209480 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material Selective modification
Sub-classes:CONTAMINATION FREE COPPER INTERCONNECT ON ALUMINUM PAD
#2SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
#3METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#4BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING THE SAME
#5Bonding structures of integrated circuit devices and method forming the same
#6Semiconductor package and method of manufacturing same
#7Bonding structures of integrated circuit devices and method forming the same
#8Method for permanent connection of two metal surfaces
#9Bonding structures of semiconductor devices
#10Contact structures with porous networks for solder connections, and methods of fabricating same
#11Method for permanent connection of two metal surfaces
#12Conductor structure for three-dimensional semiconductor device
#13Method for permanent connection of two metal surfaces
#14Three-dimensional semiconductor device
#15Three-dimensional semiconductor device
#16Manufacturing method of semiconductor device