209662 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material using a laser or a focused ion beam [FIB]
Sub-classes:LAMINATION STRUCTURE MANUFACTURED BY LASER PATTERNING
#2ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTURING THE SAME
#3HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING A HOUSING WITH A SEMICONDUCTOR BODY
#4Electroless-catalyst doped-mold materials for integrated-circuit die packaging architectures
#5Housing comprising a semiconductor body and a method for producing a housing with a semiconductor body
#6Contact bumps methods of making contact bumps
#7Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#8Semiconductor substrate and method for making the same
#9Semiconductor structures and method for fabricating the same