209432 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bonding area, e.g. marks, spacers
METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
#2SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#3METHODS OF FORMING METAL ION BARRIER LAYERS AND RESULTING STRUCTURES
#4BONDING AND TRANSFERRING METHOD FOR DIE PACKAGE STRUCTURES
#5METHOD FOR PREPARING DISPLAY SUBSTRATE AND DISPLAY SUBSTRATE
#6Semiconductor structure comprising up-narrow and down-wide openings and forming method thereof
#7Semiconductor device including bond pad with fixing parts fixed onto insulating film
#8Semiconductor device and method for producing semiconductor device
#9Semiconductor structure with sacrificial anode and method for forming
#10Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
#11Semiconductor structure with sacrificial anode and passivation layer and method for forming
#12Semiconductor device and method for manufacturing the same
#13Structures and methods to improve lead-free C4 interconnect reliability