209403 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto Redistribution layers [RDL] for bonding areas
Method for fabricating semiconductor package free of substrate
#602Semiconductor device and method of manufacturing the semiconductor device
#603Semiconductor device and method of manufacturing the same
#604Thin semiconductor device package
#605Chip with power and signal pads connected to power and signal lines on substrate
#606Integrated-circuit chip with offset external pads and method for fabricating such a chip
#607Semiconductor integrated circuit device
#608Method and structure for improving bonding reliability in bond pads
#609Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#610MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#611Method for manufacturing semiconductor device
#612Redistribution connecting structure of solder balls
#613CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE
#614Cap layer for an aluminum copper bond pad
#615Power composite integrated semiconductor device and manufacturing method thereof
#616Semiconductor device
#617System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices
#618Method of producing a semiconductor device by forming an oxide film on a resin layer
#619Wafer level chip scale package (WLCSP) with high reliability against thermal stress
#620Method for forming a redistribution layer in a wafer structure
#621Semiconductor device and manufacturing method of them
#622Semiconductor device with surface-mountable external contacts and method for manufacturing the same
#623Semiconductor device having flange structure
#624Electronic component and method for its assembly
#625Method of wire bonding over active area of a semiconductor circuit
#626Method of wire bonding over active area of a semiconductor circuit
#627Power configuration method for structured ASICs
#628Integrated circuit having second substrate to facilitate core power and ground distribution
#629Method of wire bonding over active area of a semiconductor circuit
#630Carbon nanotube circuit component structure
#631METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#632Pad layout
#633Electronic device and method of manufacturing the same
#634Method for fabricating a chip scale package using wafer level processing
#635System to wirebond power signals to flip-chip core
#636Microelectronic elements with compliant terminal mountings and methods for making the same
#637Wafer-level flipchip package with IC circuit isolation
#638Interconnect structure of an integrated circuit and manufacturing method thereof
#639Semiconductor device having high frequency components and manufacturing method thereof
#640Individualized low parasitic power distribution lines deposited over active integrated circuits
#641Semiconductor device
#642Low cost bonding pad and method of fabricating same
#643Integrated circuit package system with bump pad
#644Wafer redistribution structure with metallic pillar and method for fabricating the same
#645INTEGRATED CIRCUIT PACKAGE SYSTEM
#646Semiconductor device
#647Fine pitch interconnect and method of making
#648Method for making stacked integrated circuits (ICs) using prepackaged parts
#649Semiconductor device and method of manufacturing the same
#650Bond pads and methods for fabricating the same
#651Semiconductor device and a method of manufacturing the same
#652Relay board and semiconductor device having the relay board
#653Semiconductor chip and semiconductor device
#654Semiconductor device and method for manufacturing the same
#655Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#656Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#657Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#658Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#659Semiconductor memory device comprising pseudo ground pad and related method
#660Semiconductor device
#661System in package (SIP) structure
#662Semiconductor wafer level chip package and method of manufacturing the same
#663Semiconductor device having a probing region
#664Semiconductor device and semiconductor chip
#665Semiconductor device and manufacturing method thereof
#666Semiconductor assembly and packaging for high current and low inductance
#667Insulated gate semiconductor device and manufacturing method thereof
#668Solder composition for electronic devices
#669Power plane design and jumper wire bond for voltage drop minimization
#670Semiconductor device
#671ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#672Semiconductor package with ferrite shielding structure
#673Microelectronic bond pad
#674Relay board with bonding pads connected by wirings
#675Stress and force management techniques for a semiconductor die
#676Wafer-level-chip-scale package and method of fabrication
#677Micro-package, multi-stack micro-package, and manufacturing method therefor
#678Semiconductor package having dual interconnection form and manufacturing method thereof
#679Semiconductor device
#680Circuitry component and method for forming the same
#681Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#682Semiconductor integrated circuit device
#683Multi-chip device and method for producing a multi-chip device
#684Electronic board, method of manufacturing the same, and electronic device
#685Wafer and single chip having circuit rearranged structure and method for fabricating the same
#686Chip spanning connection
#687Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#688Method of making semiconductor BGA package having a segmented voltage plane
#689Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#690Redistribution layer with microstrips
#691Semiconductor BGA package having a segmented voltage plane
#692Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#693Die-wafer package and method of fabricating same
#694Semiconductor chip with coil element over passivation layer
#695Semiconductor device and manufacturing method thereof
#696Conductive bump structure for semiconductor device and fabrication method thereof
#697Post bump passivation for soft error protection
#698Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices
#699Method for fabricating a semiconductor device having a heat radiation layer
#700Methods for providing bias to a monolithic microwave integrated circuit
#701Wire bonded semiconductor device having low inductance and noise
#702System for providing a redistribution metal layer in an integrated circuit
#703Electronic devices including offset conductive bumps
#704Semiconductor package accomplishing fan-out structure through wire bonding
#705Semiconductor device
#706Reinforced bond pad for a semiconductor device
#707Stacked die package
#708Semiconductor device
#709Semiconductor device and method of manufacturing the same
#710Universal interconnect die
#711Microelectronics devices, having vias, and packaged microelectronic devices having vias
#712LOCAL MULTILAYERED METALLIZATION
#713Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
#714Semiconductor device having a plastic housing and external connections and method for producing the same
#715Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another
#716Method of manufacturing semiconductor device and semiconductor device
#717Semiconductor device
#718Semiconductor device and its writing method
#719Semiconductor device
#720Semiconductor component sealed on five sides by polymer sealing layer
#721Forming a cap above a metal layer
#722Semiconductor chip having solder bumps and dummy bumps
#723Semiconductor device and method of manufacturing the same
#724Semiconductor device and method for manufacturing semiconductor device
#725Semiconductor package using flexible film and method of manufacturing the same
#726Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#727On-chip circuit pad structure
#728Semiconductor device and fabrication method thereof
#729Bonding pad structure
#730System for implementing a configurable integrated circuit
#731Semiconductor device
#732Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
#733REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
#734Semiconductor package device and method for fabricating the same
#735Semiconductor chip with passivation layer comprising metal interconnect and contact pads
#736Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module
#737Contour structures to highlight inspection regions
#738Redistribution layer of wafer and the fabricating method thereof
#739Semiconductor electrical connection structure and method of fabricating the same
#740Reinforced bond pad for a semiconductor device
#741Top layers of metal for integrated circuits
#742Interconnection structure of integrated circuit chip
#743Semiconductor device having a switch circuit
#744Chip structure
#745Wire bond pads
#746Method for forming a redistribution layer in a wafer structure
#747Semiconductor device and wire bonding chip size package therefor
#748Manufacturing method of stack-type semiconductor device
#749Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance
#750Electronic devices at the wafer level having front side and edge protection material and systems including the devices
#751Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#752Power gridding scheme
#753Power gridding scheme
#754Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#755Methods of forming lead free solder bumps
#756Method for fabricating semiconductor package with circuit side polymer layer
#757Hermetic chip in wafer form
#758Chip structure with redistribution traces
#759Bond pad structure for copper metallization having increased reliability and method for fabricating same
#760Electrode contact structure
#761Method for manufacturing a semiconductor device
#762Semiconductor device
#763Semiconductor device
#764Method for fabricating chip structure
#765Semiconductor device mounted on and electrically connected to circuit board
#766Optimized driver layout for integrated circuits with staggered bond pads
#767Semiconductor component and system having thinned, encapsulated dice
#768Semiconductor device
#769Structure and method of forming metal buffering layer
#770Semiconductor device including amplifier and frequency converter
#771Multi-band tunable resonant circuit
#772Semiconductor device and interposer
#773Apparatus and method extending flip-chip pad structures for wirebonding on low-k dielectric silicon
#774Power composite integrated semiconductor device and manufacturing method thereof
#775Universal interconnect die
#776Semiconductor device and method of manufacturing the semiconductor device
#777Electronic device package structures
#778Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#779Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#780Flip chip semiconductor package for testing bump and method of fabricating the same
#781Semiconductor chip having pads with plural junctions for different assembly methods
#782Semiconductor chip having pads with plural junctions for different assembly methods
#783High-frequency amplification device
#784Programmable radio transceiver
#785Method for fabricating encapsulated semiconductor components
#786Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits
#787Integrated circuit with intergrated capacitor and methods for making same
#788Semiconductor BGA package having a segmented voltage plane and method of making
#789Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#790Semiconductor apparatus having a large-size bus connection
#791Programmable radio transceiver
#792Semiconductor device and manufacturing metthod thereof
#793Stress and force management techniques for a semiconductor die
#794Semiconductor device with recessed post electrode
#795Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#796Semiconductor device and manufacturing method thereof
#797Electronic component having an integrated passive electronic component and associated production method
#798Circuit component with bump formed over chip
#799Integrated circuit with re-route layer and stacked die assembly
#800Semiconductor package free of substrate and fabrication method thereof
#801Semiconductor package free of substrate and fabrication method thereof
#802Semiconductor package free of substrate and fabrication method thereof
#803Semiconductor integrated circuit device
#804Semiconductor device
#805Semiconductor package free of substrate and fabrication method thereof
#806Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#807Wafer-level package and method for production thereof
#808Semiconductor device having bonding pad above low-k dielectric film
#809Protective structures for bond wires
#810Semiconductor device including semiconductor element mounted on another semiconductor element
#811Semiconductor device and method for manufacturing the same
#812Semiconductor device and method of fabricating the same
#813Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
#814Die-wafer package and method of fabricating same
#815Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#816Method for fabricating a chip scale package using wafer level processing
#817Semiconductor device and manufacturing method of them
#818Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#819Structure and method for temporarily holding integrated circuit chips in accurate alignment
#820Semiconductor integrated circuit device
#821Semiconductor device including semiconductor elements mounted on base plate
#822Encapsulated semiconductor components and methods of fabrication
#823Semiconductor chip package and multichip package
#824High-frequency device
#825Manufacturing method of a semiconductor device
#826Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto
#827Semiconductor device with stacked chips
#828Semiconductor device and manufacturing method thereof
#829Bond pad
#830Multi-concentric pad arrangements for integrated circuit pads
#831Methods and apparatus for integrated circuit device power distribution via internal wire bonds
#832Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
#833Semiconductor device having a bond pad and method therefor
#834Bonding structure with compliant bumps
#835Bonding pad structure
#836Semiconductor chip and semiconductor device including lamination of semiconductor chips
#837Semiconductor device
#838Circuit device
#839Method for reduced input output area
#840Semiconductor chip package and method for making the same
#841Method of forming bumps
#842Method of manufacturing a semiconductor device
#843Semiconductor device manufacturing method
#844Local multilayered metallization
#845Semiconductor device and method of fabricating the same
#846Integrating chip scale packaging metallization into integrated circuit die structures
#847Semiconductor device and method of manufacturing the same
#848Semiconductor device having fuse circuit on cell region and method of fabricating the same
#849Semiconductor device
#850BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
#851Semiconductor device and method of manufacturing the same
#852Semiconductor device with staggered electrodes and increased wiring width
#853Programmed material consolidation processes for protecting intermediate conductive structures
#854Semiconductor package using flexible film and method of manufacturing the same
#855Method for producing a semiconductor device in chip format
#856Semiconductor device and semiconductor device manufacturing method
#857Multiple substrate microelectronic devices and methods of manufacture
#858Methods and devices for providing bias to a monolithic microwave integrated circuit
#859Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#860Semiconductor device with connections for bump electrodes
#861Methods for protecting intermediate conductive elements of semiconductor device assemblies
#862Chip structure
#863Semiconductor device having chip size package with improved strength
#864Semiconductor device with external terminal joined to concave portion of wiring layer
#865Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument
#866Semiconductor device
#867Semiconductor device and method for manufacturing the same
#868Semiconductor device
#869Stack package of semiconductor device
#870Compensating for memory input capacitance
#871Apparatus and methods for stackable packaging