209612 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the bump connector in liquid form Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
SOLDER BALL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME
#2SELF-HEALING SOLDER INTERCONNECTION
#3INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
#4BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
#5INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
#6SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
#7Injection molded solder head with improved sealing performance
#8Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#9Method for discharging fluid
#10EXPANDED HEAD PILLAR FOR BUMP BONDS
#11Microelectronic devices including redistribution layers
#12Method of forming a solder bump structure
#13Fabrication of solder balls with injection molded solder
#14Method of forming a solder bump structure
#15Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#16Wafer level flat no-lead semiconductor packages and methods of manufacture
#17Wafer level flat no-lead semiconductor packages and methods of manufacture
#18Wafer level flat no-lead semiconductor packages and methods of manufacture
#19Method for correcting solder bump
#20Expanded head pillar for bump bonds
#21Industrial chip scale package for microelectronic device
#22METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
#23Semiconductor chip, method for manufacturing semiconductor chip, integrated circuit device, and method for manufacturing integrated circuit device
#24Fluid discharge device
#25Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process
#26Integrated circuit system with carrier construction configuration and method of manufacture thereof
#27Injection molded solder bumping
#28Fabrication of solder balls with injection molded solder
#29Microelectronic package structures including redistribution layers
#30Wafer level flat no-lead semiconductor packages and methods of manufacture
#31SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#32Fabrication of solder balls with injection molded solder
#33Fabrication of solder balls with injection molded solder
#34BONDING METHOD AND BONDED BODY
#35SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#36Chip mounting structure
#37Method of forming a solder bump structure
#38Engineered polymer-based electronic materials
#39Fluid discharge device, fluid discharge method, and fluid application device
#40Integrated system and method of making the integrated system
#41Electrical connecting structure between a substrate and a semiconductor chip
#42Method of manufacturing electronic component module and electronic component module
#43Method for manufacturing metal powder
#44Chip mounting structure
#45Methods of fabricating a semiconductor package structure including at least one redistribution layer
#46Direct injection molded solder process for forming solder bumps on wafers
#47Fabricating pillar solder bump
#48Wafer level flat no-lead semiconductor packages and methods of manufacture
#49Integrated system and method of making the integrated system
#50Mechanically anchored backside C4 pad
#51Assembly bonding
#52Chip stack with electrically insulating walls
#53Electronic component-mounted structure, IC card and COF package
#54CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
#55Semiconductor package and method of fabricating the same
#56Copper post solder bumps on substrates
#57Solder bump forming method and apparatus
#58Copper post solder bumps on substrates
#59Component built-in board and method of manufacturing the same, and component built-in board mounting body
#60Wafer-level package device having high-standoff peripheral solder bumps
#61Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#62Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
#63Direct injection molded solder process for forming solder bumps on wafers
#64Method of manufacturing electronic component module and electronic component module
#65Integrated system and method of making the integrated system
#66Microspring structures adapted for target device cooling
#67Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump
#68Injection molded solder process for forming solder bumps on substrates
#69Injection molded solder process for forming solder bumps on substrates
#70Copper post solder bumps on substrate
#71Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#72Wafer level package (WLP) device having bump assemblies including a barrier metal
#73Method and apparatus of manufacturing functionally gradient material
#74Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#75Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress
#76SOLDER SUPPLYING METHOD
#77Device having a bonding structure for two elements
#78Method for forming reinforced interconnects on a substrate
#79METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY
#80Methods of bonding two semiconductor devices
#81Methods relating to forming interconnects
#82Semiconductor component assemblies having interconnects
#83Methods relating to forming interconnects and resulting assemblies
#84Fabrication of solder balls with injection molded solder