209560 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area Shape
Sub-classes:CHIP STRUCTURE
#2Chip structure and method for forming the same
#3Power package module of multiple power chips and method of manufacturing power chip unit
#4Package having substrate with embedded metal trace overlapped by landing pad
#5Package having substrate with embedded metal trace overlapped by landing pad
#6Solid-state imaging element, method for manufacturing solid-state imaging element, and electronic device