H01L2224/11332 - CPC Classification Index

ClassID:

209616 ⎘

H01L2224/11332 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the bump connector in solid form using a powder

Recent Application in this class:

20230178506

2023-06-08

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION APPARATUS

20200294942

2020-09-17

Method and apparatus for heat sinking high frequency IC with absorbing material

20190148328

2019-05-16

Method of manufacturing chip-on-chip structure comprising sinterted pillars

20190148320

2019-05-16

Electronic element and electronic device comprising the same

20190109101

2019-04-11

Method and apparatus for heat sinking high frequency IC with absorbing material

20190084097

2019-03-21

Flux, solder paste, and method for forming solder bump

20180374813

2018-12-27

Assembly comprising hybrid interconnecting means including intermediate interconnecting elements and sintered metal joints, and manufacturing process

20180361517

2018-12-20

High temperature solder paste

20180151529

2018-05-31

Solder in cavity interconnection structures

#10

20180029169

2018-02-01

Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device

#11

20170278818

2017-09-28

High temperature solder paste

#12

20170144221

2017-05-25

Sintering materials and attachment methods using same

#13

20170062318

2017-03-02

Sintered conductive matrix material on wire bond

#14

20170033069

2017-02-02

DRY-REMOVABLE PROTECTIVE COATINGS

#15

20170033068

2017-02-02

Formation of solder and copper interconnect structures and associated techniques and configurations

#16

20160365328

2016-12-15

Chip-on-chip structure and methods of manufacture

#17

20160329295

2016-11-10

Semiconductor-mounted product and method of producing the same

#18

20160247785

2016-08-25

Magnetic contacts

#19

20160181217

2016-06-23

Formation of solder and copper interconnect structures and associated techniques and configurations

#20

20160086905

2016-03-24

Shaped and oriented solder joints

#21

20160035688

2016-02-04

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

#22

20150357311

2015-12-10

Magnetic contacts

#23

20150357304

2015-12-10

Flip chip assembly and process with sintering material on metal bumps

#24

20150270247

2015-09-24

Semiconductor packages and methods of forming the same

#25

20150221602

2015-08-06

Flip-chip hybridisation of two microelectronic components using a UV anneal

#26

20150187727

2015-07-02

Solder in cavity interconnection structures

#27

20150072479

2015-03-12

Ablation method and recipe for wafer level underfill material patterning and removal

#28

20140353815

2014-12-04

Semiconductor die assemblies and semiconductor devices including same

#29

20140295619

2014-10-02

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

#30

20140035134

2014-02-06

Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages

#31

20140017823

2014-01-16

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

#32

20140010991

2014-01-09

Solder transfer substrate, manufacturing method of solder transfer substrate, and solder transfer method

#33

20140004697

2014-01-02

Method of manufacturing semiconductor packaging

#34

20130181041

2013-07-18

Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate

#35

20130140344

2013-06-06

Solder ball mounting tool

#36

20130128484

2013-05-23

Solder in cavity interconnection structures

#37

20130070436

2013-03-21

Systems and methods for high aspect ratio flip-chip interconnects

#38

20130026643

2013-01-31

Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication

#39

20130001757

2013-01-03

Flip-chip QFN structure using etched lead frame

#40

20120313239

2012-12-13

Flip chip assembly and process with sintering material on metal bumps

#41

20120252164

2012-10-04

Method for manufacturing semiconductor device

#42

20120241965

2012-09-27

Solder in cavity interconnection structures

#43

20120211549

2012-08-23

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

#44

20120205796

2012-08-16

Semiconductor package and method for manufacturing the same

#45

20120156512

2012-06-21

Solder paste, joining method using the same and joined structure

#46

20120098143

2012-04-26

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

#47

20120009775

2012-01-12

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

#48

20110297433

2011-12-08

Solder bump formation on a circuit board using a transfer sheet

#49

20110284158

2011-11-24

Method and apparatus of manufacturing functionally gradient material

#50

20110272802

2011-11-10

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

#51

20110244192

2011-10-06

THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE

#52

20110233767

2011-09-29

Semiconductor device and semiconductor device manufacturing method

#53

20100314751

2010-12-16

Methods to fabricate integrated circuits by assembling components

#54

20100314718

2010-12-16

Processes and structures for beveled slope integrated circuits for interconnect fabrication

#55

20100297814

2010-11-25

Electronic system modules and method of fabrication

#56

20100264539

2010-10-21

Semiconductor device and method of manufacturing the same

#57

20100155923

2010-06-24

Microball assembly methods, and packages using maskless microball assemblies

#58

20100093131

2010-04-15

Bonding apparatus and bonding method

#59

20100089980

2010-04-15

Bonding apparatus and bonding method

#60

20100084764

2010-04-08

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

#61

20100007012

2010-01-14

Electronic assembly with electronic compontent and interconnection assembly connected via conductive bump and mating well

#62

20090272285

2009-11-05

Three-dimensional structures and methods of fabricating the same using a printing plate

#63

20090242121

2009-10-01

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT

#64

20090179333

2009-07-16

Solder contacts and methods of forming same

#65

20090091030

2009-04-09

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

#66

20090039507

2009-02-12

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

#67