H01L2224/065 - CPC Classification Index

ClassID:

209553 ⎘

H01L2224/065 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas Material

Sub-classes:

H01L2224/06505 » Bonding areas having different materials 86

Recent Application in this class:

20260005172

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

20250105166

Semiconductor structure and alignment method thereof

20240062819

NONVOLATILE MEMORY DEVICE AND MEMORY PACKAGE INCLUDING THE SAME

20180019124

Metal-metal direct bonding method

20170317042

Multi-layer metal pads

20160240501

Reduced volume interconnect for three-dimensional chip stack

20160233182

Semiconductor packaging structure having stacked seed layers

20160049377

Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same

20150123253

Semiconductor device and die bonding structure thereof

20150054019

Semiconductor device having electrode interconnections within a conductive adhesive

20150014848

Semiconductor device and fabrication method thereof