Stacked chip package structure with leadframe having bus bar

Stacked chip package structure with leadframe having bus bar

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD

Ball-limiting-metallurgy layers in solder ball structures

Relay board and semiconductor device having the relay board

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor packages and electronic systems including the same

Multi-chip packages including extra memory chips to define additional logical packages and related devices

IO cell with multiple IO ports and related techniques for layout area saving

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor device having finger electrodes

Semiconductor device

Manufacturing method of semiconductor device

MIM decoupling capacitors under a contact pad

SEMICONDUCTOR DEVICE

Method for fabricating semiconductor packages with discrete components

Semiconductor device and a method of manufacturing the same

Layered chip package with wiring on the side surfaces

Method of making semiconductor device packaged by sealing resin member

Electronic device package and method for fabricating the same

Through-silicon via with low-K dielectric liner

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

Semiconductor device with output circuit arrangement

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Chip-Stacked Package Structure

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR DESIGNING THE SAME

Semiconductor device and fabrication method for the same

Semiconductor device

NANOTUBE ESD PROTECTIVE DEVICES AND CORRESPONDING NONVOLATILE AND VOLATILE NANOTUBE SWITCHES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

Methods for forming an RF device with trench under bond pad feature

Semiconductor package with semiconductor core structure and method of forming same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

3-D circuits with integrated passive devices

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

Double solid metal pad with reduced area

Semiconductor integrated circuit devices and display apparatus including the same

Semiconductor package having adhesive layer and method of manufacturing the same

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Bond pad array for complex IC

SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Electronic circuit for controlling a power field effect transistor

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

Packaging systems and methods

Backside connection to TSVs having redistribution lines

Multi-chip package

Integrated circuit device

Adhesive tape, connected structure and semiconductor package

Semiconductor device having a suspended isolating interconnect

SEMICONDUCTOR DIE SUPPORT IN AN OFFSET DIE STACK

Assembling of Electronic Members on IC Chip

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

Method and apparatus for improvements in chip manufacture and design

STACKED DIE PACKAGE HAVING REDUCED HEIGHT AND METHOD OF MAKING SAME

Semiconductor device including a transformer on chip

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

FINE PITCH BOND PAD STRUCTURE

Semiconductor embedded module and method for producing the same

Semiconductor package and method for packaging a semiconductor package

Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar

Semiconductor device

Method of fabricating stacked wire bonded semiconductor package with low profile bond line

Stacked wire bonded semiconductor package with low profile bond line

Method and apparatus of power ring positioning to minimize crosstalk

Semiconductor integrated circuit including plurality of bonding pads

Semiconductor device

Circuitry component and method for forming the same

Semiconductor chip package and multichip package

System and Method for Thermal Optimized Chip Stacking

Semiconductor arrangement having specially fashioned bond wires

Bond pad structure located over active circuit structure

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Electronic device package and fabrication method thereof

Method of manufacturing a semiconductor structure

CONDUCTIVE STRUCTURE OF A CHIP

High density memory device manufacturing using isolated step pads

Interposer chip and multi-chip package having the interposer chip

Semiconductor device fabrication method

COMPACT PACKAGING FOR POWER AMPLIFIER MODULE

Final via structures for bond pad-solder ball interconnections

Multi-chip stack package

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

CONTACT STRUCTURE AND CONNECTING STRUCTURE

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Semiconductor package and multi-chip package using the same

Piezoelectric device and electronic apparatus

Semiconductor device

Method of manufacturing a semiconductor device

Wafer-level integrated circuit package with top and bottom side electrical connections

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Storage medium and semiconductor package

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and a method of manufacturing the same

Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

Stack die packages

Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

Wirebond over post passivation thick metal

Integrated circuit having wide power lines

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Semiconductor package apparatus having redistribution layer

SEMICONDUCTOR DEVICE PACKAGE

High power integrated RF amplifier

Semiconductor device

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Semiconductor device

Semiconductor element, semiconductor device, and fabrication method thereof

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

Semiconductor package having redistribution layer

Controller chip mounted on a memory chip with re-wiring lines

Manufacturing method of contact structure

Semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Semiconductor device

System and Method for Improving Reliability of Integrated Circuit Packages

Semiconductor device with less power supply noise

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

SEMICONDUCTOR APPARATUS

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Semiconductor module

Undercut-free BLM process for Pb-free and Pb-reduced C4

Chip structure and stacked structure of chips

Method for micro component self-assembly

Mounting structure of electronic component

Electronic component

Thin semiconductor device package

Device including a semiconductor chip having a plurality of electrodes

Chip structure

SEMICONDUCTOR DEVICE

Semiconductor chip with coil element over passivation layer

Power Integrated Circuit with Bond-Wire Current Sense

Electronic device

Semiconductor device

Thermally enhanced wafer level package

MULTI-BAND TUNABLE RESONANT CIRCUIT

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Interposer for connecting plurality of chips and method for manufacturing the same

Semiconductor apparatus

Flip chip for electrical function test and manufacturing method thereof

Wire bond pads

Method and structure for increased wire bond density in packages for semiconductor chips

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

Semiconductor device

SEMICONDUCTOR DEVICE

System and method for providing semiconductor device features using a protective layer

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE

Rearrangement sheet, semiconductor device and method of manufacturing thereof

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Electronic assembly having a multilayer adhesive structure

Semiconductor device and method of manufacturing the same

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Manufacturing process and structure of through silicon via

Die-wafer package and method of fabricating same

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Method for fabricating semiconductor package free of substrate

Method of fabricating a semiconductor die having a redistribution layer

Semiconductor die having a distribution layer

Semiconductor device

ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor device, chip package and method of fabricating the same

BONDING PAD STRUCTURE

Device configuration and method to manufacture trench MOSFET with solderable front metal

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor package having die with recess and discrete component embedded within the recess

Semiconductor device and method for manufacturing semiconductor device

Semiconductor Device

Chip-stacked package structure

Semiconductor device

TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Method of creating contour structures to highlight inspection region

Wafer-level-chip-scale package and method of fabrication

Method of assembling chips

Semiconductor device and method of manufacturing the same

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of wire bonding over active area of a semiconductor circuit

Wafer-level stack package and method of fabricating the same

Semiconductor device with Al pad

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

Method of joining chips utilizing copper pillar

Chip structure with bumps and testing pads

Semiconductor device having stacked dice disposed on base substrate

Semiconductor module having deflecting conductive layer over a spacer structure

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Method of assembling chips

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Semiconductor integrated circuit device and fabrication method for the same

Integrated circuit with re-route layer and stacked die assembly

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device with magnetic powder mixed therein and manufacturing method thereof

INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME

BOND PAD FOR SEMICONDUCTOR DEVICE

Semiconductor device having a high frequency electrode positioned with a via hole

Zigzag-stacked package structure

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME

Method of making a semiconductor device having multiple die redistribution layer

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Semiconductor device having multiple die redistribution layer

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Method for fabricating a circuit component

Semiconductor apparatus having a large-size bus connection

Method for manufacturing semiconductor device and semiconductor device

Stacked die package

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

Semiconductor die with reduced bump-to-pad ratio

Self-aligned through vias for chip stacking

Semiconductor integrated circuit and multi-chip module

Method for fabricating semiconductor package free of substrate

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Semiconductor device and a method of manufacturing the same

Method and apparatus of power ring positioning to minimize crosstalk

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor device and a method of manufacturing the same

Stacked chip packaging with heat sink structure

MULTI-GROUND SHIELDING SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PACKAGE, AND METHOD OF PREVENTING NOISE USING MULTI-GROUND SHIELDING

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor device with bonding pad support structure

Stacked semiconductor package having fan-out structure through wire bonding

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Bonding and probing pad structures

Elimination of RDL using tape base flip chip on flex for die stacking

Integrated circuit package system with stacked die

Bonding pad for contacting a device

Stacked chip package structure with leadframe having bus bar

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Semiconductor device, relay chip, and method for producing relay chip

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Chip package and method for fabricating the same

Semiconductor device

Semiconductor device having pads

Method of wire bonding over active area of a semiconductor circuit

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Semiconductor chip structure

Structure for bumped wafer test

Solder elements with columnar structures and methods of making the same

Interconnection structure of integrated circuit chip

Package structure with leadframe on offset chip-stacked structure

Chip scale package for power devices and method for making the same

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device with interface peeling preventing rewiring layer

Contact structure having a compliant bump and a test pad

Chip having two groups of chip contacts

Chip structure with redistribution traces

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

Stack die packages

Integrated circuit (IC) chip and method for fabricating the same

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

Method for applying solder to redistribution lines

Die package and probe card structures and fabrication methods

Microelectronic assembly with back side metallization and method for forming the same

Semiconductor integrated circuit device, and method of designing and manufacturing the same

Assembly and method of assembling by soldering an object and a support

Semiconductor integrated circuit device

Contact surrounded by passivation and polymide and method therefor

Method of wire bonding over active area of a semiconductor circuit

Integrated circuit having pads and input/output (I/O) cells

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Method of fabricating microelectronic devices

Integrated circuit device with semiconductor device components embedded in plastic housing composition

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown