209356 ⎘
Details relating to semiconductor or other solid state devices covered by the group Structural electrical arrangements for semiconductor devices not otherwise provided for
Sub-classes:ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#2ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#3ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#4ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#5ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATED CIRCUITS
#6Methods and heat distribution devices for thermal management of chip assemblies
#7Methods and heat distribution devices for thermal management of chip assemblies
#8THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
#9SEMICONDUCTOR PACKAGES INCLUDING DIFFERENT TYPE SEMICONDUCTOR CHIPS HAVING EXPOSED TOP SURFACES AND METHODS OF MANUFACTURING THE SEMICONDUCTOR PACKAGES
#10Methods and heat distribution devices for thermal management of chip assemblies
#11Methods and heat distribution devices for thermal management of chip assemblies
#12Secure semiconductor chip by piezoelectricity
#13Secure semiconductor chip by piezoelectricity
#14Semiconductor devices with back-side coils for wireless signal and power coupling
#15Power semiconductor modules with protective coating
#16Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
#17Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
#18Light emitting device, light emitting device package comprising light emitting device, and light emitting apparatus comprising light emitting device package
#19Carbon-coated thermal conductive material
#20Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
#21Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications
#22Integrated circuit device having defined gate spacing and method of designing and fabricating thereof
#23Method of fabricating a semiconductor device having a defined minimum gate spacing between adjacent gate structures
#24Wiring board and method of manufacturing a semiconductor device