Bond pad structure for bonding improvement

CTE compensation for wafer-level and chip-scale packages and assemblies

Fan-out semiconductor package

Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same

Electronic device

Method for a stacked and bonded semiconductor device

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

Mechanisms for forming post-passivation interconnect structure

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Fan-out chip package with dummy pattern and its fabricating method

Structure for die probing

System in package

Semiconductor device having conductive bump with improved reliability

Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad

Semiconductor assembly having anti-warping controller and vertical connecting element in stiffener

Wafer-level chip-scale package with redistribution layer

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Integrated circuit package substrate

Semiconductor device

Package with solder regions aligned to recesses

Semiconductor device and semiconductor package including the same

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Interconnect structures for fine pitch assembly of semiconductor structures and related techniques

Semiconductor chip including a plurality of pads

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Surface mount high-frequency circuit

Methods of forming multi-die package structures including redistribution layers

Method of fabricating chip package with laser

FAN-OUT PACKAGE STRUCTURE INCLUDING ANTENNA

Semiconductor device having a plurality of chips being stacked

Semiconductor structure and fabrication method thereof

3D fanout stacking

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor package structure and method of the same

Stacked integrated circuits with redistribution lines

Laminated interposers and packages with embedded trace interconnects

Low profile integrated circuit (IC) package comprising a plurality of dies

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

System, apparatus, and method for embedding a device in a faceup workpiece

Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package

Process for forming package-on-package structures

System-in-package and fabrication method thereof

Electronic device with interconnection structure oblate ellipsoid-shaped aperture

Fan-out interconnect structure and method for forming same

Method of forming redistribution layer

Chip module and method for forming the same

SEMICONDUCTOR PACKAGES

Semiconductor device

Chip package and method for forming the same

Method of multi-chip wafer level packaging

Semiconductor Package and Method of Fabrication Thereof

Semiconductor structure having a conductive bump with a plurality of bump segments

Semiconductor device and manufacturing method thereof

Chip package and manufacturing method thereof

Semiconductor structure with oval shaped conductor

Electronic component

Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same

Electrostatic discharge protection device

RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USING SAME

Semiconductor device

Method of forming post-passivation interconnect structure

Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same

Polymer layers embedded with metal pads for heat dissipation

Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof

Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers

Multi-segment monolithic LED chip

Semiconductor device with post-passivation interconnect structure and method of forming the same

Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device

Protective layer for contact pads in fan-out interconnect structure and method of forming same

Device including two power semiconductor chips and manufacturing thereof

Method for generating die identification by measuring whether circuit is established in a package structure

Methods and apparatus of packaging semiconductor devices

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

Semiconductor device with shielding layer in post-passivation interconnect structure

Connection member, semiconductor device, and stacked structure

Electronic device, test board, and semiconductor device manufacturing method

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Semiconductor devices

Semiconductor device with pre-molding chip bonding

Package with solder regions aligned to recesses

SEMICONDUCTOR DEVICE

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Chip package and method for forming the same

Semiconductor device having stacked chips, a re-distribution layer, and penetration electrodes

Chip package

Semiconductor device having a through-substrate via

Fan-out interconnect structure and method for forming same

Routing layer for mitigating stress in a semiconductor die

Expanded semiconductor chip and semiconductor device

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

Routing layer for mitigating stress in a semiconductor die

System and process for fabricating semiconductor packages

Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method

Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements

Semiconductor device with pre-molding chip bonding

METHOD FOR MAKING A DOUBLE-SIDED FANOUT SEMICONDUCTOR PACKAGE WITH EMBEDDED SURFACE MOUNT DEVICES, AND PRODUCT MADE

Chip package

Reconstituted wafer-level package DRAM

Methods and apparatus of packaging semiconductor devices

Three dimensional microelectronic components and fabrication methods for same

Chip package and method for forming the same

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHODS FOR SAME

Wire-based methodology of widening the pitch of semiconductor chip terminals

Package with metal-insulator-metal capacitor and method of manufacturing the same

Electronic components assembly

Semiconductor device and method of forming the same

Semiconductor device

Integrated circuit chip using top post-passivation technology and bottom structure technology

Enhanced flip chip package

Semiconductor device having a through-substrate via

Semiconductor package including stacked semiconductor chips and a redistribution layer

Substrate with embedded stacked through-silicon via die

Device including two power semiconductor chips and manufacturing thereof

Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer

Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump

Post-passivation interconnect structure and method of forming the same

SEMICONDUCTOR APPARATUS

Process for forming package-on-package structures

METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE

Method for manufacturing a circuit device

Method of Multi-Chip Wafer Level Packaging

Routing layer for mitigating stress in a semiconductor die

Wafer Level Package and a Method of Forming the Same

Semiconductor device having a trace comprises a beveled edge

Multi-die packages incorporating flip chip dies and associated packaging methods

Routing layer for mitigating stress in a semiconductor die

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Circuit substrate and method of manufacturing same

CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Flip chip device having simplified routing

Substrate with embedded stacked through-silicon via die

CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE

Semiconductor device and method of forming the same

Integrated circuit having a three dimensional stack package structure

Mechanisms for resistivity measurement of bump structures

Surface mount semiconductor device

Semiconductor device and semiconductor package having the same

Semiconductor device including chip with complementary I/O cells

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

Semiconductor Package And Method For Making The Same

Manufacturing method of semiconductor device

Semiconductor device and method of bonding different size semiconductor die at the wafer level

Semiconductor device having metal posts non-overlapping with other devices and layout method of semiconductor device

Layered chip package and method of manufacturing same

Semiconductor device and manufacturing method of semiconductor device

Embedded package and method for manufacturing the same

CHIP

Semiconductor apparatus

Semiconductor device having a conductive layer reliably formed under an electrode pad

Semiconductor device and method of designing a wiring of a semiconductor device

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Layered chip package and method of manufacturing same

UBM Etching Methods

Layered chip package and method of manufacturing same

Laminated semiconductor substrate, laminated chip package and method of manufacturing the same

Electrode pad having a recessed portion

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device

Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die

Semiconductor integrated circuit having a multi-chip structure

Near chip scale semiconductor packages

Chip package and method for forming the same

Routing layer for mitigating stress in a semiconductor die

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Method of manufacturing layered chip package

Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor device

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Routing layer for mitigating stress in a semiconductor die

Chip package and fabrication method thereof

Manufacturing method of semiconductor device and semiconductor device

Near chip scale package integration process

Under land routing

Semiconductor with Bottom-Side Wrap-Around Flange Contact

Near chip scale semiconductor packages

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Light emitting device package and method for fabricating the same

Electronic board, method of manufacturing the same, and electronic device

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package and methods of manufacturing the same

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof

Electronic component mounting structure

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor with bottom-side wrap-around flange contact

Wafer level edge stacking

Semiconductor device and manufacturing method of the same

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Near chip scale package integration process

Semiconductor device and method for manufacturing the same

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Electronic device and method of manufacturing the same

Semiconductor device and method for manufacturing semiconductor device

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device

Electronic board, method of manufacturing the same, and electronic device

Semiconductor device and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Method for re-routing lithography-free microelectronic devices

Semiconductor and method for producing a semiconductor

Semiconductor device, method for producing the same, circuit board, and electronic apparatus

Method of routing an electrical connection on a semiconductor device and structure therefor

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor chip with bumps and method for manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of manufacturing a semiconductor device

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Package including a plurality of stacked semiconductor devices, an interposer and interface connections

Multi-via redistribution layer for integrated circuits having solder balls

Stress relief solutions on WLCSP large/bulk copper plane design

Package including a plurality of stacked semiconductor devices an interposer and interface connections

Package structure with protrusion structure

Integrated fan-out package, redistribution circuit structure, and method of fabricating the same

Electronic apparatus

Semiconductor structure and manufacturing method thereof

Fan-out semiconductor package

Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture

Semiconductor structure and method for forming the same

Display with embedded pixel driver chips

Semiconductor device package and methods of manufacture thereof