209640 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods using a lift-off mask Multilayer masks
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE
#3METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR DEVICE, A PACKAGE SUBSTRATE, AND A SEMICONDUCTOR PACKAGE
#5Method for preparing indium pillar solder, chip substrate and chip
#6Finned contact
#7EXPANDED HEAD PILLAR FOR BUMP BONDS
#8Interconnect structures for preventing solder bridging, and associated systems and methods
#9Fabrication method of semiconductor structure
#10Interconnect structures for preventing solder bridging, and associated systems and methods
#11Expanded head pillar for bump bonds
#12Conical-shaped or tier-shaped pillar connections
#13Injection molded solder bumping
#14Directional deposition on patterned structures
#15Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
#16Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#17Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
#18Fabrication method of semiconductor structure
#19INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#20Interconnect structures and methods for fabricating interconnect structures
#21Pillar design for conductive bump
#22Magnetic intermetallic compound interconnect
#23Conical-shaped or tier-shaped pillar connections
#24Methods for forming pillar bumps on semiconductor wafers
#25Integrated WLUF and SOD process
#26Semiconductor structure and method of fabricating the same
#27Organic thin film passivation of metal interconnections
#28Shaped and oriented solder joints
#29Copper pillar sidewall protection
#30Copper pillar bump and flip chip package using same
#31Inductor structure and manufacturing method thereof
#32Pillar bumps and process for making same
#33Pillar design for conductive bump
#34Chip interposer, semiconductor device, and method for manufacturing a semiconductor device
#35Solder in cavity interconnection technology
#36Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
#37Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#38Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#39Organic thin film passivation of metal interconnections
#40Controlled collapse chip connection (C4) structure and methods of forming
#41Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages
#42Control of silver in C4 metallurgy with plating process
#43Integrated WLUF and SOD process
#44Integrated circuit package having offset vias
#45Shaped and oriented solder joints
#46Coaxial solder bump support structure
#47Conical-shaped or tier-shaped pillar connections
#48Method of manufacturing a semiconductor component
#49Semiconductor component that includes a protective structure
#50Method for building vertical pillar interconnect
#51Semiconductor devices with compliant interconnects
#52Printed circuit board and method for manufacturing the same
#53Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate
#54Semiconductor device with means for preventing solder bridges, and method for manufacturing semiconductor device
#55Circuit board, fabricating method thereof and package structure
#56Electronic assembly apparatus and associated methods
#57ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
#58Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
#59METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS
#60Coaxial solder bump support structure
#61Pillar design for conductive bump
#62Multi-component integrated circuit contacts
#63Bump structure and manufacturing method thereof
#64Pillar bumps and process for making same
#65Process for making conductive post with footing profile
#66Recessed pillar structure
#67Bump structure and fabrication method thereof
#68Method for fabricating circuit component
#69SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME
#70Method for fabricating electrical bonding pads on a wafer
#71Solder in cavity interconnection technology
#72Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#73Method for manufacturing a semiconductor component
#74Terminal face contact structure and method of making same
#75METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#76Interconnect structure and a method of fabricating the same
#77Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom
#78Multi-component integrated circuit contacts
#79Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#80Undercut-free BLM process for Pb-free and Pb-reduced C4
#81Method for micro component self-assembly
#82Method of forming metallic bump and seal for semiconductor device
#83SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION
#84Semiconductor device and method of manufacturing the same
#85Cylindrical bonding structure and method of manufacture
#86Undercut-free BLM process for Pb-free and Pb-reduced C4
#87Component with buried ductile conductive bumps and method of electrical connection between said component and a component equipped with hard conductive points
#88Solder pillar bumping and a method of making the same
#89Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#90Method for forming metal bumps
#91Methods of forming metal layers using multi-layer lift-off patterns
#92Flip-attached and underfilled stacked semiconductor devices
#93Method for fabricating circuit component
#94Method for mounting bumps on an under metallurgy layer
#95Semiconductor device having align mark layer and method of fabricating the same
#96Technique for forming a copper-based contact layer without a terminal metal
#97Method of forming solder bump with reduced surface defects
#98Multi-component integrated circuit contacts
#99Semiconductor device production method and semiconductor device
#100Repairable three-dimensional semiconductor subsystem
#101Method for fabricating connection terminal of circuit board
#102Bumping process and structure thereof
#103Multi-component integrated circuit contacts
#104Method for forming bump on electrode pad with use of double-layered film
#105Formation method for conductive bump
#106Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#107Method of forming solder bump with reduced surface defects
#108Solder bump structure and method for forming the same
#109Method of enhancing the adhesion between photoresist layer and substrate and bumping process
#110Bonding structure with pillar and cap
#111Bumping process
#112Process of forming bonding columns
#113Robust pillar structure for semicondcutor device contacts