209499 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the bonding area; Applying permanent coating, e.g. in-situ coating Immersion coating, e.g. in a solder bath
Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#2Electronic device having cobalt coated aluminum contact pads
#3Substrate structure with selective surface finishes for flip chip assembly
#4Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias
#5Bowl-shaped solder structure
#6Apparatus for package reinforcement using molding underfill
#7Die edge contacts for semiconductor devices
#8Package on package interconnect structure
#9Die edge contacts for semiconductor devices