H01L2224/08505 - CPC Classification Index

ClassID:

209571 ⎘

H01L2224/08505 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of an individual bonding area; Material outside the bonding interface

Recent Application in this class:

20230038603

2023-02-09

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

20160372437

2016-12-22

SEMICONDUCTOR PACKAGE

20160351540

2016-12-01

Semiconductor device and manufacturing method of semiconductor device

20050275096

2005-12-15

Pre-doped reflow interconnections for copper pads