H01L2224/11436 - CPC Classification Index

ClassID:

209629 ⎘

H01L2224/11436 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in solid form Lamination of a preform, e.g. foil, sheet or layer

Recent Application in this class:

20240014197

2024-01-11

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

20190348387

2019-11-14

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

20180218990

2018-08-02

Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure

20180174949

2018-06-21

Metal cored solder decal structure and process

20180033759

2018-02-01

Semiconductor packages and methods of packaging semiconductor devices

20170271295

2017-09-21

Electronic device and method for producing an electronic device

20170098597

2017-04-06

Die attachment for packaged semiconductor device

20160351522

2016-12-01

PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION

20160336287

2016-11-17

Semiconductor substrate and semiconductor package structure having the same

#10

20160118365

2016-04-28

Die attachment for packaged semiconductor device

#11

20150318251

2015-11-05

Metal cored solder decal structure and process

#12

20140264845

2014-09-18

Wafer-level package device having high-standoff peripheral solder bumps

#13

20140252607

2014-09-11

Reflow film, solder bump formation method, solder joint formation method, and semiconductor device

#14

20140035150

2014-02-06

Metal cored solder decal structure and process

#15

20130043585

2013-02-21

Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus

#16

20120319268

2012-12-20

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

#17

20120135201

2012-05-31

Semiconductor structures and method for fabricating the same

#18

20100047971

2010-02-25

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

#19

20070187840

2007-08-16

Nanoscale probes for electrophysiological applications

#20

20070001280

2007-01-04

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

#21

20050082669

2005-04-21

Electronic circuit device and porduction method therefor