209313 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of conductors; Barrier, adhesion or liner layers Multiple stacked thin films not being formed in openings in dielectrics
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#2Nanowire-based interconnects for sub-millimeter wave integrated circuit applications
#3INTEGRATED ELECTRONIC DEVICE WITH A PAD STRUCTURE INCLUDING A BARRIER STRUCTURE AND RELATED MANUFACTURING PROCESS
#4Wiring board and method of manufacturing the same
#5Semiconductor device and its manufacturing method
#6Interconnection structure
#7Semiconductor device and its manufacturing method
#8Aluminum interconnection apparatus
#9Electrical interconnection structure and fabrication method thereof
#10Semiconductor device and method for making same
#11Semiconductor device and method for making same
#12Aluminum interconnection apparatus
#13Aluminum interconnection apparatus
#14Semiconductor device and manufacturing method thereof
#15Semiconductor device and manufacturing method thereof
#16Semiconductor structure and method for making same
#17Via-less thin film resistor with a dielectric cap
#18Multi-layer via-less thin film resistor
#19Lateral connection for a via-less thin film resistor
#20Electromigration resistant aluminum-based metal interconnect structure
#21Semiconductor device having metal wirings of laminated structure
#22METHOD AND SYSTEM FOR MAKING THIN METAL FILMS
#23Semiconductor device and manufacturing method thereof
#24Electromigration resistant aluminum-based metal interconnect structure
#25Semiconductor device and method for producing the same
#26Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
#27Semiconductor device and method for making same
#28BARRIER METAL FILM PRODUCTION APPARATUS, BARRIER METAL FILM PRODUCTION METHOD, METAL FILM PRODUCTION METHOD, AND METAL FILM PRODUCTION APPARATUS
#29Wiring, display device and method of manufacturing the same
#30TUNGSTEN LINER FOR ALUMINUM-BASED ELECTROMIGRATION RESISTANT INTERCONNECT STRUCTURE
#31Interconnection structure having oxygen trap pattern in semiconductor device
#32Method of manufacturing semiconductor device
#33Electrically Conductive Line
#34Method and system for making thin metal films
#35Semiconductor device having metal wirings of laminated structure
#36Semiconductor device and manufacturing method thereof
#37SEMICONDUCTOR DEVICE INCLUDING COPPER INTERCONNECT AND METHOD FOR MANUFACTURING THE SAME
#38SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#39Formation of Titanium Nitride Film
#40Semiconductor Device and Fabrication Method Thereof
#41Semiconductor device and method for producing the same
#42Nitrogen rich barrier layers and methods of fabrication thereof
#43Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
#44Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
#45Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
#46Semiconductor device having improved metal wiring
#47Deposition method for wiring thin film
#48Manufacturing method of semiconductor device
#49Methods of forming materials comprising tungsten and nitrogen, and methods of forming capacitors
#50Integrated electronic component
#51Method for depositing metallic nitride series thin film
#52Electrically conductive line, method of forming an electrically conductive line, and method of reducing titanium silicide agglomeration in fabrication of titanium silicide over polysilicon transistor gate lines
#53Nitrogen rich barrier layers and methods of fabrication thereof
#54Method for producing semiconductor devices that includes forming a copper film in contact with a ruthenium film
#55Semiconductor device having a capping layer including cobalt and method of fabricating the same
#56Multilayered barrier metal thin-films
#57Thin-film formation in semiconductor device fabrication process and film deposition apparatus
#58Method and system for making thin metal films
#59Barrier metal film production apparatus, barrier metal film production method, metal film production method, and metal film production apparatus
#60Atomic layer deposition metallic contacts, gates and diffusion barriers
#61Nitride and polysilicon interface with titanium layer
#62Compressive alpha-tantalum thin film stack
#63Semiconductor device and its manufacture method
#64Ionized physical vapor deposition (iPVD) process
#65Method for fabricating metallic interconnects on electronic components
#66Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance
#67Process for producing metallic interconnects and contact surfaces on electronic components
#68Method of forming a semiconductor device having a Ti/TiN/Ti<002>/a1<111> laminate
#69Methods of providing ohmic contact
#70Method for forming compressive alpha-tantalum on substrates and devices including the same
#71Word lines for memory cells
#72Multilevel copper interconnect with double passivation
#73Method for depositing metallic nitride series thin film
#74Semiconductor device having a capping layer including cobalt and method of fabricating the same
#75Atomic layer deposition of metallic contacts, gates and diffusion barriers
#76Semiconductor memory device having low-resistance tungsten line and method of manufacturing the semiconductor memory device
#77Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices
#78Method of modifying source chemicals in an ALD process