H01L2224/10 - CPC Classification Index

ClassID:

209585 ⎘

H01L2224/10 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto Bump connectors; Manufacturing methods related thereto

Sub-classes:

H01L2224/1012 » Auxiliary members for bump connectors, e.g. spacers 21
H01L2224/11 » Manufacturing methods 1,1K
H01L2224/12 » Structure, shape, material or disposition of the bump connectors prior to the connecting process 7
H01L2224/15 » Structure, shape, material or disposition of the bump connectors after the connecting process 3

Recent Application in this class:

20210375725

2021-12-02

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

20210074625

2021-03-11

Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions

20200355958

2020-11-12

Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability

20200295029

2020-09-17

Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same

20200066745

2020-02-27

Three-dimensional memory device having bonding structures connected to bit lines and methods of making the same

20190348332

2019-11-14

Method of manufacturing semiconductor device

20190189837

2019-06-20

Vertical type light emitting diode die and method for fabricating the same

20190189836

2019-06-20

Vertical type light emitting diode die and method for fabricating the same

20190172845

2019-06-06

Array Structure, Manufacturing Method Thereof, Array Substrate and Display Device

#10

20190057913

2019-02-21

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

#11

20180358323

2018-12-13

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#12

20180358322

2018-12-13

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#13

20180358321

2018-12-13

PRESSING SOLDER BUMPS TO MATCH PROBE PROFILE DURING WAFER LEVEL TESTING

#14

20180315674

2018-11-01

Package process method including disposing a die within a recess of a one-piece material

#15

20180175113

2018-06-21

Semiconductor device having a protruding interposer edge face

#16

20180145001

2018-05-24

Manufacturing method of semiconductor device

#17

20180102470

2018-04-12

Cryogenic electronic packages and assemblies

#18

20180102469

2018-04-12

Cryogenic electronic packages and methods for fabricating cryogenic electronic packages

#19

20170077574

2017-03-16

Flip-chip employing integrated cavity filter, and related components, systems, and methods

#20

20170025343

2017-01-26

Circuit substrate, semiconductor package and process for fabricating the same

#21

20160336244

2016-11-17

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

#22

20160284570

2016-09-29

Encapsulated dies with enhanced thermal performance

#23

20160284568

2016-09-29

Encapsulated dies with enhanced thermal performance

#24

20160276367

2016-09-22

Array structure, manufacturing method thereof, array substrate and display device

#25

20160079304

2016-03-17

Method for fabricating an image sensor package

#26

20150156882

2015-06-04

PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE

#27

20140361299

2014-12-11

Semiconductor device

#28

20140293547

2014-10-02

Circuit substrate, semiconductor package and process for fabricating the same

#29

20140264692

2014-09-18

Low profile sensor module and method of making same

#30

20140231991

2014-08-21

Method of fabricating three dimensional integrated circuit

#31

20140218998

2014-08-07

Semiconductor package

#32

20140061900

2014-03-06

Semiconductor package with improved redistribution layer design and fabricating method thereof

#33

20130277829

2013-10-24

Method of fabricating three dimensional integrated circuit

#34

20130256895

2013-10-03

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

#35

20130133928

2013-05-30

Printed circuit board including a plurality of circuit layers and method for manufacturing the same

#36

20120077310

2012-03-29

Manufacturing method of semiconductor device

#37

20110186978

2011-08-04

STACK PACKAGE

#38

20090309178

2009-12-17

Image sensor package and fabrication method thereof

#39

20090243118

2009-10-01

Semiconductor device and manufacturing method of the same

#40

20090186449

2009-07-23

Method for fabricating package structures for optoelectronic devices

#41

20090181490

2009-07-16

Image sensing devices and methods for fabricating the same

#42

20090166667

2009-07-02

Substrate for light-emitting diode, and light-emitting diode

#43

20090032893

2009-02-05

Image sensor package

#44

20090001495

2009-01-01

Image sensor package and fabrication method thereof

#45

20080290438

2008-11-27

Image sensing devices and methods for fabricating the same

#46

20080191343

2008-08-14

Integrated circuit package having large conductive area and method for fabricating the same

#47

20080169477

2008-07-17

Package structure for optoelectronic device and fabrication method thereof

#48

20080164550

2008-07-10

Electronic assembly for image sensor device and fabrication method thereof

#49

20080106356

2008-05-08

Ball grid array resonator

#50

20080023639

2008-01-31

Ultraviolet Irradiation Apparatus

#51

20070145590

2007-06-28

Semiconductor device and manufacturing method of the same

#52

20070117277

2007-05-24

Methods for fabricating protective layers on semiconductor device components

#53

20070107186

2007-05-17

Method and system for high volume transfer of dies to substrates

#54

20060246702

2006-11-02

NON-SOLDER MASK DEFINED (NSMD) TYPE WIRING SUBSTRATE FOR BALL GRID ARRAY (BGA) PACKAGE AND METHOD FOR MANUFACTURING SUCH A WIRING SUBSTRATE

#55

20050156331

2005-07-21

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

#56

20050039944

2005-02-24

Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate

#57

14853802

2016-09-13

Flip-chip employing integrated cavity filter, and related components, systems, and methods