209472 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
Sub-classes:SEMICONDUCTOR DIE PACKAGES AND METHODS OF FORMATION
#2METHODS AND DEVICES FOR IMPROVING BOND STRENGTH OF DIFFUSION BARRIERS
#3METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
#4OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES
#5Redistribution layer metallic structure and method
#6Oxidation and corrosion prevention in semiconductor devices and semiconductor device assemblies
#7Redistribution layer metallic structure and method
#8Redistribution layer metallic structure and method
#9Redistribution layer metallic structure and method
#10Connection pads for a fingerprint sensing device
#11Low z-height package assembly
#12Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#13Solderless die attach to a direct bonded aluminum substrate
#14Solderless die attach to a direct bonded aluminum substrate
#15Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#16Techniques for improving bond pad performance
#17ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
#18Semiconductor package
#19Semiconductor device
#20Semiconductor device and manufacturing method thereof
#21Semiconductor package
#22Process for making a semiconductor device having a roughened surface
#23Techniques for improving bond pad performance