Surface mountable chip

Low profile side emitting LED with window layer and phosphor layer

Method of making demountable interconnect structure

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Connected body and optical transceiver module

Optical path converting member, multilayer print circuit board, and device for optical communication

Method Of Manufacturing A Fingerprint Sensor And Corresponding Sensor

Semiconductor memory device

FACE-TO-FACE BONDED I/O CIRCUIT DIE AND FUNCTIONAL LOGIC CIRCUIT DIE SYSTEM

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Die offset die to die bonding

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

Image sensor module with a three-dimensional die-stacking structure

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Semiconductor package with passive elements

Chip package

CHIP PACKAGE

CHIP PACKAGE

Thin flash or video recording light using low profile side emitting LED

Implementation structure of semiconductor package

Optical path converting member, multilayer print circuit board, and device for optical communication

WIRING SUBSTRATE WITH REINFORCING MEMBER

Chip carrier substrate and production method therefor

Electronic component and manufacturing method thereof

Electronic circuit package

Through silicon via dies and packages

Thin silicon based substrate

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Chip-in-slot interconnect for 3D chip stacks

Pin grid array package substrate including pins having curved pin heads

Microelectronic packages having cavities for receiving microelectric elements

Leadframe with die pad and leads corresponding thereto

Integrated circuit package system with leadfinger

Integrated circuit package system with leaded package

Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module

Mount for a semiconductor light emitting device

Vented die and package

Wiring board and manufacturing method thereof

Printed wiring board and a method of manufacturing a printed wiring board

Circuit device and manufacturing method therefor

Chip scale package having flip chip interconnect on die paddle

Integrated circuit die with logically equivalent bonding pads

ELECTRONIC COMPONENT-CONTAINING MODULE AND MANUFACTURING METHOD THEREOF

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

Method of Manufacturing Electrical Conductors for a Semiconductor Device

Multi-die wafer level packaging

Substrate with pin, manufacturing method thereof, and semiconductor product

Package stacking through rotation

Microelectronic package having interconnected redistribution paths

Packages and assemblies including lidded chips

Sensor semiconductor device and manufacturing method thereof

Chip assembly including package element and integrated circuit chip

Printed circuit board, production method therefor, electronic-component carrier board using printed circuit board, and production method therefor

MULTILAYER PRINTED WIRING BOARD

Semiconductor chip mounting board with multiple ports

Method of assembling a silicon stack semiconductor package

SURFACE-MOUNT TYPE CRYSTAL OSCILLATOR

Semiconductor device and process for fabrication thereof

Semiconductor device package and method of fabricating the same

SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and fabrication method thereof

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Semiconductor integrated circuit with solder bump

Bonding pad structure disposed in semiconductor device and related method

Image sensing devices and methods for fabricating the same

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Method of fabricating a circuit board and semiconductor package.

Method for adhering semiconductor devices

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Temporary chip attach carrier

Light emitting device and light emitter

Flip chip mounting method and bump forming method

Semiconductor package with under bump metallization aligned with open vias

BUMP STRUCTURE

Semiconductor package using chip-embedded interposer substrate

Die stacking system and method

System-in-package type semiconductor device

Chip-On-Lead and Lead-On-Chip Stacked Structure

Semiconductor Package Having Reduced Thickness

Method for manufacturing a printed wiring board

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION

Wiring board connection method

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same

Etch method

Semiconductor package and method of forming the same, and printed circuit board

In package ESD protections of IC using a thin film polymer

RF-coupled digital isolator

RF-coupled digital isolator

Device comprising an element with electrodes coupled to connections

Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects

Semiconductor device and a method of manufacturing the same

Flash memory card

Microelectronic package and method of manufacturing same

High power density switch module with improved thermal management and packaging

Wiring board with built-in component and method for manufacturing the same

Multi-layer printed circuit board and method of manufacturing multilayer printed circuit board

Circuit board and method of fabricating the same

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor device package with multi-chips and method of the same

Package substrate and its solder pad

Pin grid array package substrate including slotted pins

Package-on-package using through-hole via die on saw streets

Through-hole via on saw streets

Semiconductor substrates including vias of nonuniform cross-section and associated structures

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Test structures for stacking dies having through-silicon vias

Thermal insulation for a bonding tool

LED epiwafer pad manufacturing process & new construction thereof

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Chip package

Fabricating process of a chip package structure

Bidirectional multiplexed RF isolator

Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board

Surface acoustic wave device and boundary acoustic wave device

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Package equipped with semiconductor chip and method for producing same

Semiconductor device and its manufacturing method

Semiconductor device and process for fabricating the same

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Semiconductor chip with post-passivation scheme formed over passivation layer

Structure of packaging substrate and method for making the same

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

Magnetically alignable integrated circuit device

Semiconductor device and method for producing the same

STACKED SEMICONDUCTOR DEVICE ASSEMBLY AND PACKAGE

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Interconnect structure with stress buffering ability and the manufacturing method thereof

On chip transformer isolator

Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion

Fabric type semiconductor device package and methods of installing and manufacturing same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Macro-cell block and semiconductor device

Integrated circuit package system for package stacking and method of manufacture therefor

Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same

Ultra-thin chip packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor package and method

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Semiconductor device with power noise suppression

Interposer and electronic device fabrication method

LIGHT-EMITTING DIODE AND METHOD FOR PRODUCING IT

Semiconductor device and process for manufacturing the same

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

COMPACT OPTO-ELECTRONIC DEVICE INCLUDING AT LEAST ONE SURFACE EMITTING LASER

Light emitting module

Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device

Power-MOSFETs with improved efficiency for multi-channel class-D audio amplifiers and packaging thereof

Light-emitting element including a fusion-bonding portion on contact electrodes

Chip package structure

Semiconductor device

Flip chip with interposer, and methods of making same

Semiconductor device and manufacturing method thereof

Multi-chip module

Curing layers of a semiconductor product using electromagnetic fields

Plastic package and method of fabricating the same

Semiconductor device

Semiconductor device

Mounted body and method for manufacturing the same

SEMICONDUCTOR PACKAGE

Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package

Capacitor and wiring board including the capacitor

Mounting substrate and electronic device

Electrical interconnect structure and method

Wiring design support apparatus for bond wire of semiconductor devices

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THERMAL BONDING PROCESS FOR CHIP PACKAGING

Package substrate and device for optical communication

Chip package structure

Integrated circuit carrier arrangement with electrical connection islands

Display device

Solid-state image sensing device

Semiconductor device and method of manufacturing same

Semiconductor device with a semiconductor chip connected in a flip chip manner

Stack package, a method of manufacturing the stack package, and a digital device having the stack package

Stacked package module and board having exposed ends

Chip package structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

FABRICATION METHOD AND STRUCTURE OF PCB ASSEMBLY, AND TOOL FOR ASSEMBLY THEREOF

CIRCUIT BOARD STRUCTURE FOR EMBEDDING SEMICONDUCTOR CHIP THEREIN AND METHOD FOR FABRICATING THE SAME

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Solder composition doped with a barrier component and method of making same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method of assembling chips

METHODS OF LASER SURFACE MODIFICATION OF CERAMIC PACKAGES FOR UNDERFILL SPREAD CONTROL AND STRUCTURES FORMED THEREBY

CAPACITOR BUILT-IN WIRING BOARD

Varistor and light emitting device

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE

Semiconductor device and dam for resin

Semiconductor device

Semiconductor device

Semiconductor device and wiring board

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Integrated circuit package system with bonding in via

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

Semiconductor device

Microelectronic package and method of manufacturing same

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

Microelectronic die having nano-particle containing passivation layer and package including same

Package structure and manufacturing method thereof

ISOLATED SOLDER PADS

THROUGH-ELECTRODE AND SEMICONDUCTOR DEVICE

Semiconductor device with different sized ESD protection elements

Light emitting diode lamp with low thermal resistance

Semiconductor light emitting element, method for manufacturing the same, and light emitting device

Method of joining electronic package capable of prevention for brittle fracture

Circuit board and method of manufacturing same

Circuit board and circuit device

Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Method of making semiconductor package with plated connection

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

Output Circuit

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE

Semiconductor device and its manufacturing method

Chip package module

Semiconductor package

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Methods and apparatus for flip-chip-on-lead semiconductor package

Semiconductor light emitting device

Method for manufacturing electric connections in wafer

Paste for forming an interconnect and interconnect formed from the paste

Fibrous laminate interface for security coatings

Wire bonding method and related device for high-frequency applications

Method of joining chips utilizing copper pillar

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module with multiple semiconductor chips

Semiconductor device having stacked dice disposed on base substrate

Base substrate for chip scale packaging

Package structure and stacked package module using the same

Method and apparatus for fabricating a plurality of semiconductor devices

CHIP PACKAGE STRUCTURE

Semiconductor device and method of manufacturing the same

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and manufacturing method of the same

Submount for diode with single bottom electrode

Wiring substrate and electronic device

Wiring board and capacitor to be built into wiring board

Design techniques for stacking identical memory dies

Semiconductor module

Thin film deposition as an active conductor and method therefor

Electronic device, package having the same, and electronic apparatus

Class D amplifier arrangement

Method and device including reworkable alpha particle barrier and corrosion barrier

Semiconductor device manufacturing method and semiconductor device

System and method for increased stand-off height in stud bumping process

Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces

Structure of semiconductor device package and method of the same

Semiconductor device and method of manufacturing the same

Resin molded semiconductor device and differential amplifier circuit

Space-efficient package for laterally conducting device

Conductive ball mounting apparatus and conductive ball mounting method

Method for manufacturing the BGA package board

Method of forming plugs

Methods for fabricating semiconductor components and packaged semiconductor components

Semiconductor device and fabrication process thereof

Thermosetting die bonding film

Method for manufacturing semiconductor light emitting device

Method of assembling chips

Electronic assembly having a multilayer adhesive structure

Package structure to improve the reliability for WLP

Memory IC package assembly having stair step metal layer and apertures

Light emitting apparatus

Method and apparatus for ultra thin wafer backside processing

Electronic component structure and method of making

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Method of manufacturing an electronic component and an electronic device

CHIP CARD MODULE AND METHOD OF PRODUCING A CHIP CARD MODULE

Low profile flip chip power module and method of making

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Semiconductor package and fabrication method thereof

Semiconductor device

Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same

Stacked Package and Method of Fabricating the Same

High current semiconductor power device SOIC package

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

Method for fabricating an electronic device substrate

Leadframe enhancement and method of producing a multi-row semiconductor package

Package board and method for manufacturing thereof

Semiconductor package having stacked semiconductor chips

Semiconductor device and method for manufacturing the same

CHIP PACKAGE

Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member

Semiconductor device and method for producing the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same