209346 ⎘
Details relating to semiconductor or other solid state devices covered by the group; Marks applied to semiconductor devices or parts containing identification or tracking information
Sub-classes:SEMICONDUCTOR PACKAGE COMPONENT AND METHOD OF MAKING THE SAME
#2GLASS SUBSTRATE FOR SEMICONDUCTORS
#3IDENTIFICATION MARKING CAVITY FILLING FOR SEMICONDUCTOR PACKAGES
#4SEMICONDUCTOR PACKAGE
#5INTERCONNECT SUBSTRATE AND METHOD OF MAKING
#6INTEGRATED CIRCUIT STRUCTURES HAVING A WATERMARK
#7DUAL-SIGNATURE STRUCTURE TO VERIFY AUTHENTICITY IN MICROELECTRONICS
#8INTEGRATED CIRCUIT RESISTIVE STRUCTURE VALIDATION FOR AUTHENTICATION
#9SEMICONDUCTOR DEVICE
#10SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE AND A LASER MARK
#11METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PRODUCT HISTORY MANAGEMENT METHOD FOR SEMICONDUCTOR DEVICE
#12METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PRODUCT HISTORY MANAGEMENT METHOD FOR SEMICONDUCTOR DEVICE
#13SIDE WETTABLE SEMICONDUCTOR PACKAGE WITH PROBE MARKS
#14Semiconductor Package Using A Coreless Signal Distribution Structure
#15SYSTEM FOR DYNAMICALLY PROVISIONING CYBER TRAINING ENVIRONMENTS
#16APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL DIES ACROSS DIE STACKS
#17PACKAGE STRUCTURE INCLUDING A PACKAGE SUBSTRATE AND METHODS OF FORMING THE SAME
#18PACKAGED SEMICONDUCTOR CHIPS HAVING PROTECTED IDENTIFICATION MARKS THEREIN
#19SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#20Method for Ensuring the Integrity of Semiconductor Devices From Wafer Fabrication Through Packaging
#21PHOTOVOLTAIC CELL, METHOD FOR FORMING SAME, AND PHOTOVOLTAIC MODULE
#22THREE-DIMENSIONAL SELF-REFERENCE MARKING FEATURES
#23METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
#24ENCLOSURE
#25ADVANCED PROCESS IN PROCESS PAIR WITHOUT FUSES
#26SOLDERABLE AND WIRE BONDABLE PART MARKING
#27IDENTIFICATION INFORMATION ACQUISITION METHOD, PATTERN FORMING METHOD, SEMICONDUCTOR MANUFACTURING FACILITY OPERATION METHOD, PROCESSING APPARATUS, AND PATTERN FORMING APPARATUS
#28SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#29DISPLAY DEVICE
#30Semiconductor package using a coreless signal distribution structure
#31METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HAVING THE MARK
#32INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
#33SEMICONDUCTOR PACKAGE
#34WAFER-SCALE CHIP STRUCTURE AND METHOD AND SYSTEM FOR DESIGNING THE STRUCTURE
#35SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURINGTHE SEMICONDUCTOR PACKAGE
#36CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE MODULE THEREOF
#37CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF
#38INTERCONNECT SUBSTRATE, METHOD OF MAKING THE SAME, AND METHOD OF IDENTIFYING INTERCONNECT SUBSTRATE
#39Electronic apparatus and method of manufacturing the same
#40METHOD FOR PRODUCING AN ELECTRONIC COMPONENT ASSEMBLY ON THE FRONT FACE OF A SEMI-CONDUCTOR WAFER
#41SECURE CHIPS WITH SERIAL NUMBERS
#42SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
#43SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
#44System for dynamically provisioning cyber training environments
#45SEMICONDUCTOR DEVICE STRUCTURE WITH OVERLAY MARK
#46Photovoltaic cell, method for forming same, and photovoltaic module
#47CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#48MULTIPLE TARGETS ON SUBSTRATE LAYERS FOR LAYER ALIGNMENT
#49MODULE
#50MICROCHIP CHARGE PATTERNING
#51SEMICONDUCTOR DEVICE
#52SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#53SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION
#54SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING
#55Semiconductor package using a coreless signal distribution structure
#56Semiconductor packages
#57Aligner apparatus
#58Semiconductor device and manufacturing method thereof
#59Solderable and wire bondable part marking
#60Integrated circuit structure with fluorescent material, and related methods
#61Method of printing laser mark and method of producing laser-marked silicon wafer
#62Semiconductor device and method for manufacturing the same
#63Semiconductor chip, processed wafer, and method for manufacturing semiconductor chip
#64Secure inspection and marking of semiconductor wafers for trusted manufacturing thereof
#65Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
#66Array substrate comprising a binding region having a binding zone and a vacancy zone alternately disposed and display apparatus thereof
#67Package module comprising shield film on semiconductor device and method of manufacturing the same
#68IC PACKAGE
#69Method of producing laser-marked silicon wafer and laser-marked silicon wafer
#70Method, apparatus, and system for forming code
#71Electronic semiconductor component and method for producing an electronic semiconductor component
#72Display panel and display device
#73Semiconductor package using a coreless signal distribution structure
#74Integrated circuit product customizations for identification code visibility
#75Secure inspection and marking of semiconductor wafers for trusted manufacturing thereof
#76Pattern-to-design alignment for one-dimensional unique structures
#77Display device having information code on a lateral side of display panel
#78Electronic apparatus and method of manufacturing the same
#79Semiconductor packages with indications of die-specific information
#80Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
#81Pad design for reliability enhancement in packages
#82LAYER FOR ETCHED IDENTIFICATION MARKS ON A PACKAGE
#83WAFER ALIGNER
#84Mark pattern in semiconductor device
#85Embedded chip identification formed by directed self-assembly
#86Advanced wafer security method including pattern and wafer verifications
#87Secure chips with serial numbers
#88METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES AND PACKAGES FORMED THEREBY
#89Package comprising identifier on and/or in carrier
#90METHOD FOR DIE-LEVEL UNIQUE AUTHENTICATION AND SERIALIZATION OF SEMICONDUCTOR DEVICES
#91Method of manufacturing semiconductor device
#92Semiconductor device, and method for manufacturing semiconductor device
#93Direct transfer of semiconductor devices from a substrate
#94Apparatus for direct transfer of semiconductor device die
#95Code pattern for representing tracing number of chip
#96Semiconductor package authentication feature
#97Method for transfer of semiconductor devices onto glass substrates
#98Thinned semiconductor wafer
#99Indicia for light emitting diode chips
#100Semiconductor module
#101Systems for direct transfer of semiconductor device die
#102High-frequency module
#103Integrated circuit security
#104Semiconductor package
#105IC PACKAGE
#106Semiconductor package
#107Semiconductor package having mark with identification information
#108Semiconductor package
#109Secure chips with serial numbers
#110Alignment mark design for packages
#111Method of manufacturing semiconductor device
#112Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#113Methods for selectively forming identification mark on semiconductor wafer
#114Optical chip ID definition using nanoimprint lithography
#115Positional relationship among components of semiconductor device
#116Substrate structure and manufacturing process
#117Legal chip identification method and system
#118Defect-tolerant layout and packaging for GaN power devices
#119Apparatus for direct transfer of semiconductor device die
#120Elastic wave device
#121Manufacturing method of semiconductor device and semiconductor device
#122Display device
#123Optical chip ID definition using nanoimprint lithography
#124Semiconductor package manufacturing method
#125Photoelectric conversion element
#126Apparatus for lithographically forming wafer identification marks and alignment marks
#127Methods of making semiconductor devices
#128Method for improved transfer of semiconductor die
#129LASER COLOR MARKING METHOD FOR A SEMICONDUCTOR PACKAGE
#130IC wafer for identification of circuit dies after dicing
#131Method of manufacturing semiconductor device
#132Semiconductor package and a method of manufacturing the same
#133Chip scale package semiconductor device and method of manufacture
#134Electronic element with embedded information
#135Integrated circuit security
#136Array substrate, chip on film, and alignment method
#137METHOD AND APPARATUS FOR LIGHT DIFFUSION
#138Display device
#139Display device including identification number pattern
#140Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#141Method of manufacturing semiconductor package
#142Semiconductor device sorting system and semiconductor device
#143Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
#144Method of dampening a force applied to an electrically-actuatable element
#145Semiconductor device
#146Support substrates, methods of fabricating semiconductor packages using the same, and methods of fabricating electronic devices using the same
#147Die identification by optically reading selectively blowable fuse elements
#148Compact laser device
#149Silicon wafer forming method
#150Integrated circuit security
#151WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS
#152SEMICONDUCTOR CHIP MODULE AND METHOD FOR ENHANCING VISUAL EFFECTS OF A PATTERN LAYER
#153Mini identification mark in die-less region of semiconductor wafer
#154Thinned semiconductor wafer
#155Methods of reducing wafer thickness
#156Method for lithographically forming wafer identification marks and alignment marks
#157CHIP IDENTIFICATION SYSTEM
#158Heart transfer label structure
#159Method of manufacturing semiconductor device
#160Integrated circuit substrate and method for manufacturing the same
#161Positional relationship among components of semiconductor device
#162Substrate with Array of LEDs for Backlighting a Display Device
#163Fuse of semiconductor device and method for forming the same
#164Microchip charge patterning
#165Apparatus for direct transfer of semiconductor device die
#166Methods for inspection sampling on full patterned wafer using multiple scanning electron beam column array
#167Semiconductor package including titanium oxide layer and method for manufacturing the same
#168Manufacturing method of semiconductor device and semiconductor device
#169CHIP IDENTIFICATION SYSTEM
#170Support substrate for transfer of semiconductor devices
#171Method and apparatus for direct transfer of semiconductor device die from a mapped wafer
#172Apparatus for direct transfer of semiconductor devices with needle retraction support
#173Method and apparatus for improved direct transfer of semiconductor die
#174Method of arranging a plurality of semiconductor structural elements on a carrier and carrier comprising a plurality of semiconductor structural elements
#175Substrate with array of LEDs for backlighting a display device
#176Molding compound including a carbon nano-tube dispersion
#177Semiconductor package and method of fabricating the same
#178Vertical memory devices and methods of manufacturing the same
#179Flexible support substrate for transfer of semiconductor devices
#180Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#181Semiconductor package and method of fabricating the same
#182Substrate handling and identification mechanism
#183Alignment pattern for package singulation
#184Pad design for reliability enhancement in packages
#185Device wafer processing method
#186Thermal management and/or EMI mitigation materials with custom colored exterior surfaces
#187Protective film for semiconductors, semiconductor device, and composite sheet
#188Visual identification of semiconductor dies
#189Semiconductor device
#190Method and apparatus for detecting and removing defective integrated circuit packages
#191Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#192Arrangement for spatially limiting a reservoir for a marker material
#193Electronic circuit module
#194Secure chips with serial numbers
#195METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFER
#196Secure chips with serial numbers
#197Apparatus for multi-direct transfer of semiconductors
#198Methods of manufacturing multi-die semiconductor device packages and related assemblies
#199Semiconductor devices comprising protected side surfaces and related methods
#200Semiconductor wafer and method of reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark
#201Counter counterfeit technology
#202Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#203Electronic Circuit and Substrate with Identification Pattern for Separate Electronic Circuits and Method for Producing Thereof
#204METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#205Integrated circuit (IC) chip comprising an identification circuit
#206Semiconductor device on string circuit and method of making the same
#207Semiconductor package using a coreless signal distribution structure
#208Methods for forming a semiconductor device and semiconductor devices
#209Semiconductor device and method of manufacture
#210Alignment mark design for packages
#211Vertical memory devices and methods of manufacturing the same
#212Method and apparatus for light diffusion
#213Substrate and multiple substrate, and method for producing thereof
#214Semiconductor device on glass substrate
#215Method and apparatus for transfer of semiconductor devices
#216Alignment mark design for packages
#217Visual identification of semiconductor dies
#218METHOD FOR MANUFACTURING THIN SiC WAFER AND THIN SiC WAFER
#219Electronic chip inspection by backside illumination
#220Semiconductor device, and semiconductor chip having chip identification information
#221SEMICONDUCTOR DEVICE
#222Wafer marking method
#223Method for semiconductor wafer alignment
#224Method of marking a semiconductor package
#225Reduction of defects in wafer level chip scale package (WLCSP) devices
#226Wafer processing system and wafer processing method using same
#227Multichip debugging method and multichip system adopting the same
#228Marking method for wafer dice
#229METHOD FOR EXTRACTING NON-PERIODICAL PATTERNS MASKED BY PERIODICAL PATTERNS, AND DEVICE IMPLEMENTING THE METHOD
#230Semiconductor chip package comprising side wall marking
#231Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other
#232Apparatus and method for direct transfer of semiconductor devices
#233Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product
#234Metal pad for laser marking
#235Lithography engraving machine for forming water identification marks and aligment marks
#236Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor device
#237Display apparatus capable of easily acquiring identification about a display panel and a driving chip
#238Automated module for assembly lines and method to actuate and control thereof
#239Laser marking in packages
#240Semiconductor storage device and manufacturing method thereof
#241Semiconductor device including electromagnetic interference (EMI) shielding layer and method for manufacturing the semiconductor device
#242SEMICONDUCTOR DEVICE
#243Substrate with array of LEDs for backlighting a display device
#244Semiconductor packages having EMI shielding parts and methods of fabricating the same
#245Semiconductor device manufacturing method
#246Methods of manufacturing multi-die semiconductor device packages and related assemblies
#247Thermosetting adhesive sheet and semiconductor device manufacturing method
#248Film for semiconductor back surface and its use
#249Semiconductor package and method of fabricating the same
#250SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#251Integrated circuit substrate and method for manufacturing the same
#252Identification circuit and IC chip comprising the same
#253Aggregation of semiconductor devices and the method thereof
#254Semiconductor package and mobile device using the same
#255Chip part and method of making the same
#256Apparatus for transfer of semiconductor devices
#257Method for transfer of semiconductor devices
#258Reduction of defects in wafer level chip scale package (WLCSP) devices
#259Semiconductor device and method for manufacturing the same
#260Production method for semiconductor element, and semiconductor element
#261Compact laser device
#262Method of manufacturing semiconductor device
#263Method of manufacturing semiconductor device and semiconductor device
#264Semiconductor package using a coreless signal distribution structure
#265Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
#266Method for forming identification marks on refractory material single crystal substrate, and refractory material single crystal substrate
#267Discrete component backward traceability and semiconductor device forward traceability
#268Method of marking a semiconductor package
#269Screening of electronic components for detection of counterfeit articles using automated inspection system
#270Wafer processing method
#271Semiconductor device and manufacturing method thereof
#272Wafer aligner
#273Semiconductor device and method of fabricating 3D package with short cycle time and high yield
#274Packaged semiconductor devices and packaging methods thereof
#275Using interrupted through-silicon-vias in integrated circuits adapted for stacking
#276Semiconductor device having markings and package on package including the same
#277Thin-film transistor substrate, display apparatus, method of manufacturing thin-film transistor substrate, and method of manufacturing display apparatus
#278METHODS FOR FORMING COLOR IMAGES ON MEMORY DEVICES AND MEMORY DEVICES FORMED THEREBY
#279TRACEABLE INTEGRATED CIRCUITS AND PRODUCTION METHOD THEREOF
#280Front side package-level serialization for packages comprising unique identifiers
#281Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device
#282Composite sheet for forming protective film
#283Production method of display substrate, production control system and production apparatus
#284Semiconductor devices comprising protected side surfaces and related methods
#285Semiconductor device and method for manufacturing same
#286SEMICONDUCTOR PACKAGE INCLUDING MARKING LAYER
#287Advanced structure for info wafer warpage reduction
#288Circuit probing structures and methods for probing the same
#289Electronic device and method for producing an electronic device
#290Method of manufacturing three-dimensional semiconductor chip
#291Pad design for reliability enhancement in packages
#292Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device
#293Extremely thin package
#294Method for semiconductor wafer alignment
#295Metal pad for laser marking
#296Alignment mark design for packages
#297Semiconductor devices and methods of making the same
#298Electronic device and method for producing an electronic device
#299OPTICAL ELEMENT WITH INTEGRATED INDICATOR
#300Sensor for outputting an electric signal on the basis of a detected physical variable