209312 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of conductors Barrier, adhesion or liner layers
Sub-classes:METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE OF 3D ELECTRONIC ASSEMBLY AND ASSOCIATED 3D ELECTRONIC ASSEMBLY
#2Metal Contact Structure and Method of Forming the Same in a Semiconductor Device
#3Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF FORMING THE SAME
#4Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of Forming The Same
#5METHODS FOR RELIABLY FORMING MICROELECTRONIC DEVICES WITH CONDUCTIVE CONTACTS TO SILICIDE REGIONS, AND RELATED SYSTEMS
#6Pressurizing members for semiconductor package
#7Semiconductor structure and method for fabricating the same
#8Microelectronic devices with conductive contacts to silicide regions, and related devices
#9Flexible and stretchable interconnects for flexible systems
#10Metal contact structure and method of forming the same in a semiconductor device
#11Treatment to interface between metal film and BARC or photoresist
#12Method and apparatus for forming silicon oxide film on tungsten film
#13Package structure