Flip chip package structure and carrier thereof

Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Package for a light emitting element

Electronic device

Method for bonding a wire conductor laid on a substrate

Method of forming metallic bump and seal for semiconductor device

Electronic chip embedded circuit board and method of manufacturing the same

ESD protection substrate and integrated circuit utilizing the same

Semiconductor device and method of manufacturing the same

Thermally enhanced wafer level package

High speed electrical interconnects and method of manufacturing thereof

Semiconductor device

SEMICONDUCTOR PACKAGE HAVING A WARPAGE RESISTANT SUBSTRATE

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Semiconductor apparatus with decoupling capacitor

Multilayer pillar for reduced stress interconnect and method of making same

Roll-on encapsulation method for semiconductor packages

Die offset die to bonding

Circuit device

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

Bond pad design for fine pitch wire bonding

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Memory Packages Having Stair Step Interconnection Layers

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

I/O pad structures for integrated circuit devices

Wireless semiconductor package for efficient heat dissipation

Multilayer printed wiring board

Stacked semiconductor device and fabricating method thereof

Heat-resistant resin paste and method for producing same

Manufacturing process of leadframe-based BGA packages

PLASMA DISPLAY APPARATUS

Carrier body for components or circuits

Integrated circuit package including miniature antenna

Audio power amplifier package

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor

Integrated circuit packaging system with base structure device

Wafer-level image sensor module, method of manufacturing the same, and camera module

Island submount and a method thereof

Solder ball loading method and solder ball loading unit

Heat resistant substrate incorporated circuit wiring board

Method of manufacturing substrate

Manufacturing method of solder ball disposing surface structure of package substrate

Method of applying encapsulant to wire bonds

Wire bond encapsulant application control

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Method of adhering wire bond loops to reduce loop height

Method of wire bond encapsulation profiling

Integrated circuit support for low profile wire bond

MULTI-BAND TUNABLE RESONANT CIRCUIT

Multi-chip package for reducing parasitic load of pin

Method of testing using a temporary chip attach carrier

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Stacked semiconductor chips

Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

Microelectronic package and method of cooling an interconnect feature in same

Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package

Package structure and manufacturing method thereof

Center Conductor to Integrated Circuit for High Frequency Applications

Solid-state optical device

Method for forming interconnects

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Semiconductor device having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode

Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device

Method for fabricating multi-chip stacked package

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Electronic component soldering structure and electronic component soldering method

Carrier assembly for an integrated circuit

Semiconductor chip package and printed circuit board

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

Semiconductor device, and manufacturing method of semiconductor device

Integrated circuit package system with package encapsulation having recess

Structurally-enhanced integrated circuit package and method of manufacture

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with leads separated from a die paddle

Molded semiconductor device including IC-chip covered with conductor member

Image sensor package

Apparatus and method for arranging magnetic solder balls

Multilayer substrate with interconnection vias and method of manufacturing the same

Structural component comprising boron nitride agglomerated powder

Semiconductor connection component

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Package structure for multiple die stack

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor package embedded in substrate, system including the same and associated methods

SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING THE SAME

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Printed wiring board

Method for manufacturing printed circuit board

Methods of laser surface modification of ceramic packages for underfill spread control and structures formed thereby

Optoelectronic circuit with a photoreceptor and a laser diode, and module comprising the same

Imaging device and method for a bonding apparatus

Bidirectional switch module

Semiconductor apparatus

Semiconductor apparatus

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

Post passivation structure for a semiconductor device and packaging process for same

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device including thermally dissipating dummy pads

Semiconductor module including semiconductor chips in a plastic housing in separate regions

Integrated Circuit Package with Passive Component

Sandwiched organic LGA structure

BONDING-PATTERNED DEVICE AND ELECTRONIC COMPONENT

Redistribution structures for microfeature workpieces

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

CONDUCTIVE BALL MOUNTING APPARATUS

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

Printed board with component mounting pin

Printed board with component mounting pin

Wiring board, method of manufacturing the same, and semiconductor device having wiring board

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

Semiconductor package having buss-less substrate

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Semiconductor device

Front and rear covering type LED package structure and method for packaging the same

Semiconductor light emitting device and semiconductor light emitting apparatus

Method And Device For Enhancing Solderability

Electronic component mounting method and electronic component mounting device

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

Packaging substrate structure with electronic components embedded therein and method for manufacturing the same

Multi-substrate region-based package and method for fabricating the same

Microelectronic package

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Electronic device

Semiconductor package having a plurality input/output members

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Magnetic shielding package structure of a magnetic memory device

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Method of manufacturing an integrated circuit module

Cascode current sensor for discrete power semiconductor devices

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Power semiconductor component with metal contact layer and production method therefor

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Power semiconductor module

Stacked memory device

Semiconductor package having buried post in encapsulant and method of manufacturing the same

SEMICONDUCTOR DEVICE

Image sensor package with trench insulator and fabrication method thereof

Noncontact information storage medium and method for manufacturing same

Wiring board and method of manufacturing wiring board

Substrate with low-elasticity layer and low-thermal-expansion layer

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Power electronics devices with integrated gate drive circuitry

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Method and structure to reduce cracking in flip chip underfill

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Arrangement of stacked integrated circuit dice having a direct electrical connection

Semiconductor chip package and method for designing the same

Electronic device, method of producing the same, and semiconductor device

Integrated circuit packaging system for fine pitch substrates

Multi-chip stack structure having through silicon via and method for fabrication the same

Integrated Support Structure for Stacked Semiconductors With Overhang

PACKAGING WITH A CONNECTION STRUCTURE

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Component and assemblies with ends offset downwardly

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor device

Flip chip package structure and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electrical connections for multichip modules

Integrated circuit having a semiconductor substrate with a barrier layer

Electronic assembly having a multilayer adhesive structure

Semiconductor device and method for manufacturing the same

Semiconductor plastic package and fabricating method thereof

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor device

Method and apparatus for loading solder balls

Apparatus and method of mounting conductive ball

ALIGNMENT OF OPTICAL ELEMENT AND SOLAR CELL

THERMAL SPRAY FOR SOLAR CONCENTRATOR FABRICATION

Conductive ball mounting method and apparatus having a movable solder ball container

Flip chip mounting method and bump forming method

Luminescent material

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor apparatus having side surface wiring

Semiconductor device having double side electrode structure and method of producing the same

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Method for packaging semiconductor dies having through-silicon vias

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

Semiconductor device bonding apparatus and method for bonding semiconductor device using the same

Method of manufacturing printed wiring board

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Substrate removal during LED formation

Semiconductor assembly

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit package system with flexible substrate and recessed package

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Bonding pad for preventing pad peeling and method for fabricating the same

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Multichip module package and fabrication method

Heat-conductive package structure

Microelectronic package element and method of fabricating thereof

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Electrically connecting substrate with electrical device

Electronic device comprising an integrated circuit and a capacitance element

Microelectronic imagers and methods for manufacturing such microelectronic imagers

Method for connecting an electronic chip to a radiofrequency identification device

Method and apparatus for placing conductive balls

Film substrate, fabrication method thereof, and image display substrate

Method of fabricating chip package

PRODUCING A SURFACE-MOUNTABLE RADIATION EMITTING COMPONENT

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Power semiconductor package

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Chip package

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Optical semiconductor device

Multilayered printed circuit board and fabricating method thereof

ELECTRONIC APPARATUS

Method for fabricating semiconductor package free of substrate

Method of fabricating a two-sided die in a four-sided leadframe based package

Methods for forming quad flat no-lead (QFN) packages

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Circuit system with circuit element and reference plane

LED with phosphor layer having different thickness or different phosphor concentration

Method of manufacturing a piezoelectric component

Integrated circuit package system with overhang die

Semiconductor device and wire bonding method

Electronic device comprising an ESD device

Semiconductor package and method for manufacturing the same

Integrated circuit package system with overhanging connection stack

Wafer-level solder bumps

Semiconductor device, a method of manufacturing the same and an electronic device

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Semiconductor package and multi-chip semiconductor package using the same

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Packaged device and method of manufacturing the same

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Method for manufacturing a printed wiring board

BONDING METHOD AND BONDING APPARATUS

Demountable interconnect structure

Multi-layer substrate and manufacture method thereof

Semiconductor memory device and semiconductor memory card using the same

Antenna System for a Radar Transceiver

Antenna system for a radar transceiver

Tape wiring substrate and chip-on-film package using the same

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Electrical shielding in stacked dies by using conductive die attach adhesive

Structure and manufactruing method of chip scale package

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Die mounting stress isolator

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Method of making a wafer level integration package

Method for designing dummy pattern, exposure mask, semiconductor device, method for semiconductor device, and storage medium