Patents-Review.com
ClassID:

209459 ⎘

H01L2224/03436 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in solid form Lamination of a preform, e.g. foil, sheet or layer

Recent Application in this class:
#1
20240274557
2024-08-15

SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE

 #2
20230369261
2023-11-16

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

 #3
20210257322
2021-08-19

SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF POWER DEVICE

 #4
20200279787
2020-09-03

3D flex-foil package

 #5
20190348387
2019-11-14

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

 #6
20180033759
2018-02-01

Semiconductor packages and methods of packaging semiconductor devices

 #7
20170372998
2017-12-28

SHEET MOLDING PROCESS FOR WAFER LEVEL PACKAGING

 #8
20170200670
2017-07-13

Embedding thin chips in polymer

 #9
20160365323
2016-12-15

Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices

 #10
20160240505
2016-08-18

Metal joining structure using metal nanoparticles and metal joining method and metal joining material

 #11
20160111353
2016-04-21

Embedding thin chips in polymer

 #12
20160099199
2016-04-07

Electronic devices with semiconductor die coupled to a thermally conductive substrate

 #13
20150357238
2015-12-10

Method of making integrated circuit

 #14
20140151744
2014-06-05

Power semiconductor devices

 #15
20140110859
2014-04-24

Embedding thin chips in polymer

 #16
20130075928
2013-03-28

INTEGRATED CIRCUIT AND METHOD OF MAKING

 #17
20130075890
2013-03-28

Integrated circuit and method of making

 #18
20130009300
2013-01-10

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

 #19
20110193222
2011-08-11

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

 #20
20110086505
2011-04-14

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

 #21
20100320560
2010-12-23

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

 #22
20100171221
2010-07-08

Semiconductor device and manufacturing method thereof

 #23
20100140797
2010-06-10

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

 #24
20100132992
2010-06-03

Device mounting board and semiconductor module

 #25
20100084763
2010-04-08

Metallic bump structure without under bump metallurgy and manufacturing method thereof

 #26
20050082669
2005-04-21

Electronic circuit device and porduction method therefor