H01L2224/0343 - CPC Classification Index

ClassID:

209458 ⎘

H01L2224/0343 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in solid form

Sub-classes:

H01L2224/03436 » Lamination of a preform, e.g. foil, sheet or layer 26
H01L2224/03442 » using a powder 12

Recent Application in this class:

20230411317

2023-12-21

CHIP PACKAGE

20120286418

2012-11-15

Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance

20120211884

2012-08-23

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME