ClassID:

209461

H01L2224/03444 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bonding area in gaseous form

Sub-classes:
Recent Application in this class:
#1
20250343187
2025-11-06

BONDING LAYER AND PROCESS OF MAKING

#2
20250201753
2025-06-19

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

#3
20250183217
2025-06-05

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

#4
20240282866
2024-08-22

PASSIVE ELEMENT AND ELECTRONIC DEVICE

#5
20240145416
2024-05-02

SUBSTRATE BONDING METHOD

#6
20230062465
2023-03-02

BONDING LAYER AND PROCESS OF MAKING

#7
20210327843
2021-10-21

Semiconductor packages with an intermetallic layer

#8
20170133341
2017-05-11

Semiconductor packages with an intermetallic layer

#9
20160218074
2016-07-28

Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel

#10
20150130029
2015-05-14

Semiconductor constructions having through-substrate interconnects

#11
20150084202
2015-03-26

Die edge side connection

#12
20140206145
2014-07-24

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

#13
20130323884
2013-12-05

Three dimensional microelectronic components and fabrication methods for same

#14
20130316497
2013-11-28

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHODS FOR SAME

#15
20120306084
2012-12-06

Methods of forming through-substrate interconnects

#16
20120282772
2012-11-08

Method of manufacturing a semiconductor component

#17
20120273951
2012-11-01

Contact Metal for Hybridization and Related Methods

#18
20120153484
2012-06-21

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

#19
20110316123
2011-12-29

Laminated semiconductor substrate, laminated chip package and method of manufacturing the same

#20
20110111561
2011-05-12

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

#21
20100059897
2010-03-11

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods