209545 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas Structure
Sub-classes:SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#2CIRCUIT BOARD, IMAGE FORMING APPARATUS, MOUNTING METHOD ONTO CIRCUIT BOARD, AND METHOD OF MANUFACTURING PLURALITY OF IMAGE FORMING APPARATUS
#3SEMICONDUCTOR DEVICE
#4DISPLAY DEVICE
#5Solid-state imaging device and electronic apparatus
#6Dual bond pad structure for photonics
#7Die stack structure and method of fabricating the same
#8Method for self-aligned solder reflow bonding and devices obtained thereof
#9Dual bond pad structure for photonics
#10Air trench in packages incorporating hybrid bonding
#11Semiconductor device and manufacturing method of semiconductor device
#12Hybrid bonding with air-gap structure
#13Air trench in packages incorporating hybrid bonding
#14Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad
#15Hybrid bonding with air-gap structure
#16VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
#17Substrate structure and fabrication method thereof
#18Semiconductor device and manufacturing method thereof
#19Semiconductor device
#20Method for producing contact areas on a semiconductor substrate
#21Crack arrest vias for IC devices