209630 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by blanket deposition of the material of the bump connector in solid form using a powder
CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE
#2Method of manufacturing chip-on-chip structure comprising sinterted pillars
#3Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#4Solder in cavity interconnection technology
#5Electronic-component mounted body, electronic component, and circuit board
#6Micro bump and method for forming the same
#7Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#8Solder in cavity interconnection technology
#9Electrically conductive structure on a semiconductor substrate formed from printing
#10Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages
#11Self-assembled interconnection particles
#12Method of applying a pattern of particles to a substrate