209503 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the bonding area; Applying permanent coating, e.g. in-situ coating Chemical vapour deposition [CVD], e.g. laser CVD
THICK REDISTRIBUTION LAYER FEATURES
#2SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#3SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MATERIAL
#4THICK REDISTRIBUTION LAYER FEATURES
#5METHOD OF MAKING SEMICONDUCTOR STRUCTURE INCLUDING BUFFER LAYER
#6Semiconductor structure including buffer layer
#7Semiconductor device with metal film on surface between passivation film and copper film
#8Semiconductor package and method for manufacturing the same
#9Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same
#10Chip package, method of forming a chip package and method of forming an electrical contact
#11Method of designing a layout, method of making a semiconductor structure and semiconductor structure
#12Fabrication of solder balls with injection molded solder
#13Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer
#14Die structure, die stack structure and method of fabricating the same
#15Semiconductor Devices and Methods of Manufacture Thereof
#16Semiconductor device with post passivation structure
#17Semiconductor device with post passivation structure and fabrication method therefor
#18Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
#19Semiconductor devices and methods of manufacture thereof
#20Semiconductor device and manufacturing method thereof
#21Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement
#22Magnet assisted alignment method for wafer bonding and wafer level chip scale packaging