209543 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area; External layer Material
Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#1802Multi-chip packages including extra memory chips to define additional logical packages and related devices
#1803Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1804IO cell with multiple IO ports and related techniques for layout area saving
#1805Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#1806PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF
#1807Thermal interface material with support structure
#1808Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1809SEMICONDUCTOR DEVICE
#1810Integrated circuit packaging system with an interposer and method of manufacture thereof
#1811INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF
#1812Semiconductor device and wire bonding method
#1813Package Level Tuning Techniques for Propagation Channels of High-Speed Signals
#1814SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE
#1815Semiconductor device having finger electrodes
#1816Package substrate with a cavity, semiconductor package and fabrication method thereof
#1817Apparatus and method for manufacturing semiconductor device
#1818METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1819Method for manufacturing capacitor embedded in interposer
#1820Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
#1821Package substrate
#1822Imaging device
#1823SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM
#1824Semiconductor device
#1825Microelectronic assembly with impedance controlled wirebond and conductive reference element
#1826Microelectronic assemblies having compliancy and methods therefor
#1827Wire loop and method of forming the wire loop
#1828Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#1829Warp-suppressed semiconductor device
#1830Semiconductor Carrier for Multi-Chip Packaging
#1831Semiconductor device which can transmit electrical signals between two circuits
#1832HIGH ELECTRON MOBILITY FIELD EFFECT TRANSISTOR (HEMT) DEVICE
#1833LAMP AND PRODUCTION METHOD OF LAMP
#1834Electrical interconnect forming method
#1835Electrical interconnect forming method
#1836BONDING METHOD AND BONDING DEVICE
#1837Conductive ball mounting apparatus and conductive ball mounting method
#1838Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element
#1839Electrical interconnect structure
#1840Printed circuit board and method of manufacturing printed circuit board
#1841Semiconductor device
#1842Wire bond interconnection
#1843Integrated circuit packaging system with stacked die and method of manufacture thereof
#1844Semiconductor apparatus and method of manufacturing semiconductor apparatus
#1845MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#1846Low Temperature Metal to Silicon Diffusion and Silicide Wafer Bonding
#1847Forming sacrificial composite materials for package-on-package architectures and structures formed thereby
#1848Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#1849Mounted body and method for manufacturing the same
#1850Lead and lead frame for power package
#1851THROUGH-SILICON VIA STRUCTURE AND METHOD FOR MAKING THE SAME
#1852Composition encapsulating optical semiconductor and optical semiconductor device using same
#1853Semiconductor device having a junction FET and a MISFET for control
#1854TCP-type semiconductor device
#1855Micro-fluidic injection molded solder (IMS)
#1856Module substrate and production method
#1857METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#1858Reversible leadless package and methods of making and using same
#1859Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#1860Method and apparatus for ultra thin wafer backside processing
#1861Electronic substrate, semiconductor device, and electronic device
#1862Acoustic wave device
#1863Semiconductor device having shifted stacked chips
#1864Connecting terminals with conductive terminal-forming members having terminal portions extending in different directions
#1865SEMICONDUCTOR DEVICE
#1866CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME
#1867SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
#1868WINDOW TYPE SEMICONDUCTOR PACKAGE
#1869Complete power management system implemented in a single surface mount package
#1870Quad flat non-leaded package
#1871Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method
#1872Power management integrated circuit
#1873Nitride crystal with removable surface layer and methods of manufacture
#1874Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#1875Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate
#1876Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#1877Printed wiring board
#1878Stacked semiconductor devices including a master device
#1879Module having a stacked magnetic device and semiconductor device and method of forming the same
#1880ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD
#1881Chip and Transmitter for Wireless Communication System
#1882Solder bump UBM structure
#1883Stack package
#1884Stacked semiconductor package having reduced height
#1885Electronic device
#1886SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
#1887Bidirectional switch module
#1888Optical semiconductor device encapsulated with silicone resin
#1889Electromagnetic interference noise reduction board using electromagnetic bandgap structure
#1890Circuit board and structure using the same
#1891Module having a stacked magnetic device and semiconductor device and method of forming the same
#1892Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same
#1893Wiring board assembly and manufacturing method thereof
#1894Multilayer wiring substrate and method for manufacturing the same
#1895Wire bonding method and semiconductor device
#1896Semiconductor package with ribbon with metal layers
#1897Semiconductor package structure
#1898Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#1899Micro Ball Feeding Method
#1900Method of stiffening coreless package substrate
#1901Quad flat package with exposed common electrode bars
#1902Semiconductor apparatus with decoupling capacitor
#1903Semiconductor device and wire bonding method
#1904Electronic component device, and method of manufacturing the same
#1905Micro-electro-mechanical system having movable element integrated into substrate-based package
#1906Thin film light emitting diode
#1907Wire bonding method, wire bonding apparatus, and wire bonding control program
#1908Wire bonding apparatus, record medium storing bonding control program, and bonding method
#1909PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)
#1910Method of refining solder materials
#1911Semiconductor device and method of manufacturing semiconductor device
#1912Method of manufacturing a semiconductor package with fine pitch lead fingers
#1913Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
#1914Wireless radio frequency signal transceiving system
#1915Carrier assembly for an integrated circuit
#1916Multi-layered semiconductor apparatus
#1917Electrically isolated vertical light emitting diode structure
#1918Semiconductor device and method for manufacturing semiconductor device
#1919Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips
#1920Semiconductor device and method of manufacturing the same, and electronic apparatus
#1921BGA package with leads on chip
#1922Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages
#1923THRU SILICON ENABLED DIE STACKING SCHEME
#1924Wavelength-converted semiconductor light emitting device
#1925Process for through silicon via filling
#1926Microelectronic package with thermal access
#1927Method of making semiconductor device packaged by sealing resin member
#1928Semiconductor device
#1929Composite sensor for detecting angular velocity and acceleration
#1930APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE TO BE TESTED
#1931Semiconductor device including stacked semiconductor chips
#1932Redistribution layer power grid
#1933WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO
#1934Flip chip interconnection having narrow interconnection sites on the substrate
#1935SEMICONDUCTOR MODULE
#1936Semiconductor device having a sealing body and partially exposed conductors
#1937Semiconductor device stack with bonding layer and wire retaining member
#1938Wafer Level package for heat dissipation and method of manufacturing the same
#1939Package-on-package using through-hole via die on saw streets
#1940SEMICONDUCTOR DEVICE
#1941Memory card and method for manufacturing memory card
#1942Semiconductor device
#1943Semiconductor device
#1944Package for an optical device
#1945Method of disposing an electronic device on an electrode formed on substrate
#1946Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
#1947METHOD OF FORMING CONNECTION TERMINAL
#1948Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
#1949METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE
#1950Manufacturing method of light-emitting diode
#1951SEMICONDUCTOR DEVICE
#1952Underbump metallization structure
#19533-D ICs equipped with double sided power, coolant, and data features
#1954WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1955Electrical connectivity for circuit applications
#1956Monolithic semiconductor switches and method for manufacturing
#1957Semiconductor device and production method therefor
#1958Lead pin for mounting semiconductor and printed wiring board
#1959CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME
#1960Method for producing a metal-ceramic substrate for electric circuits on modules
#1961Micro-machined structure production using encapsulation
#1962Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board
#1963Integrated circuit protection layer used in a capacitive capacity
#1964Composite substrate and elastic wave device using the same
#1965Semiconductor device and manufacturing method of the semiconductor device
#1966Semiconductor device and electronic apparatus equipped with the semiconductor device
#1967Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
#1968SEMICONDUCTOR DEVICE
#1969Semiconductor device including bonding pads and semiconductor package including the semiconductor device
#1970Wire bonding apparatus and wire bonding method
#1971Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#1972Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same
#1973Laser bonding for stacking semiconductor substrates
#1974Substrate having optional circuits and structure of flip chip bonding
#1975SEMICONDUCTOR DEVICE
#1976Wafer level vertical diode package structure and method for making the same
#1977Semiconductor device including wires connecting electrodes to an inner lead
#1978Semiconductor device with lead terminals having portions thereof extending obliquely
#1979Power module package having excellent heat sink emission capability and method for manufacturing the same
#1980Integrated circuit package-on-package stacking system
#1981Microelectromechanical apparatus and method for producing the same
#1982Semiconductor device with circuit for reduced parasitic inductance
#1983Semiconductor light emitting device
#1984EXTRA HIGH BANDWIDTH MEMORY DIE STACK
#1985ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME
#1986PACKAGED POWER SWITCHING DEVICE
#1987Through-wafer interconnects for photoimager and memory wafers
#1988SEMICONDUCTOR DEVICE
#1989Semiconductor device
#1990Three-dimensional package
#1991Semiconductor device with output circuit arrangement
#1992Thin film light emitting diode
#1993Integrated array transmit/receive module
#1994METHOD FOR FABRICATING A SEMICONDUCTOR CHIP DEVICE HAVING THROUGH-SILICON-VIA (TSV)
#1995Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace
#1996Method of manufacturing semiconductor device
#1997Light emitting diode lamp
#1998Semiconductor package and plasma display device including the same
#1999Memory card and method for manufacturing the same
#2000Illumination system
#2001METHOD OF EVALUATING THE FLAME RETARDANCY OF SEALING RESIN AND TEST SAMPLE FOR EVALUATION OF FLAME RETARDANCY
#2002Through-hole electrode substrate and method of manufacturing the same
#2003Through-silicon via with air gap
#2004Semiconductor device
#2005Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips
#2006Structures and methods for improving solder bump connections in semiconductor devices
#2007Semiconductor device
#2008Semiconductor device and method of confining conductive bump material during reflow with solder mask patch
#2009Structures and methods for improving solder bump connections in semiconductor devices
#2010System-in-package packaging for minimizing bond wire contamination and yield loss
#2011SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP
#2012PROTECTIVE THIN FILM COATING IN CHIP PACKAGING
#2013Semiconductor device
#2014Semiconductor device and method of manufacturing same
#2015Stacked semiconductor package
#2016Semiconductor optical sensor element and method of producing the same
#2017Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace
#2018Light emitting diode
#2019Bonding inspection structure
#2020Printed wiring board and method for manufacturing printed wiring board
#2021Package carrier
#2022SUBSTRATE EMBEDDED WITH PASSIVE DEVICE
#2023METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#2024METHOD FOR MANUFACTURING WIRING BOARD WITH BUILT-IN COMPONENT
#2025Attachment using magnetic particle based solder composites
#2026LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
#2027Electric power converter
#2028Electrical assembly
#2029Memory card and memory card manufacturing method
#2030Grid array packages
#2031Semiconductor device
#2032Pad layout structure of semiconductor chip
#2033LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS
#2034Solder joints with enhanced electromigration resistance
#2035SEMICONDUCTOR DEVICE
#2036Wafer structure with conductive bumps and fabrication method thereof
#2037Method of thinning a semiconductor substrate
#2038Molding compound including a carbon nano-tube dispersion
#2039Stackable semiconductor device assemblies
#2040Semiconductor package and manufacturing method of the same
#2041Integrated circuit packaging system substrates and method of manufacture thereof
#2042Microball assembly methods, and packages using maskless microball assemblies
#2043Semiconductor apparatus
#2044Stacked semiconductor package, semiconductor package module and method of manufacturing the stacked semiconductor package
#2045High-density multifunctional PoP-type multi-chip package structure
#2046Package for electronic component, manufacturing method thereof and sensing apparatus
#2047Semiconductor chip assembly with post/base heat spreader and cavity in post
#2048Light emitting diode and method for manufacturing the same
#2049Standing transparent mirrorless light emitting diode
#2050Semiconductor integrated circuit
#2051Wire bonding method
#2052Printed wiring board
#2053Fine wiring package and method of manufacturing the same
#2054Printed wiring board and method for manufacturing the same
#2055Semiconductor device and manufacturing method of a semiconductor device
#2056Buried via technology for three dimensional integrated circuits
#2057Fabricating process of a chip package structure
#2058LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT
#2059Electronic component built-in substrate and method of manufacturing the same
#2060Flip chip mounting process and flip chip assembly
#2061Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#2062Stacked die parallel plate capacitor
#2063Wire bonding method and semiconductor device
#2064Grid array connection device and method
#2065Semiconductor device and method for fabricating the same
#2066Semiconductor device and method for fabricating the same
#2067Grid array packages and assemblies including the same
#2068Semiconductor device and method for manufacturing the same
#2069Leadless package housing having a symmetrical construction with deformation compensation
#2070Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#2071Semiconductor device having a mounting substrate with a capacitor interposed therebetween
#2072SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE AND ITS MANUFACTURING METHOD
#2073Light emitting device and method for manufacturing same
#2074Semiconductor device
#2075Detector
#2076Method of forming bends in a wire loop
#2077Method of manufacturing semiconductor devices
#2078Method for fabricating flip-attached and underfilled semiconductor devices
#2079Integrated circuit packaging system and method of manufacture thereof
#2080Die assemblies
#2081COPPER-CLAD LAMINATE WITH CAPACITOR, PRINTED CIRCUIT BOARD HAVING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE PRINTED CIRCUIT BOARD
#2082Image sensor camera module including a protruding portion and method of manufacturing the same
#2083Display driver integrated circuit device, film, and module
#2084Method and apparatus for making a radio frequency inlay
#2085SEMICONDUCTOR DEVICE
#2086SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL
#2087Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
#2088Device
#2089DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE
#2090Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#2091Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices
#2092Semiconductor package with semiconductor core structure and method of forming same
#2093STACKED CHIP, MICRO-LAYERED LEAD FRAME SEMICONDUCTOR PACKAGE
#2094Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound
#2095Component stacking using pre-formed adhesive films
#2096Large die package structures and fabrication method therefor
#2097Leadless integrated circuit packaging system and method of manufacture thereof
#2098Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof
#2099Integrated circuit packaging system with stacked paddle and method of manufacture thereof
#2100Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure