209543 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area; External layer Material
Semiconductor package and mobile device using the same
#902Method of manufacturing stack type semiconductor package
#903Semiconductor package with a mold material encapsulating a chip and a portion of a lead frame
#904Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom
#905Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#906Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same
#907BGA PACKAGE WITH TRACES FOR PLATING PADS UNDER THE CHIP
#908Stackable molded microelectronic packages
#909Circuit board
#910THERMAL FLEX CONTACT CARRIERS #2
#911Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#912Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds
#913Semiconductor device assembly and method thereof
#914SEMICONDUCTOR DEVICE
#915Resin-encapsulated semiconductor device
#916Methods, devices, and materials for metallization
#917Method of forming Cu pillar capped by barrier layer
#918Semiconductor device
#919Semiconductor device
#920Method for reducing chip warpage
#921Multi-chip package module and a doped polysilicon trench for isolation and connection
#922Reduction of etch microloading for through silicon vias
#923Conductive bumps, wire loops, and methods of forming the same
#924Implementing selective rework for chip stacks and silicon carrier assemblies
#925Method of manufacturing printed wiring board
#926SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND
#927Die connection monitoring system and method
#928Semiconductor package with an embedded printed circuit board and stacked die
#929Semiconductor apparatus including resin case
#930Method for manufacturing a semiconductor device using an Al-Zn connecting material
#931CIRCUIT MODULE
#932Thermally and electrically enhanced ball grid array package
#933CONNECTING STRUCTURE, CIRCUIT DEVICE AND ELECTRONIC APPARATUS
#934Semiconductor device having semiconductor substrate, and method of manufacturing the same
#935Protection film having a plurality of openings above an electrode pad
#936Semiconductor device with lead terminals having portions thereof extending obliquely
#937Semiconductor device with heat spreader
#938Package for a light emitting element
#939Method of manufacturing semiconductor device, and bonding apparatus
#940Stacked memory module and system
#941Cut-edge positioning type soldering structure and method for preventing pin deviation
#942Electrical microfilament to circuit interface
#943Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#944Three-dimensional semiconductor integrated circuit
#945Semiconductor package having gap-filler injection-friendly structure
#946Semiconductor chip having staggered arrangement of bonding pads
#947Electrode pad having a recessed portion
#948Stack type semiconductor package
#949Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#950Multi-chip stack package structure
#951Multi-chip stack package structure
#952Multi-chip stack package structure
#953Semiconductor device, a method of manufacturing the same and an electronic device
#954Etched surface mount islands in a leadframe package
#955Combined packaged power semiconductor device
#956Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus
#957PACKAGED LEDS WITH PHOSPHOR FILMS, AND ASSOCIATED SYSTEMS AND METHODS
#958INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
#959Adhesive resin compositions, and laminates and flexible printed wiring boards using same
#960Semiconductor device and method of forming flipchip interconnection structure with bump on partial pad
#961STACK-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#962Thermal interface material with support structure
#963STACKED CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD
#964Copper bump structures having sidewall protection layers
#965Semiconductor device and manufacturing method thereof
#966WAFER LEVEL DIODE PACKAGE STRUCTURE
#967MULTILAYER PRINTED WIRING BOARD
#968Method for the miniaturizable contacting of insulated wires
#969Through-silicon via structure and method for making the same
#970Semiconductor device, and manufacturing method therefor
#971Millimeter wave multi-layer packaging including an RFIC cavity and a radiating cavity therein
#972Surface mountable device
#973POWER SEMICONDUCTOR DEVICE
#974SEMICONDUCTOR DEVICE
#975Pad configurations for an electronic package assembly
#976Semiconductor device and production method thereof
#977INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
#978Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
#979Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#980Sensor module and method for producing sensor modules
#981Semiconductor light emitting device
#982AC switch having compound semiconductor MOSFETs
#983Method of manufacturing wiring board
#984Solder joints with enhanced electromigration resistance
#985Semiconductor package having a cooling fan and method of fabricating the same
#986Liquid discharge head and manufacturing method therefor
#987Microelectronic packages having cavities for receiving microelectronic elements
#988Package stacking through rotation
#989Chip package having a chip combined with a substrate via a copper pillar
#990Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
#991INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF
#992SOLDER JOINTS WITH ENHANCED ELECTROMIGRATION RESISTANCE
#993RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
#994Activation treatments in plating processes
#995Method for fabricating chip elements provided with wire insertion grooves
#996Semiconductor device including semiconductor elements mounted on base plate
#997Method for device packaging
#998Electrical connections for multichip modules
#999Microelectronic assembly with joined bond elements having lowered inductance
#1000Integrated circuit packaging system with dual side connection and method of manufacture thereof
#1001Leadless package system having external contacts
#1002Leadless integrated circuit packaging system and method of manufacture thereof
#1003Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
#1004Semiconductor apparatus and power supply circuit
#1005Semiconductor device including external connection pads and test pads
#1006Etch isolation LPCC/QFN strip
#1007Socket connector assembly with compressive contacts
#1008WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1009Stacked electronic component and manufacturing method thereof
#1010Magnetic microelectronic device attachment
#1011COPPER-MANGANESE BONDING STRUCTURE FOR ELECTRONIC PACKAGES
#1012Adhesive composition
#1013Circuitry and Method for Encapsulating the Same
#1014Semiconductor Package
#1015Method of fabricating bump structure
#1016Chip package device and manufacturing method thereof
#1017Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material
#1018Power Electronic Device Package
#1019Semiconductor Device with Circuit for Reduced Parasitic Inductance
#1020Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
#1021Thin film light emitting diode
#1022Magnetic attachment structure
#1023Ventilating apparatus
#1024Ventilating apparatus
#1025Method of manufacturing a printed circuit board (PCB)
#1026CIRCUIT DEVICE AND MANUFACTURING METHOD THEREFOR
#1027Semiconductor package having an antenna with reduced area and method for fabricating the same
#1028ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESSES AND OXIDATION OF METALS AND ALLOYS
#1029Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#1030Interdigitated conductive support for GaN semiconductor die
#1031Apparatus for applying solder to semiconductor chips using decals with aperatures present therein
#1032Isolating wire bonding in integrated electrical components
#1033Semiconductor device and a manufacturing method of the same
#1034CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL
#1035Wire bond interconnection and method of manufacture thereof
#1036Semiconductor chip with post-passivation scheme formed over passivation layer
#1037Isolated wire bond in integrated electrical components
#1038Cutting blade for a wire bonding system
#1039Method of mounting devices in substrate and device-mounting substrate structure thereof
#1040Photosensitive composition
#1041Power switch component having improved temperature distribution
#1042Semiconductor device
#1043Semiconductor device with stacked semiconductor chips
#1044Semiconductor device having double side electrode structure
#1045Integrated circuits with multiple I/O regions
#1046Cu pillar bump with electrolytic metal sidewall protection
#1047Power semiconductor device packaging
#1048Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height
#1049APPARATUS FOR MONITORING BONDING SURFACE BOUNCING, WIRE BONDING APPARATUS HAVING THE SAME AND METHOD FOR MONITORING BONDING SURFACE BOUNCING
#1050Semiconductor device fabricating method and fabricating apparatus
#1051Semiconductor memory device
#1052Integrated Circuit Package Having Under-Bump Metallization
#1053Wafer level die integration and method therefor
#1054Routing layer for mitigating stress in a semiconductor die
#1055Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1056Chip package structure and method of making the same
#1057Semiconductor device
#1058High performance sub-system design and assembly
#1059Manufacturing method for electronic devices
#1060Semiconductor device capable of switching operation modes
#1061Method of manufacturing multi-layer printed circuit board
#1062Method of manufacturing multi-layer printed circuit board
#1063Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#1064STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
#1065Thru silicon enabled die stacking scheme
#1066Process for making a semiconductor system
#1067Leadframe package for high-speed data rate applications
#1068Method of manufacturing a multilayered printed wiring board
#1069Wire bonding structure of semiconductor device and wire bonding method
#1070Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
#1071SEMICONDUCTOR DEVICE
#1072Semiconductor device packages including connecting elements
#1073SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE
#1074SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#1075Die level integrated interconnect decal manufacturing method and apparatus
#1076Chipstack package and manufacturing method thereof
#1077Semiconductor device
#1078Through-wafer interconnects for photoimager and memory wafers
#1079SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
#1080Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#1081Wafer level integrated interconnect decal and manufacturing method thereof
#1082Semiconductor device
#1083SEMICONDUCTOR DEVICE
#1084Semiconductor device package having a jumper chip and method of fabricating the same
#1085Integrated circuit packaging system with interconnect and method of manufacture thereof
#1086Semiconductor device and lead frame
#1087Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#1088Integrated circuit having a semiconductor substrate with barrier layer
#1089Micro-fluidic injection molded solder (IMS)
#1090Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#1091Method of fabricating stacked packages with bridging traces
#1092Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making the same
#1093METHOD AND STRUCTURES OF A MINIATURIZED LINE LAMP
#1094MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA
#1095Silicon substrate for package
#1096Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
#1097Semiconductor substrate and semiconductor chip
#1098Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same
#1099Method of manufacturing substrates having asymmetric buildup layers
#1100Method of fabricating a capillary-flow underfill compositions
#1101Method of sensing magnitude of current through semiconductor power device
#1102Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#1103Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#1104METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#1105CONNECTING PAD PRODUCING METHOD
#1106SEMICONDUCTOR DEVICE
#1107Thin package system with external terminals and method of manufacture thereof
#1108Semiconductor device capable of switching operation mode and operation mode setting method therefor
#1109Printed wiring board
#1110Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns
#1111Microelectronic workpieces with stand-off projections and methods for manufacturing microelectronic devices using such workpieces
#1112Carbon nanotubes for the selective transfer of heat from electronics
#1113Semiconductor device having IPD structure with smooth conductive layer and bottom-side conductive layer
#1114Multi-chip package with improved signal transmission
#1115Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts
#1116Light emitting device
#1117Two-shelf interconnect
#1118Power device packages having thermal electric modules using peltier effect and methods of fabricating the same
#1119Semiconductor device assemblies
#1120Method for mounting a component
#1121Flip chip mounting method and bump forming method
#1122Semiconductor device and process for fabricating the same
#1123METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
#1124Semiconductor device including stacked semiconductor chips
#1125Led lead frame structure
#1126Wiring board and liquid crystal display device
#1127RFID integrated circuit with integrated antenna structure
#1128METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE
#1129MOS transistor device in common source configuration
#1130Solder alloy and semiconductor device
#1131Semiconductor device and electronic device
#1132Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#1133Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#1134Light emitting diode with metal piles and multi-passivation layers and its manufacturing method
#1135Semiconductor chip with a bonding pad having contact and test areas
#1136Flux-free chip to wafer joint serial thermal processor arrangement
#1137Rule-based semiconductor die stacking and bonding within a multi-die package
#1138Semiconductor element and display device provided with the same
#1139Pillar structure having a non-planar surface for semiconductor devices
#1140SEMICONDUCTOR PACKAGE
#1141Stacked semiconductor package
#1142Semiconductor package of a flipped MOSFET and its manufacturing method
#1143LEAD FRAME FOR SEMICONDUCTOR DIE
#1144Micro-fluidic injection molded solder (IMS)
#1145Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
#1146Method to form solder deposits on substrates
#1147Semiconductor device
#1148Interconnection tape providing a serial electrode pad connection in a semiconductor device
#1149Integrated circuit packaging system having dual sided connection and method of manufacture thereof
#1150Component stacking using pre-formed adhesive films
#1151GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#1152LED package
#1153Semiconductor package structure
#1154LED assembly with a protective frame
#1155LED PACKAGE
#1156Method of manufacturing a semiconductor device
#1157ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE
#1158Interconnection structure and its design method
#1159Semiconductor device structures and electronic devices including same hybrid conductive vias
#1160Semiconductor device
#1161Co-axial restraint for connectors within flip-chip packages
#1162Multi-chip package having frame interposer
#1163Semiconductor device
#1164Wireless chip and electronic device having wireless chip
#1165Chip packaging with metal frame pin grid array
#1166SEMICONDUCTOR MEMORY DEVICE
#1167Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#1168Semiconductor device and a method of manufacturing the same
#1169Semiconductor integrated circuit
#1170Semiconductor device having conductive pads and a method of manufacturing the same
#1171Semiconductor device and manufacturing method thereof
#1172Dual die semiconductor package
#1173EMI shielding package structure and method for fabricating the same
#1174Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#1175Coated light emitting device and method for coating thereof
#1176Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#1177System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#1178Electronic devices and components for high efficiency power circuits
#1179WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE
#1180Dual Interconnection in Stacked Memory and Controller Module
#1181Grid array connection device and method
#1182Semiconductor device sealed in a resin section and method for manufacturing the same
#1183SEMICONDUCTOR DEVICE
#1184Attaching passive components to a semiconductor package
#1185Integrated Circuit Module and Multichip Circuit Module Comprising an Integrated Circuit Module of This Type
#1186Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
#1187Manufacturing method of lead frame substrate and semiconductor apparatus
#1188Die package including multiple dies and lead orientation
#1189Method for establishing and closing a trench of a semiconductor component
#1190Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#1191Semiconductor device including a DC-DC converter having a metal plate
#1192System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
#1193System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#1194Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#1195Contact equipment and circuit package
#1196Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
#1197Flexible interposer for stacking semiconductor chips and connecting same to substrate
#1198Semiconductor package having buss-less substrate
#1199Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device
#1200SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME