Redistribution layer for wafer-level chip scale package and method therefor

Semiconductor device and method for manufacturing the same

Structure and method for fabricating flip chip devices

Electronic assemblies providing active side heat pumping

Integrated circuit package system with multi-chip module

Planar array contact memory cards

SEMICONDUCTOR DEVICE

Printed circuit board manufacturing method

3D IC method and device

Microelectronic package interconnect and method of fabrication thereof

Production methods of electronic devices

Semiconductor chip with crack stop

SUBSTRATE, ELECTRONIC COMPONENT, ELECTRONIC CONFIGURATION AND METHODS OF PRODUCING THE SAME

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor packaging process using through silicon vias

Semiconductor device and producing method of the same

Conductive metal structure applied to a module IC and method of manufacturing the same

Flip chip for electrical function test and manufacturing method thereof

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Semiconductor integrated circuit device and method of fabricating the same

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device having wafer level chip scale packaging substrate decoupling

Semiconductor device comprising internal and external wiring

SEMICONDUCTOR DEVICE

Structure and process for electrical interconnect and thermal management

Through-chip via interconnects for stacked integrated circuit structures

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Semiconductor device and manufacturing method for the same

Semiconductor device including semiconductor constituent and manufacturing method thereof

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Fan out type wafer level package structure and method of the same

Electronic device wafer level scale packages and fabrication methods thereof

Microelectronic lithographic alignment using high contrast alignment mark

Method of manufacturing semiconductor device

Top layers of metal for high performance IC's

Integrated circuit including parylene material layer

Flip chip interconnection

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Semiconductor chip, method of fabricating the same and stacked package having the same

Member for semiconductor light emitting device and method for manufacturing such member, and semiconductor light emitting device using such member

CIRCUIT BOARD, ELECTRONIC CIRCUIT DEVICE, AND DISPLAY DEVICE

Three-dimensional face-to-face integration assembly

Packaging substrate having electrical connection structure and method for fabricating the same

Cascode current sensor for discrete power semiconductor devices

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

Mounting method, electric part-mounted substrate and an electric device

Mounting method

INTERCONNECT ASSEMBLIES AND METHODS

Apparatus and method for bonding silicon wafer to conductive substrate

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES

CHIP MODULE, ACTIVE DEVICE ARRAY SUBSTRATE AND LIQUID CRYSTAL DISPLAY PANEL

GROUP PROBING OVER ACTIVE AREA PADS ARRANGEMENT

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Semiconductor stack package having wiring extension part which has hole for wiring

System and method for providing semiconductor device features using a protective layer

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Small area, robust silicon via structure and process

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

Conductor bump method and apparatus

Laser release process for very thin Si-carrier build

TFCC (TM) and SWCC (TM) thermal flex contact carriers

INTEGRATED CIRCUIT WITH INTERCONNECTED FRONTSIDE CONTACT AND BACKSIDE CONTACT

Compression bonding device and a mounting method

Method of manufacturing an electronic part mounting structure

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

SYSTEM IN PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor package and method for manufacturing the same for decreasing number of processes

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Crosstalk-free WLCSP structure for high frequency application

Thin plastic leadless package with exposed metal die paddle

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Sensor package

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Method and apparatus for fabricating integrated circuit device using self-organizing function

Semiconductor device with offset stacked integrated circuits

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

Wafer level package structure and fabrication methods

Weldable contact and method for the production thereof

Packaging substrate with conductive structure

Wafer processing method

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Flip-chip package structure, and the substrate and the chip thereof

Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor package with reduced length interconnect and manufacturing method thereof

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR CHIP AND PACKAGE PROCESS FOR THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Manufacturing process and structure of through silicon via

Lateral Power MOSFET With Integrated Schottky Diode

COMPRESSION BONDING DEVICE

Communication module having tuner units that are separated and isolated from each other, and method of manufacturing the same

Cooling of substrate using interposer channels

Method of forming a substrate with interposer channels for cooling the substrate

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Die-wafer package and method of fabricating same

Semiconductor device suitable for a stacked structure

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Three-dimensional chip-stack package and active component on a substrate

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device with pads of enhanced moisture blocking ability

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

SEMICONDUCTOR PACKAGE

Cooling of substrate using interposer channels

Cooling of substrate using interposer channels

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

High thermal performance packaging for circuit dies

Forming a semiconductor package including a thermal interface material

CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method for manufacturing the same

Packaged device and method of manufacturing the same

Method of machining substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Grooving bumped wafer pre-underfill system

Stack circuit member and method

Method of constructing a stacked-die semiconductor structure

RECOVERABLE ELECTRONIC COMPONENT

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Demountable interconnect structure

ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Signal transmission circuit, IC package, and mounting board

Semiconductor device including a stress buffer

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Self-aligned wafer or chip structure, and self-aligned stacked structure

Mounting substrate and manufacturing method thereof

Electronic device manufacturing method and electronic device

Electronic device manufacturing method and electronic device

Integrated circuit package system employing device stacking

Direct edge connection for multi-chip integrated circuits

THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION

Heat spreader in a flip chip package

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement

PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK

Stacked semiconductor package and method for manufacturing the same

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Semiconductor device

Integrated circuit package system having perimeter paddle

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM

System, apparatus and method of selective laser repair for metal bumps of semiconductor device stack

Electronic component package and method of manufacturing the same, and electronic component device

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Electromagnetic bandgap structure and printed circuit board

Manufacturing method of electronic component

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Method for fabricating semiconductor package

Apparatus for Producing Ic Chip Package

Method and structure to improve thermal dissipation from semiconductor devices

Semiconductor power device having a stacked discrete inductor structure

Semiconductor package and method for manufacturing thereof

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure

Solder bump interconnect for improved mechanical and thermo-mechanical performance

Electronic structures including barrier layers defining lips

Semiconductor device, chip package and method of fabricating the same

Heat dissipation package structure and method for fabricating the same

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

Electro-optical apparatus and a circuit bonding detection device and detection method thereof

Photoelectric conversion element having a semiconductor and semiconductor device using the same

METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRING BOARD

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Method of manufacturing electronic component integrated substrate

Bonding structure with buffer layer and method of forming the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Reducing stress in a flip chip assembly

Method of machining wafer

Fabrication method for semiconductor device

Au—Sn alloy bump including no large void and method of producing same

ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD

Contact pad and method of forming a contact pad for an integrated circuit

High-Density Fine Line Structure And Method Of Manufacturing The Same

Structure, method and system for assessing bonding of electrodes in FCB packaging

Microelectronic die including locking bump and method of making same

Electronic system with vertical intermetallic compound

Chip-in-slot interconnect for 3D chip stacks

Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module

Conductive ball arraying apparatus

Flexible and elastic dielectric integrated circuit

Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer

Method and apparatus for plating a semiconductor package

Method for providing near-hermetically coated, thermally protected integrated circuit assemblies

Heat spreader and method for manufacturing the same, and semiconductor device

Counterflow microchannel cooler for integrated circuits

Delay circuit and delay time adjustment method

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor element and method of manufacturing the same

Enhanced copper posts for wafer level chip scale packaging

Multi-die wafer level packaging

Semiconductor device

Cylindrical bonding structure and method of manufacture

Semiconductor device with molten metal preventing member

Semiconductor package

Programmable semiconductor interposer for electronic package and method of forming

Metal interconnect System and Method for Direct Die Attachment

CIRCUIT BOARD AND DISPLAY APPARATUS

OPTICAL SEMICONDUCTOR DEVICE WITH SEALING SPACER

Method and apparatus to change solder pad size using a differential pad plating

Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus

Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Semiconductor device and manufacturing method of the same

Standoff height improvement for bumping technology using solder resist

Semiconductor package

Electronic component and manufacturing method therefor

Method of fabricating a semiconductor device package

Electronic circuit module including chip mounted to multi-layer wiring plate in flip chip manner

Apparatus and method for measuring height of protuberances

Surface mountable integrated circuit packaging scheme

Silicon-on-insulator structures for through via in silicon carriers

Post passivation interconnection process and structures

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

CHIP EMBEDDED PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

Mold design and semiconductor package

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE

Semiconductor package

Mounting board, mounted body, and electronic equipment using the same

Semiconductor package and stacked layer type semiconductor package

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

Stacked semiconductor device and method of testing the same

Electronic component package

Composite substrate and method for manufacturing composite substrate

Solderable top metal for silicon carbide semiconductor devices

Method for manufacturing semiconductor package

THERMOSETTING ENCAPSULATION ADHESIVE SHEET

Power amplifier circuitry and method

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Chip Package with Stiffener Ring

SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIA AND RELATED METHOD OF FABRICATION

Semiconductor device and method of manufacturing same

Apparatus and Methods for Constructing Semiconductor Chip Packages with Silicon Space Transformer Carriers

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

Integrated chip carrier with compliant interconnects

Reliable metal bumps on top of I/O pads after removal of test probe marks

Chip assembly with interconnection by metal bump

Method for manufacturing semiconductor device, and semiconductor device

Semiconductor module manufacturing method, semiconductor module, and mobile device

Dimple free gold bump for drive IC

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor package having die with recess and discrete component embedded within the recess

Semiconductor device and fabrication method

Methods of assembling integrated circuit packages

Chip Package with Pin Stabilization Layer

Electronic system with expansion feature

Die stacking system and method

Housed active microstructures with direct contacting to a substrate

Package structure and manufacturing method thereof

Ultra thin bumped wafer with under-film

Stacked die package for peripheral and center device pad layout device

Systems and methods for post-circuitization assembly

METHODS FOR FORMING PACKAGE STRUCTURES

CONVEX DIE ATTACHMENT METHOD

Light Emitting Diode Module

Flip-chip semiconductor package and package substrate applicable thereto

Semiconductor package and method of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor package substrate

Semiconductor chip and manufacturing method thereof

Printed circuit board and flip chip package using the same with improved bump joint reliability

Heat dissipation semiconductor package

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure