209558 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area
Sub-classes:Semiconductor device
#2Semiconductor apparatus and equipment
#3Electronic system having increased coupling by using horizontal and vertical communication channels
#4Electronic system having increased coupling by using horizontal and vertical communication channels
#5Flattened substrate surface for substrate bonding
#6Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding