METHOD OF FORMING CONDUCTIVE BUMPS

Camera modules and methods of fabricating the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

C4 joint reliability

Mounting structure of electronic component

Electronic component

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Multilayer pillar for reduced stress interconnect and method of making same

I/O pad structures for integrated circuit devices

Heat-resistant resin paste and method for producing same

Flip chip package with advanced electrical and thermal properties for high current designs

Semiconductor device and methods of manufacturing semiconductor devices

Method of testing using a temporary chip attach carrier

Microelectronic package and method of cooling an interconnect feature in same

Semiconductor device and method of manufacturing the same

Image sensor package

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Semiconductor device and methods of manufacturing semiconductor devices

SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Semiconductor device and method for manufacturing the same

Mounting structure of electronic component

Electronic device

Semiconductor package having a plurality input/output members

Magnetic shielding package structure of a magnetic memory device

Power semiconductor component with metal contact layer and production method therefor

Wiring board and method of manufacturing wiring board

Electronic device, method of producing the same, and semiconductor device

PACKAGING WITH A CONNECTION STRUCTURE

Electrical connections for multichip modules

Electronic assembly having a multilayer adhesive structure

Conductive ball mounting method and apparatus having a movable solder ball container

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Three-dimensional die-stacking package structure

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Semiconductor package and multi-chip semiconductor package using the same

Demountable interconnect structure

Method of making a wafer level integration package

Semiconductor device and method of manufacturing semiconductor device

Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module

Chip scale package having flip chip interconnect on die paddle

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING ELECTRICAL CONNECTING PADS

Temporary chip attach carrier

Method for Fabricating Array-Molded Package-On-Package

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Semiconductor package with under bump metallization aligned with open vias

High power density switch module with improved thermal management and packaging

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Interconnect structure with stress buffering ability and the manufacturing method thereof

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Macro-cell block and semiconductor device

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device and process for manufacturing the same

Chip package structure

Solder composition doped with a barrier component and method of making same

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of making reliable wafer level chip scale package semiconductor devices

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Microelectronic substrate including bumping sites with nanostructures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module with semiconductor chips and method for producing it

Power module having stacked flip-chip and method of fabricating the power module

Metallic electrode forming method and semiconductor device having metallic electrode

Structure of semiconductor device package and method of the same

Semiconductor device and fabrication process thereof

Electronic assembly having a multilayer adhesive structure

Semiconductor device and a method of manufacturing for high output MOSFET

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Method of manufacturing semiconductor devices encapsulated in chip size packages

MOS transistor device in common source configuration

Integrated circuit package having large conductive area and method for fabricating the same

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Apparatus and method for semiconductor wafer bumping via injection molded solder

Semiconductor device and method for manufacturing the same

Thin-film capacitor

Package structure with circuits directly connected to semiconductor chip

Light-emitting material, scintillator containing the light-emitting material, x-ray detector equipped with the scintillator, image display device using the light-emitting material, and light source using the light-emitting material

Semiconductor device having a high frequency electrode positioned with a via hole

Semiconductor device

Manufacturing method of semiconductor device with smoothing

Under bump metallurgy structure of a package and method of making same

INJECTION MOLDED SOLDER BALL METHOD

Electronic assembly for image sensor device and fabrication method thereof

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

METHOD FOR CHIP TO PACKAGE INTERCONNECT

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE FOR HIGH SPEED OPERATIONS AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having through vias

Micro-machined structure production using encapsulation

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Semiconductor device

Modular sensor assembly and methods of fabricating the same

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Structure and method for enhancing resistance to fracture of bonding pads

Ball grid array resonator

Solder ball mounting method and solder ball mounting substrate manufacturing method

Technique for forming a passivation layer without a terminal metal

Semiconductor device

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Method of fabricating semiconductor package structure

Integrated Circuit with Back Side Conductive Paths

Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same

CHIP PACKAGE AND CHIP PACKAGE ARRAY

Semiconductor device having circuit blocks in a single crystal layer, and bumps on certain blocks

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

Light emitting device and the manufacture method thereof

Microball placement solutions

Camera module and assembling process thereof

Semiconductor package and method for manufacturing the same

Physical quantity detection device with pixel array column-aligned terminals and method of driving same

Semiconductor device contact resistant to deterioration due to heat and method for manufacturing contact

Chip scale package and method for manufacturing the same

Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

Substrate structure integrated with passive components

Contact structure having a compliant bump and a test pad

Substrate structure integrated with passive components

Package structure having semiconductor chip embedded therein and method for fabricating the same

BLM structure for application to copper pad

Light emitting diode chip with large heat dispensing and illuminating area

Integrated circuit mount system with solder mask pad

Chip structure

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

CHIP STRUCTURE

Methods of forming solder connections and structure thereof

Substrate treating method and method of manufacturing semiconductor apparatus

DEVICE EMBEDDED WITH SEMICONDUCTOR CHIP AND STACK STRUCTURE OF THE SAME

Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

Semiconductor device including electrically conductive bump and method of manufacturing the same

Semiconductor device having a chip stack on a rewiring plate

Semiconductor Device

Semiconductor device and method of manufacturing the same

Chip level biostable interconnect for implantable medical devices

Process for fabricating chip package structure

Method for forming C4 connections on integrated circuit chips and the resulting devices

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Semiconductor device system and method for modifying a semiconductor device

Semiconductor device

Space transformer having multi-layer pad structures

Flip chip bonding structure

Interconnect structure with stress buffering ability and the manufacturing method thereof

Multi-chip package for reducing parasitic load of pin

Semiconductor device and fabrication process thereof

Chip package

Method of manufacturing wafer level stack package

Semiconductor package containing multi-layered semiconductor chips

Method, system, and apparatus for gravity assisted chip attachment

STACKED CONTACT BUMP

Chip packaging process

Semiconductor device and manufacturing method for the same

Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device

Wafer level chip scale package (WLCSP) with high reliability against thermal stress

Microelectromechanical semiconductor component with cavity structure and method for producing the same

Stack of semiconductor chips

Three-dimensional package and method of making the same

Semiconductor device having flange structure

Semiconductor device, method of manufacturing the same, and camera module

Semiconductor package and fabricating method thereof

Package board having internal terminal interconnection and semiconductor package employing the same

Methods of forming back side layers for thinned wafers

Semiconductor device and a method of manufacturing the same

Manufacturing method for semiconductor device and semiconductor device

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Method for Manufacturing Chip Package Structures

Microelectronic elements with compliant terminal mountings and methods for making the same

Chip package structure

Bonding apparatus having adjacent hot-heads for liquid crystal display manufacture

Semiconductor device with a wiring substrate and method for producing the same

FORMING A BARRIER LAYER IN JOINT STRUCTURES

Flip chip package and manufacturing method of the same

Integrated circuit package system with bump pad

Flip-chip light emitting diode device without sub-mount

Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls

Semiconductor device

Package and package module of the package

Small chips with fan-out leads

Photosensitive composition

Semiconductor device and method for manufacturing the same

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Stacked die package with thermally conductive block embedded in substrate

Electronic component packaging structure and method for producing the same

Integrated circuit solder bumping system

Cooling system for a semiconductor device and method of fabricating same

Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device

Integrated die bumping process

Multi-chip stack structure

Bumping process and structure thereof

Semiconductor device integrated with opto-electric component and method for fabricating the same

Chip package and bump connecting structure thereof

Semiconductor Apparatus and Semiconductor Module

Methods for forming flexible column die interconnects and resulting structures

High brightness light-emitting device and manufacturing process of the light-emitting device

Temperature dependent semiconductor module connectors

Electronic component and manufacturing method thereof

Backside-illuminated photodetector

Mechanical integrity evaluation of low-k devices with bump shear

Semiconductor device packaging substrate and semiconductor device packaging structure

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Electrical component and production thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Solid-state imaging device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor device production method and semiconductor device

Conductive bump structure of circuit board and method for forming the same

Method of making a circuitized substrate

Chip level biostable interconnect for implantable medical devices

Flip chip package and the fabrication thereof

Semiconductor device

C4 joint reliability

Underfill on substrate process and ultra-fine pitch, low standoff chip-to-package interconnections produced thereby

Temperature dependent semiconductor module connectors

Forming a barrier layer in interconnect joints and structures formed thereby

Semiconductor package and method for manufacturing the same

Submount for use in flipchip-structured light emitting device including transistor

CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Apparatus for use in semiconductor wafer processing for laterally displacing individual semiconductor devices away from one another

METHOD AND APPARATUS FOR MOUNTING AND REMOVING AN ELECTRONIC COMPONENT

MEMS packaging using a non-silicon substrate for encapsulation and interconnection

Chip scale package having flip chip interconnect on die paddle

Flip chip package with advanced electrical and thermal properties for high current designs

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Semiconductor device

Method for producing an electronic component with shielding

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Chip scale package and method for manufacturing the same

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Structure and manufacturing method of a chip scale package

Luminescent body and optical device including the same

Interconnection structure through passive component

Semiconductor substrate with conductive bumps having a stress relief buffer layer formed of an electrically insulating organic material

Flip-chip package structure with direct electrical connection of semiconductor chip

Integrated die bumping process

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Method of manufacturing semiconductor device

Repairable three-dimensional semiconductor subsystem

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device manufacturing method, semiconductor device, laminated semiconductor device, circuit substrate, and electronic apparatus

Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures

Electronic component and a panel

Method of making a circuitized substrate

Die-to-die connection method and assemblies and packages including dice so connected

Micro-machined structure production using encapsulation

SER immune cell structure

Cooling system for a semiconductor device and method of fabricating same

Film circuit substrate having Sn-In alloy layer

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Packaging method for an electronic element

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Method and apparatus for mounting and removing an electronic component

Semiconductor electrical connection structure and method of fabricating the same

Semiconductor device and fabrication method thereof

Film substrate of a semiconductor package and a manufacturing method

Method for manufacturing wafer level chip scale package structure

Submount for use in flipchip-structured light-emitting device including transistor

Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device

Light emitting device

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

Packaging with metal studs formed on solder pads

Integrated antenna type circuit apparatus

Methods and apparatuses for transferring heat from stacked microfeature devices

High-reliable semiconductor device using hermetic sealing of electrodes

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Semiconductor and method for producing a semiconductor

Semiconductor device and process for manufacturing the same

Fluxless solder transfer and reflow process

Metal-metal bonding of compliant interconnect

Semiconductor structure

Chip package structure

Semiconductor component having a CSP housing

Semiconductor device and manufacturing method thereof

Apparatus and method of wafer level package

Slave device, master device and stacked device

Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device

High brightness light-emitting device and manufacturing process of the light-emitting device

Heat-decaying materials, transfer sheet using the same, and patterning method

Method for forming interconnects on thin wafers

Semiconductor package including redistribution pattern and method of manufacturing the same

Integrated circuit packages with reduced stress on die and associated methods

Semiconductor device and method of manufacturing the same

Chip heat sink device and method

Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor device

Flip chip semiconductor package for testing bump and method of fabricating the same

Semiconductor light emitting device with flexible substrate

Selectable decoupling capacitors for integrated circuits and associated methods

Process for fabricating chip package structure