Process for making conductive post with footing profile

Light emitting device and the manufacture method thereof

Capillary and ultrasonic transducer for ultrasonic bonding

Packaging substrate having embedded passive component and fabrication method thereof

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE, AND DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

Micro-machined structure production using encapsulation

Electrostatic discharge (ESD) protection for electronic devices using wire-bonding

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

Chip scale package and fabrication method thereof

Semiconductor package and method for manufacturing the same via holes in semiconductor chip for plurality stack chips

Backside processing of semiconductor devices

Methods, devices, and materials for metallization

Method of forming Cu pillar capped by barrier layer

Implementing selective rework for chip stacks and silicon carrier assemblies

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND

CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS

Semiconductor device having semiconductor substrate, and method of manufacturing the same

Protection film having a plurality of openings above an electrode pad

Stack package having reduced electrical connection length suitable for high speed operations and method of manufacturing the same

Stacked memory module and system

Semiconductor chip having staggered arrangement of bonding pads

Electrode pad having a recessed portion

Stack type semiconductor package

Combined packaged power semiconductor device

Adhesive resin compositions, and laminates and flexible printed wiring boards using same

Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad

Copper bump structures having sidewall protection layers

Semiconductor device and manufacturing method thereof

Semiconductor device, and manufacturing method therefor

Method of manufacturing wiring board

Solder joints with enhanced electromigration resistance

SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE

Activation treatments in plating processes

Semiconductor device including external connection pads and test pads

Socket connector assembly with compressive contacts

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Magnetic microelectronic device attachment

COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES

Adhesive composition

Method of fabricating bump structure

Ventilating apparatus

Ventilating apparatus

Method of mounting devices in substrate and device-mounting substrate structure thereof

Photosensitive composition

Semiconductor device

Cu pillar bump with electrolytic metal sidewall protection

APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING

Integrated Circuit Package Having Under-Bump Metallization

Routing layer for mitigating stress in a semiconductor die

Semiconductor device

Manufacturing method for electronic devices

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

METHOD AND STRUCTURES OF A MINIATURIZED LINE LAMP

Multi-chip package with improved signal transmission

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

Method for mounting a component

Wiring board and liquid crystal display device

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

MOS transistor device in common source configuration

Solder alloy and semiconductor device

Flux-free chip to wafer joint serial thermal processor arrangement

Semiconductor element and display device provided with the same

Pillar structure having a non-planar surface for semiconductor devices

Method to form solder deposits on substrates

ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

Co-axial restraint for connectors within flip-chip packages

Semiconductor device having conductive pads and a method of manufacturing the same

Dual Interconnection in Stacked Memory and Controller Module

Method for establishing and closing a trench of a semiconductor component

Method for Fabricating Array-Molded Package-on-Package

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

Method for fabricating electrical bonding pads on a wafer

Manufacturing method of semiconductor device

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Semiconductor device and method for manufacturing the same

Method for manufacturing semiconductor device

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR

Method of manufacturing printed circuit board

First-level interconnects with slender columns, and processes of forming same

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

SILICONE BASE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND FILM

Thin-film capacitor having a connecting part of a lead conductor disposed within an opening in a protective layer

Integrated circuits and methods for forming the integrated circuits

Circuit board and chip package structure

Integrated Circuit

Mechanisms for forming copper pillar bumps

PILLAR BUMP WITH BARRIER LAYER

Routing layer for mitigating stress in a semiconductor die

Method of making a connection component with hollow inserts

Preventing UBM oxidation in bump formation processes

Semiconductor device and electronic apparatus equipped with the semiconductor device

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Electrical connection for multichip modules

Chip having a metal pillar structure

Wafers including patterned back side layers thereon

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

Template process for small pitch flip-chip interconnect hybridization

Wafer-level stack package

Method for manufacturing a semiconductor component

Interposer and electronic device

STRUCTURE AND METHOD FOR COUPLING SIGNALS TO AND/OR FROM STACKED SEMICONDUCTOR DIES

Protection layer for preventing UBM layer from chemical attack and oxidation

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device having stable signal transmission at high speed and high frequency

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules

METALLURGY FOR COPPER PLATED WAFERS

Manufacturing method of semiconductor device and semiconductor device

Conductive ball mounting apparatus having a movable conductive ball container

Electronic device, method of producing the same, and semiconductor device

Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

Structure and method for forming pillar bump structure having sidewall protection

Manufacturing method of semiconductor device including Au bump on seed film

Chip package structure and manufacturing methods thereof

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

Method for manufacturing semiconductor device

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Metallic electrode forming method and semiconductor device having metallic electrode

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Stress-engineered interconnect packages with activator-assisted molds

Manufacturing method for electronic devices

Power MOSFET package

Bump pad structure

In-situ cavity integrated circuit package

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Universal inter-layer interconnect for multi-layer semiconductor stacks

High quality electrical contacts between integrated circuit chips

Dual Interconnection in Stacked Memory and Controller Module

Light emitting apparatus and fabrication method thereof

Semiconductor device

Solid-state imaging device comprising through-electrode

Semiconductor device

Semiconductor device and method of forming the same

Bumped, self-isolated GaN transistor chip with electrically isolated back surface

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Filp chip interconnection structure with bump on partial pad and method thereof

Active device array substrate with particular test circuit

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

Integrated circuit packaging system with an interposer and method of manufacture thereof

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Package substrate

TCP-type semiconductor device

Acoustic wave device

Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element

Solder bump UBM structure

Semiconductor package structure

Semiconductor device and method for manufacturing semiconductor device

Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips

Semiconductor device and method of manufacturing the same, and electronic apparatus

MICROWAVE CIRCUIT ASSEMBLY

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Memory card and method for manufacturing memory card

METHOD OF FORMING CONNECTION TERMINAL

Electronic device package and method for fabricating the same

Underbump metallization structure

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Micro-machined structure production using encapsulation

Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board

Semiconductor device and electronic apparatus equipped with the semiconductor device

EXTRA HIGH BANDWIDTH MEMORY DIE STACK

Method of manufacturing semiconductor device

Structures and methods for improving solder bump connections in semiconductor devices

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device and semiconductor package including the same

Bonding inspection structure

Package carrier

Solder joints with enhanced electromigration resistance

Fabrication method of circuit board

Wafer structure with conductive bumps and fabrication method thereof

Power module having stacked flip-chip and method of fabricating the power module

Package for electronic component, manufacturing method thereof and sensing apparatus

Semiconductor device and method for fabricating the same

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Light emitting device and method for manufacturing same

Light-emitting diode die packages and illumination apparatuses using same

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

System and apparatus for venting electronic packages and method of making same

Device mounting board and semiconductor module

Method of manufacturing semiconductor device

Semiconductor device and connection checking method for semiconductor device

Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation

Semiconductor device and method of forming WLCSP using wafer sections containing multiple die

Solder ball mounting method and apparatus

Method of thinning a block transferred to a substrate

Semiconductor integrated circuit devices and display apparatus including the same

Semiconductor chip with through-silicon-via and sidewall pad

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING BUMPED LEAD AND METHOD OF MANUFACTURE THEREOF

Metal line in semiconductor device and method for forming the same

Semiconductor device and method of manufacturing semiconductor device

Structure and method for stacked wafer fabrication

MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS

Semiconductor package and method of manufacturing the same

Camera module and manufacturing method thereof

Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device

Conductive paths for transmitting an electrical signal through an electrical connector

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Chip structure and chip package structure

APPARATUS FOR USE IN SEMICONDUCTOR WAFER PROCESSING FOR LATERALLY DISPLACING INDIVIDUAL SEMICONDUCTOR DEVICES AWAY FROM ONE ANOTHER

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Electrical Component

Voltage switchable dielectric material containing conductor-on-conductor core shelled particles

Semiconductor package having bump ball

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Method for manufacturing semiconductor device having electrode for external connection

Semiconductor device with stacked memory and processor LSIs

System and process for fabricating semiconductor packages

Methods of forming solder connections and structure thereof

PACKAGING STRUCTURE, PACKAGING METHOD AND PHOTOSENSITIVE DEVICE

Stacked device identification assignment

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LED structure

Crystal structure of a solder bump of flip chip semiconductor device

Three-dimensional package and method of making the same

Method of manufacturing stacked semiconductor package using improved technique of forming through via

Electronic device having a chip stack

SEMICONDUCTOR DEVICE

Semiconductor device and method of fabricating semiconductor device

Method of making a sidewall-protected metallic pillar on a semiconductor substrate

Assembling of Electronic Members on IC Chip

Solid-state imaging device and method for manufacturing same

Semiconductor device and fabrication method thereof

PRESSURE-HEATING APPARATUS AND METHOD

Stacked memory module and system

Semiconductor device and method of manufacturing a semiconductor device

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

Conductive nanowires for electrical interconnect

Semiconductor package

Method for housing an electronic component in a device package and an electronic component housed in the device package

PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER

Methods and apparatuses for transferring heat from stacked microfeature devices

Injection molded solder ball method

Manufacturing method of wafer level chip scale package of image-sensing module

Methods of forming interlayer dielectrics having air gaps

Semiconductor device, and manufacturing method therefor

Transponder and method of producing a transponder

Electronic device package and fabrication method thereof

ELECTRONIC DEVICE HAVING ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS OF FABRICATING THE SAME

Image sensor package and camera module utilizing the same

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

Image sensor package, camera module having same and manufacturing method for the same

Heat radiation structure of semiconductor device, and manufacturing method thereof

Adhesive composition

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Intermetallic diffusion block device and method of manufacture

Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips

Process for Preparing a Solder Stand-Off

Wafer level integration package

Integrated circuit system having different-size solder bumps and different-size bonding pads

Contact structure and forming method thereof and connecting structure thereof

Flip chip interconnection structure with bump on partial pad and method thereof

Semiconductor package and method for manufacturing the same

Semiconductor device including adhesive covered element

Structure and method for coupling signals to and/or from stacked semiconductor dies

Semiconductor device and semiconductor device manufacturing method

Packaging an integrated circuit die using compression molding

Semiconductor module

Semiconductor device manufacturing method

Infinitely stackable interconnect device and method

Method and system for improving alignment precision of parts in MEMS

Integrated circuit and method

Electrical connecting structure and bonding structure

Image sensor having through via

Wafer processing method for processing wafer having bumps formed thereon

Clustered stacked vias for reliable electronic substrates

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

Stack package and method for manufacturing the same

Electronic element wafer module; electronic element module; sensor wafer module; sensor module; lens array plate; manufacturing method for the sensor module; and electronic information device

Semiconductor device and method of manufacturing the same

Semiconductor device including electrically conductive bump and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

WAFER-LEVEL STACK PACKAGE

Method for manufacturing metal chips by plasma from a layer comprising several elements

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Manufacturing method of contact structure

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

Flexible column die interconnects and structures including same

Multi-die processor

Manufacturing method for electronic devices

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Method for fabricating electrical bonding pads on a wafer

Solder ball attachment ring and method of use