209582 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas; Material Bonding areas having different materials
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
#2STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
#3SEMICONDUCTOR DEVICE
#4PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
#5Method for forming semiconductor device structure with conductive polymer liner
#6Microelectronic assemblies with inductors in direct bonding regions
#7Semiconductor device structure with conductive polymer liner and method for forming the same
#8Semiconductor with external electrode
#9Electronics package having a self-aligning interconnect assembly and method of making same
#10Adjustable losses on bond wire arrangement
#11Semiconductor device with solders of different melting points and method of manufacturing
#12Adjustable losses of bond wire arrangement
#13Semiconductor device and manufacturing method therefor
#14Electronics package having a self-aligning interconnect assembly and method of making same