209314 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by; Applying interconnections to be used for carrying current between separate components within a device; Formation and after-treatment of conductors; Barrier, adhesion or liner layers Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
Sub-classes:Methods And Systems Of Forming Metal Interconnect Layers Using Engineered Templates
#2Integrated circuit devices and methods of manufacturing the same
#3Methods and systems of forming metal interconnect layers using engineered templates
#4Integrated circuit devices and methods of manufacturing the same
#5Methods and systems of forming metal interconnect layers using engineered templates
#6Method for forming components without adding tabs during etching
#7Semiconductor device including physical unclonable function
#8Integrated circuit devices and methods of manufacturing the same
#9METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM
#10Barrier structure for copper interconnect
#11Method forming through-via using electroless plating solution
#12Pillar bumps and process for making same
#13Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via
#14Systems, methods and materials including crystallization of substrates via sub-melt laser anneal, as well as products produced by such processes
#15Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via
#16Pillar bumps and process for making same
#17Systems, methods and materials including crystallization of substrates via sub-melt laser anneal, as well as products produced by such processes