209433 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for protecting parts during manufacture
PROTRUDED BOND PADS FOR HYBRID BONDING OF SEMICONDUCTOR DEVICES
#2Selective Dielectric Capping for Hybrid Bonding
#3STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
#4Structures for low temperature bonding using nanoparticles
#5Methods for low temperature bonding using nanoparticles
#6SEMICONDUCTOR DEVICE WITH A BOND PAD AND A SANDWICH PASSIVATION LAYER AND MANUFACTURING METHOD THEREOF
#7Method of fabricating integrated circuit device
#8DIRECT BONDING METHODS AND STRUCTURES
#9Structures and methods for low temperature bonding using nanoparticles
#10Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch
#11Method of forming and packaging semiconductor die
#12Structures and methods for low temperature bonding using nanoparticles
#13Probe methodology for ultrafine pitch interconnects
#14Method of manufacturing wafer level low melting temperature interconnections
#15SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#16Corrosion resistant aluminum bond pad structure
#17Method of forming solder bumps
#18Semiconductor fabrication method thereof
#19Structures and methods for low temperature bonding using nanoparticles
#20Corrosion resistant aluminum bond pad structure
#21Method of forming solder bumps
#22Method of forming solder bumps
#23Method of manufacturing semiconductor device and semiconductor device
#24Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#25Backside integration of RF filters for RF front end modules and design structure
#26Power package module of multiple power chips and method of manufacturing power chip unit
#27Method of manufacturing semiconductor device and semiconductor device
#28Structures and methods for low temperature bonding using nanoparticles
#29Semiconductor devices and methods of forming thereof
#30Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same
#31Semiconductor structure with sacrificial anode and method for forming
#32Semiconductor device and manufacturing method thereof
#33Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
#34Bond pad structure with dual passivation layers
#35Method of protecting a mounting tape during laser singulation of a wafer
#36Conductive connections, structures with such connections, and methods of manufacture
#37Backside integration of RF filters for RF front end modules and design structure
#38Method for manufacturing semiconductor devices having a metallisation layer
#39Semiconductor devices and methods of forming thereof
#40Method of fabricating wafer-level chip package
#41Plug via formation with grid features in the passivation layer
#42Semiconductor device and manufacturing method thereof
#43Semiconductor structure with sacrificial anode and passivation layer and method for forming
#44Semiconductor device and electronic device having the same
#45Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
#46Method for manufacturing semiconductor devices having a metallisation layer
#47Packaged nano-structured component and method of making a packaged nano-structured component
#48Bond pad structure and method of manufacturing the same
#49Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packages
#50Backside integration of RF filters for RF front end modules and design structure
#51Manufacturing method of semiconductor device, processing method of semiconductor wafer, semiconductor wafer
#52SEMICONDUCTOR DEVICE INCLUDING THROUGH ELECTRODE AND METHOD OF MANUFACTURING THE SAME AND STACKED PACKAGE INCLUDING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#53Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process
#54Methods of forming bump structures that include a protection layer
#55SEMICONDUCTOR DEVICE DIE BONDING
#56Method of fabricating a semiconductor device having recessed bonding site
#57METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
#58Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#59Devices including bond pad having protective sidewall seal
#60Passivation layer for semiconductor device packaging
#61Semiconductor device having a copper plug
#62Layered chip package and method of manufacturing same
#63Method for manufacturing semiconductor devices having a metallisation layer
#64Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer
#65Protecting bond pad for subsequent processing
#66Semiconductor device having a copper plug
#67Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#68Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer
#69WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING
#70Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#71Semiconductor device and electronic device having the same
#72SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF
#73Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#74Method for fabricating last level copper-to-C4 connection with interfacial cap structure
#75Resist sidewall spacer for C4 BLM undercut control