209581 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas Material
Sub-classes:ELECTRONIC DEVICE
#2Semiconductor device and method for production of semiconductor device
#3Semiconductor device and method for production of semiconductor device
#4Semiconductor device and method for production of semiconductor device
#5Semiconductor device and method for production of semiconductor device
#6Method for producing a chip assemblage
#7Semiconductor device and method of manufacturing semiconductor device
#8Semiconductor device and method for production of semiconductor device
#9SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#10Chip mounting structure and manufacturing method therefor
#11Leadless semiconductor package with optical inspection feature
#12Apparatus and methods for reducing impact of high RF loss plating
#13Semiconductor device with a connection pad in a substrate and method for production thereof
#14Apparatus and methods for reducing impact of high RF loss plating
#15Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device