209555 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas Function
Sub-classes:SEMICONDUCTOR PACKAGE
#2Structure of semiconductor device
#3Semiconductor Device and Method of Disposing Electrical Components Above and Below Substrate
#4Multi-chip package structure having dummy pad disposed between input/output units
#5Multi-chip package structure having dummy pad disposed between input/output units
#6Structure of semiconductor device and method for bonding two substrates
#7Semiconductor device
#8Electronic circuit unit and method of manufacturing electronic circuit unit