Semiconductor device and manufacturing method thereof

Flip chip package

Semiconductor package and multi-chip package using the same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Multi-chips package structure and the method thereof

A1InGaP LED having reduced temperature dependence

Method of bonding

Methods of fabricating a composite carbon nanotube thermal interface device

Semiconductor device

Method of fabricating semiconductor components with through interconnects

Semiconductor device and semiconductor device manufacturing method

Protection for bonding pads and methods of formation

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Etching Solution And Method For Structuring A UBM Layer System

Memory module and memory device

Heat spreader for a multi-chip package

Semiconductor integrated circuit device

Wafer-level integrated circuit package with top and bottom side electrical connections

Flip chip semiconductor assembly with variable volume solder bumps

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween

Semiconductor module and method of producing the same

Autoclave capable chip-scale package

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor IC-embedded substrate and method for manufacturing same

METHOD OF PRODUCING ELECTRONIC COMPONENT

Integrated thermoelectric cooling devices and methods for fabricating same

Process for producing multilayer printed wiring board

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method

Package having exposed integrated circuit device

Curable Silicone Composition And Electronic Device Produced Therefrom

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Semiconductor device

Fluorine depleted adhesion layer for metal interconnect structure

Semiconductor device

Power semiconductor device including a double metal contact

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

SURFACE TREATMENT METHOD

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

Method for forming lead frame land grid array

Method of manufacturing semiconductor package

Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate

Semiconductor device and a method of manufacturing the same

Solder interconnect pads with current spreading layers

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Curable silicone composition and electronic components

Gap capacitors for monitoring stress in solder balls in flip chip technology

Integrated inductor structure and method of fabrication

Electrical connecting structure and bonding structure

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor apparatus and semiconductor apparatus

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Heatplates for heatsink attachment for semiconductor chips

Integrated Circuit Packaging Using Electrochemically Fabricated Structures

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

High bandwidth cache-to-processing unit communication in a multiple processor/cache system

Device mounting board and manufacturing method therefor, and semiconductor module

Device mounting board, and semiconductor module and manufacturing method therefor

Bond pad structure

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

Semiconductor device having wiring line and manufacturing method thereof

Light-emitting diode arrangement comprising a color-converting material

Aligned nanotube bearing composite material

ANGLED FLYING LEAD WIRE BONDING PROCESS

Fine pitch solder bump structure with built-in stress buffer

Semiconductor chip and semiconductor device

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Manufacturing process of semiconductor device and semiconductor device

Liquid epoxy resin composition and flip chip semiconductor device

Module with stacked semiconductor devices

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

Flip chip interconnect solder mask

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

High performance system-on-chip inductor using post passivation process

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Method for processing a base that includes connecting a first base to a second base with an insulating film

Structure of embedded active components and manufacturing method thereof

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

SEMICONDUCTOR DEVICE PACKAGE

Integrated circuit incorporating wire bond inductance

Integrated circuit package-on-package stacking system and method of manufacture thereof

Semiconductor component and method for producing the same

Multileveled printed circuit board unit including substrate interposed between stacked bumps

Multiple access over proximity communication

Semiconductor device having a refractory metal containing film and method for manufacturing the same

MULTI-CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for processing a base that includes connecting a first base to a second base

Circuit board and manufacturing method thereof

Method of making halogen-free circuitized substrate with reduced thermal expansion

Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same

Semiconductor device

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Semiconductor device, circuit board, and electronic instrument

Semiconductor Device

Method and manufacture of silicon based package and devices manufactured thereby

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

CONSTRUCTION METHODS FOR BACKSIDE ILLUMINATED IMAGE SENSORS

Method of manufacturing semiconductor device

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

3-D semiconductor die structure with containing feature and method

Semiconductor package including flip chip controller at bottom of die stack

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor device and method of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

Integrated circuit package system with interposer

Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate

Leadless package system having external contacts

Positive photosensitive resin composition, and semiconductor device and display therewith

Semiconductor device and manufacturing method thereof

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Optical die-down quad flat non-leaded package

Connection unit, a board for mounting a device under test, a probe card and a device interfacing part

Integrated circuit package

Semiconductor element, semiconductor device, and fabrication method thereof

Semiconductor device

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

Semiconductor device employing wafer level chip size package technology

Wafer level chip scale packaging

Dice rearrangement package structure using layout process to form a compliant configuration

Methods for forming through wafer interconnects and structures resulting therefrom

Semiconductor device and automotive AC generator

Forming solder balls on substrates

Terminal pad structures and methods of fabricating same

Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes

Multi-die wafer level packaging

Semiconductor device

Thermal mechanical flip chip die bonding

ELECTRO-OPTIC INTEGRATED CIRCUITS WITH CONNECTORS AND METHODS FOR THE PRODUCTION THEREOF

Method of manufacturing a printed wiring board

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Semiconductor package

Semiconductor package having redistribution layer

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor die with die pad pattern

Coupling wire to semiconductor region

Semiconductor device and method for manufacturing the same

Semiconductor component

Method of fabricating semiconductor device having three-dimensional stacked structure

Manufacturing method of contact structure

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Interconnection element with plated posts formed on mandrel

3D chip arrangement including memory manager

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Top layers of metal for high performance IC's

Post passivation interconnection schemes on top of the IC chips

Flip chip interconnection with double post

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

Embedded package security tamper mesh

Method for soldering two elements together using a solder material

Method of fabricating an interconnection element having conductive posts

Leaded stacked packages having elevated die paddle

Light source apparatus and display apparatus and white resist layer

LCD Driver IC and Method for Manufacturing the Same

Wafer level semiconductor package and method for manufacturing the same

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the same

EXTENDED PLATING TRACE IN FLIP CHIP SOLDER MASK WINDOW

System and Method for Improving Reliability of Integrated Circuit Packages

Edge seal for thru-silicon-via technology

Warpage resistant semiconductor package and method for manufacturing the same

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

Method of Forming Conductive Lines and Similar Features

Low fabrication cost, high performance, high reliability chip scale package

Method of manufacturing a wiring substrate and semiconductor device

Manufacturing method for electronic devices

Method of manufacturing semiconductor device and semiconductor device

Method for fabricating electrical bonding pads on a wafer

Integrated circuit with flexible planar leads

Semiconductor package and packaging method for balancing top and bottom mold flows from window

SEMICONDUCTOR APPARATUS

Through substrate via semiconductor components

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Solder ball attachment ring and method of use

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Semiconductor device fabrication method

Protected solder ball joints in wafer level chip-scale packaging

Manufacturing method of redistribution circuit structure

Multilayer printed wiring board

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Semiconductor module

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTRUSION

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Copper pillar tin bump on semiconductor chip and method of forming the same

CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Method and system for providing a reliable semiconductor assembly

Stacked semiconductor device and method of forming serial path thereof

Wafer level sensing package and manufacturing process thereof

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device and method of manufacturing semiconductor device

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device

Semiconductor device and a method of manufacturing the same

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Wafer level sensing package and manufacturing process thereof

Radiation detector array

Conductive through via structure and process for electronic device carriers

Manufacturing method of semiconductor integrated device with inverting plating cup

Electrostatic discharge (ESD) protection structure

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Mould Part and Method for Encapsulating Electronic Components

Back end integrated WLCSP structure without aluminum pads

Electronic device and method of manufacturing same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Wafer-level chip scale package and method for fabricating and using the same

Method of manufacturing chip-on-chip semiconductor device

Substrate anchor structure and method

Methods for fabricating sub-resolution alignment marks on semiconductor structures

Wafer of circuit board and joining structure of wafer or circuit board

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Chip structure

METAL PAD OF SEMICONDUCTOR DEVICE

Fluid cooled encapsulated microelectronic package

Semiconductor device

Semiconductor chip with coil element over passivation layer

Method of forming micro metal bump

Warpage preventing substrates

Patterned Leads For WLCSP And Method For Fabricating The Same

Semiconductor package

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor packaging device

Through-silicon vias and methods for forming the same

Method of forming metallic bump and seal for semiconductor device

Method of forming metallic bump on I/O pad

High-Purity Tin or Tin Alloy and Process for Producing High-Purity Tin

Optical data transceivers

Layout schemes and apparatus for high performance DC-DC output stage

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Semiconductor device

Current distribution structure and method

Multilayer pillar for reduced stress interconnect and method of making same

Sprocket opening alignment process and apparatus for multilayer solder decal

Process for packaging electronic devices

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

Stable gold bump solder connections

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

I/O pad structures for integrated circuit devices

Semiconductor package having a crack-propagation preventing unit

Semiconductor devices

Multilayer printed wiring board

Method for producing an electric component-mounted substrate

Heat-resistant resin paste and method for producing same

Method of manufacturing wafer level package

Interface module

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor device with copper wirebond sites and methods of making same

Semiconductor device

Method for manufacturing an electronic component package and electronic component package

Semiconductor device and methods of manufacturing semiconductor devices

Integrated-circuit package for proximity communication

Electronic components on trenched substrates and method of forming same

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

Flip chip structure and method of manufacture

Stacked dual-die packages, methods of making, and systems incorporating said packages

Stacked semiconductor chips

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor package with passivation island for reducing stress on solder bumps

Method for stacking semiconductor chips

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Semiconductor package and method of reducing electromagnetic interference between devices

Low ohmic through substrate interconnection for semiconductor carriers

Semiconductor device

Three dimensional packaging optimized for high frequency circuitry

Method of manufacturing a printed circuit board having an embedded electronic component

Planar array contact memory cards

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Electromagnetic shield formation for integrated circuit die package

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Process for making microelectronic element chips

Method of manufacturing semiconductor device

Integrated circuit, circuit system, and method of manufacturing