209442 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the bonding area in liquid form
Sub-classes:LIQUID METAL INTERCONNECTS FOR POWER SEMICONDUCTOR MODULES
#2MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING PRODUCTION METHOD
#3Semiconductor device and method of forming insulating layers around semiconductor die
#4Semiconductor structure and manufacturing method thereof
#5Semiconductor device and method of forming insulating layers around semiconductor die
#6Integrated circuit backside metallization
#7Semiconductor package having a laser-activatable mold compound
#8WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#9Integrated circuit backside metallization
#10Semiconductor device and method of forming insulating layers around semiconductor die
#11Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same
#12Die sidewall interconnects for 3D chip assemblies
#13Semiconductor device and method of forming insulating layers around semiconductor die
#14Semiconductor device and method of forming insulating layers around semiconductor die
#15Method of manufacturing a layer structure having partially sealed pores
#16CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#17Multiple bond via arrays of different wire heights on a same substrate
#18Conductor structure for three-dimensional semiconductor device
#19SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#20Controlled solder-on-die integrations on packages and methods of assembling same
#21SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
#22Three-dimensional semiconductor device
#23Electronic component mounting structure
#24Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body
#25Three-dimensional semiconductor device
#26METHOD FOR FABRICATING A CIRCUIT
#27Protective layers for high-yield printed electronic devices
#28Method of manufacturing an electronic device having a contact pad with partially sealed pores