207549 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof; Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body the insulating body being sapphire, e.g. silicon on sapphire structure, i.e. SOS
Semiconductor device and manufacturing method thereof
#2Semiconductor device and manufacturing method thereof
#3DC-coupled high-voltage level shifter
#4DC-coupled high-voltage level shifter
#5Composite substrate and method of manufacturing composite substrate
#6Compound lateral resistor structures for integrated circuitry
#7Nanosheet transistors having different gate dielectric thicknesses on the same chip
#8Nanosheet transistors having different gate dielectric thicknesses on the same chip
#9Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management
#10Double balanced mixer
#11Double balanced mixer
#12Handle substrate of composite substrate for semiconductor, and composite substrate for semiconductor
#13Silicon-on-sapphire device with minimal thermal strain preload and enhanced stability at high temperature
#14Methods for reducing metal contamination on a surface of a sapphire substrate by plasma treatment
#15Composite substrate with a high-performance semiconductor layer and method of manufacturing the same
#16Method for producing SOS substrates, and SOS substrate
#17Composite substrate and method for manufacturing same
#18SOS substrate with reduced stress
#19Silicon Chip Having Penetrative Connection Holes
#20Manufacturing method of semiconductor device, semiconductor device, and method of printing on semiconductor wafer
#21Memory having a vertical access device
#22MOS capacitor structures
#23Fabrication method for device structure having transparent dielectric substrate
#24NITRIDE SEMICONDUCTOR DEVICE, NITRIDE SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE
#25Method for forming a nitride semiconductor laminated structure and method for manufacturing a nitride semiconductor element
#26Method for manufacturing silicon on sapphire wafer
#27ED inverter circuit and integrate circuit element including the same
#28IC Substrate and Method of Manufacture of IC Substrate
#29Methods for forming MOS capacitors
#30Integrated circuit and method of manufacturing an integrated circuit
#31Radiation-hardened silicon-on-insulator CMOS device, and method of making the same
#32Memory having a vertical access device
#33Enhanced mobility MOSFET devices
#34Semiconductor Device and Method for Manufacturing the Same
#35WIRING MATERIAL AND WIRING BOARD USING THE SAME
#36Semiconductor wafer and manufacturing method thereof
#37SEMICONDUCTOR DEVICE AND METHOD FOR REGIONAL STRESS CONTROL
#38SEMICONDUCTOR DEVICE
#39Horizontal memory devices with vertical gates
#40SEMICONDUCTOR DEVICE
#41Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
#42Semiconductor device and method for regional stress control
#43Electronic and optical devices and methods of forming these devices
#44Silicon on sapphire wafer
#45Dielectric substrate with reflecting films
#46Method of dicing a semiconductor device into plural chips
#47Semiconductor device and manufacturing method thereof
#48Method for manufacturing semiconductor device
#49Anchoring, by lateral oxidizing, of patterns of a thin film to prevent the dewetting phenomenon
#50SOI device having increased reliability and reduced free floating body effects
#51Thin-film capacitor device, mounting module for the same, and method for fabricating the same
#52Semiconductor wafer and manufacturing method thereof
#53Receiver electronics proximate antenna
#54Semiconductor device and method of manufacturing same
#55High temperature environment tool system and method
#56Wiring material and wiring board using the same
#57High temperature electronic devices
#58High temperature memory device
#59Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
#60System for integrating a circuit on an isolation layer and method thereof
#61Semiconductor device and method of manufacturing the same
#62Horizontal memory devices with vertical gates
#63Horizontal memory devices with vertical gates
#64Semiconductor device and method of manufacturing the same
#65Radiation-hardened silicon-on-insulator CMOS device, and method of making the same
#66Nanosheet transistors having different gate dielectric thicknesses on the same chip
#67Method of forming a stacked low temperature transistor and related devices
#68Method of forming a stacked low temperature transistor and related devices