Lead frame substrate and method of manufacturing the same, and semiconductor device

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

Semiconductor chip package assembly with deflection-resistant leadfingers

Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars

Germanium film optical device

High voltage devices and methods of forming the high voltage devices

Two dimensional light source using light emitting diode and liquid crystal display device using the two dimensional light source

Reconfigurable radio-frequency front-end

Flip-chip mounting method and bump formation method

INTEGRATED DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Semiconductor memory device having improved voltage transmission path and driving method thereof

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

Inductive relayed coupling circuit between substrates

Quad flat no lead (QFN) package

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

Semiconductor package and stack semiconductor package having the same

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

Semiconductor package having electrical connecting structures and fabrication method thereof

Semiconductor device and method for manufacturing the same

Semiconductor package

Stack package

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

INTERPOSER AND SEMICONDUCTOR DEVICE

Circular shield of a circuit-substrate laminated module and electronic apparatus

Solid-state image pickup device, electronic apparatus using such solid-state image pickup device and method of manufacturing solid-state image pickup device

Contacting a device with a conductor

Bonding apparatus

Circuit board and its wire bonding structure

Method for fabricating electrical bonding pads on a wafer

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Method for manufacturing chips

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Base plate for use in a multi-chip module

Systems employing a stacked semiconductor package

Integrated circuit with inductive bond wires

Radio frequency amplifier with effective decoupling

Microelectronic assembly with joined bond elements having lowered inductance

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Pre-soldered leadless package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and manufacturing method thereof

Boron nitride agglomerated powder and devices comprising the powder

Method and apparatus for pass/fail determination of bonding and bonding apparatus

Flow sensors having nanoscale coating for corrosion resistance

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Semiconductor connection component

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Semiconductor device having a microcomputer chip mounted over a memory chip

Semiconductor device and method for manufacturing the same

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device, substrate and semiconductor device manufacturing method

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Leadframe for semiconductor package

Light emitting diodes with smooth surface for reflective electrode

Method for manufacturing an electronic assembly

Method for manufacturing a semiconductor apparatus having a through-hole interconnection

Method of forming at least one bonding structure

Method of manufacturing a wiring board

Method for manufacturing semiconductor device

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR

Semiconductor device

Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device

Through-silicon via with air gap

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Semiconductor device with sealed semiconductor chip

Heat radiation member for a semiconductor package with a power element and a control circuit

Auxiliary leadframe member for stabilizing the bond wire process

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device, and communication apparatus and electronic apparatus having the same

SEMICONDUCTOR LIGHT-EMITTING DEVICE

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME

Process to form semiconductor packages with external leads

Semiconductor device and method of manufacturing the same

Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method

Universal IO unit, associated apparatus and method

Semiconductor device

Package system with a shielded inverted internal stacking module and method of manufacture thereof

3D interconnection structure and method of manufacturing the same

INTEGRATED PASSIVE DEVICE ASSEMBLY

Substrate holder and plating apparatus

Method of manufacturing printed circuit board

Manufacturing method of semiconductor device

Packaged device and method of manufacturing the same

First-level interconnects with slender columns, and processes of forming same

Stack semiconductor package and method for manufacturing the same

Semiconductor device

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and structure

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES

Electrical bond connection system

THERMOSETTING ADHESIVE FILM, ADHESIVE FILM WITH DICING FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE THERMOSETTING ADHESIVE FILM OR THE ADHESIVE FILM WITH DICING FILM

Biocompatible bonding method and electronics package suitable for implantation

SEMICONDUCTOR DEVICE

Flip-chip underfill

Semiconductor device, production method for the same, and substrate

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME

Semiconductor device and method of manufacturing the same

Circuit-connecting material and circuit terminal connected structure and connecting method

Bonding apparatus and bonding method

Stacked electronic device and method of making such an electronic device

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

SILICONE BASE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND FILM

Stacked semiconductor devices including a master device

Semiconductor memory device and semiconductor memory card using the same

Integrated circuits and methods for forming the integrated circuits

Integrated Circuit

POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF

Semiconductor device package

Semiconductor component having through wire interconnect with compressed bump

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor memory device and manufacturing method thereof

Inductor and electric power supply using it

Semiconductor apparatus and chip selection method thereof

Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Mechanisms for forming copper pillar bumps

PILLAR BUMP WITH BARRIER LAYER

Molded semiconductor package having a filler material

Power module assembly with reduced inductance

Wafer integrated with permanent carrier and method therefor

Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate

Via forming method and method of manufacturing multi-chip package using the same

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

Hybrid package

Ball grid array substrate with insulating layer and semiconductor chip package

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Routing layer for mitigating stress in a semiconductor die

Semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Semiconductor sensor for detecting a light radiation

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

Method of making a connection component with hollow inserts

Bumping Electronic Components Using Transfer Substrates

Preventing UBM oxidation in bump formation processes

Method of manufacturing a lead frame with a nickel coating

Method for manufacturing package system incorporating flip-chip assembly

Package, in particular for MEMS devices and method of making same

Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device

Method and apparatus providing fine alignment of a structure relative to a support

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and electronic apparatus equipped with the semiconductor device

Adhesive on wire stacked semiconductor package

Leadframe packages having enhanced ground-bond reliability

Semiconductor device and manufacturing method thereof

Semiconductor Device

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate

SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Electrical connection for multichip modules

Reducing Device Mismatch by Adjusting Titanium Formation

Chip having a metal pillar structure

SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

Through silicon via (TSV) wire bond architecture

Solid state image capture device and method for manufacturing same

Semiconductor device

Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type

Semiconductor integrated circuit and multi-chip module

Integrated circuit with protective structure

Die stacking system and method

Semiconductor device

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

Template process for small pitch flip-chip interconnect hybridization

Integrated circuit package system for stackable devices and method for manufacturing thereof

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Wafer-level stack package

Pad layout structure of driver IC chip

Wiring board, semiconductor device, and method of manufacturing the same

Electronic component, board unit, and information-processing device

LOCAL INTEGRATION OF NON-LINEAR SHEET I INTEGRATED CIRCUIT PACKAGES FOR ESD/EOS PROTECTION

Electronic device

Method for manufacturing a semiconductor component

Back side metallization with superior adhesion in high-performance semiconductor devices

Apparatus and methods of forming an interconnect between a workpiece and substrate

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

Semiconductor integrated circuit

Interposer and electronic device

Manufacturing method of semiconductor device

Template and pattern forming method

Method of manufacturing semiconductor device

3D smart power module

Fabrication method of semiconductor integrated circuit device

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Semiconductor device and adhesive sheet

Semiconductor package with semiconductor core structure and method of forming the same

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Integrated circuit packaging system with cap layer and method of manufacture thereof

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Thermally improved semiconductor QFN/SON package

Resin-sealed semiconductor device and method of manufacturing the same

Screened electrical device and a process for manufacturing the same

Semiconductor device having semiconductor chip within multilayer substrate

Semiconductor device including vertical transistor and horizontal transistor

Semiconductor light emitting element, method for manufacturing the same, and light emitting device

Printed wiring board and method for manufacturing the same

Heat resistant substrate incorporated circuit wiring board

STRUCTURE AND METHOD FOR COUPLING SIGNALS TO AND/OR FROM STACKED SEMICONDUCTOR DIES

Stacked-die package including substrate-ground coupling

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Display device

Semiconductor package

Protection layer for preventing UBM layer from chemical attack and oxidation

Substrate and package with micro BGA configuration

Double-side mountable MEMS package

Method of manufacturing a printed wiring board

Stacked device remapping and repair

Semiconductor wafer coat layers and methods therefor

Method of integrating a MOSFET with a capacitor

SEMICONDUCTOR DEVICE

Die Package

Semiconductor Chip with Stair Arrangement Bump Structures

Impedance optimized chip system

Semiconductor package

Delamination resistant packaged die having support and shaped die having protruding lip on support

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

Metal-oxide-semiconductor chip and fabrication method thereof

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

Method for manufacturing interposer

Semiconductor device, and power conversion device using semiconductor device

Electronic devices with extended metallization layer on a passivation layer

Semiconductor chip with contoured solder structure opening

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

DEVICES AND METHOD FOR MANUFACTURING A DEVICE

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive connection film

Printed wiring board and method for manufacturing the same

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Vertically stacked pre-packaged integrated circuit chips

High frequency circuit having multi-chip module structure

Multichip module and method for manufacturing the same

Semiconductor device

Semiconductor device having stable signal transmission at high speed and high frequency

Electronic part and method of manufacturing the same

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

Semiconductor device having semiconductor chip and metal plate

Light emitting diode package

Semiconductor memory device and semiconductor memory card

Method for manufacturing semiconductor device

Method of making a semiconductor chip assembly with a post/base heat spreader and an adhesive between the base and a terminal

Illumination apparatus

Semiconductor device

Semiconductor package

Integrated circuit

Electronic device and manufacturing method therefor

Ball-grid-array package, electronic system and method of manufacture

Package-level integrated circuit connection without top metal pads or bonding wire

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Edge connect wafer level stacking

Light-emitting device and method for manufacturing the same

Integrated circuit device and electronic equipment

Light emitting apparatus

Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device

Method of thinning a semiconductor substrate

METHODS FOR FABRICATING SEMICONDUCTOR COMPONENTS AND PACKAGED SEMICONDUCTOR COMPONENTS

Power semiconductor circuit device and method for manufacturing the same

Semiconductor package requiring reduced manufacturing processes

Semiconductor package

Semiconductor device having an interposer

NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

Metal trace fabrication for optical element

Method of making micromodules including integrated thin film inductors

Method and apparatus for manufacturing semiconductor device

Stud bumps as local heat sinks during transient power operations

Integrated circuit device and electronic apparatus

Semiconductor device and programming method

Component arrangement and method for producing a component arrangement

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Three-dimensional semiconductor device comprising an inter-die connection on the basis of functional molecules

METALLURGY FOR COPPER PLATED WAFERS

Manufacturing method of semiconductor device and semiconductor device

METHOD OF MANUFACTURING SUBSTRATES HAVING ASYMMETRIC BUILDUP LAYERS

Semiconductor device having under-filled die in a die stack

High frequency field-effect transistor

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD

Thin foil semiconductor package

Conductive ball mounting apparatus having a movable conductive ball container