209474 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Sintering
Methods for registration of circuit dies and electrical interconnects
#2Method For Producing A Solder Contact Surface On A Chip By Producing A Sinter Paste Interface
#3Methods for registration of circuit dies and electrical interconnects
#4Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch
#5Bonding pad layer system, gas sensor and method for manufacturing a gas sensor
#6Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#7Semiconductor device
#8Method of forming solder bumps
#9Integrated circuit system with carrier construction configuration and method of manufacture thereof
#10Method of forming solder bumps
#11Method of forming solder bumps
#12Power semiconductor contact structure and method for the production thereof
#13Method for producing a silver sintering agent having silver oxide surfaces and use of said agent in methods for joining components by pressure sintering
#14Method of manufacturing a layer structure having partially sealed pores
#15Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#16Method for processing a semiconductor substrate and a method for processing a semiconductor wafer
#17Electronic devices with semiconductor die coupled to a thermally conductive substrate
#18Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures
#19Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#20SEMICONDUCTOR DEVICE
#21Solder joint structure, power module, power module substrate with heat sink and method of manufacturing the same, and paste for forming solder base layer
#22Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips
#23Solderless die attach to a direct bonded aluminum substrate
#24Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#25Solderless die attach to a direct bonded aluminum substrate
#26Three dimensional microelectronic components and fabrication methods for same
#27THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHODS FOR SAME
#28Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#29Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module
#30Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#31POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE
#32METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
#33Method of Contacting a Semiconductor Substrate
#34ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT
#35Semiconductor device
#36Process for producing a contact area of an electronic component
#37Metal line in semiconductor device and method for forming the same
#38Semiconductor package and method for manufacturing semiconductor package
#39Power semiconductor component with metal contact layer and production method therefor
#40Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body
#41Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier
#42Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#43Methods for protecting metal surfaces
#44Component mounting method and component-mounted body
#45Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#46Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device
#47Method of manufacturing an electronic device having a contact pad with partially sealed pores