H01L2224/1183 - CPC Classification Index

ClassID:

209675 ⎘

H01L2224/1183 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the bump connector Reworking, e.g. shaping

Sub-classes:

H01L2224/11831 » involving a chemical process, e.g. etching the bump connector 130
H01L2224/1184 » involving a mechanical process, e.g. planarising the bump connector 187
H01L2224/11845 » Chemical mechanical polishing [CMP] 42

Recent Application in this class:

20250259954

2025-08-14

SOLDER BALL, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING THE SAME

20240321801

2024-09-26

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

20240222302

2024-07-04

REPAIR OF SOLDER BUMPS

20230197632

2023-06-22

ELECTRONIC COMPONENT, MODULE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

20220122938

2022-04-21

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMENTS AND METHODS FOR MANUFACTURING THE SAME

20200118947

2020-04-16

Solder ball protection in packages

20190109098

2019-04-11

Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same

20180358324

2018-12-13

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

20180337144

2018-11-22

Solder ball protection in packages

#10

20180301424

2018-10-18

Package structure

#11

20180108632

2018-04-19

Solder bump stretching method

#12

20180026008

2018-01-25

3D semiconductor package interposer with die cavity

#13

20160315059

2016-10-27

METHOD OF PRODUCING BUMPS IN ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT

#14

20160254249

2016-09-01

3D semiconductor package interposer with die cavity

#15

20160218076

2016-07-28

Semiconductor device having a cylindrical shaped conductive portion

#16

20160126201

2016-05-05

Dual layer stack for contact formation

#17

20160086910

2016-03-24

Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same

#18

20160035688

2016-02-04

Semiconductor component, semiconductor-mounted product including the component, and method of producing the product

#19

20150311170

2015-10-29

Contact and solder ball interconnect

#20

20150255406

2015-09-10

Solder ball protection in packages

#21

20150243616

2015-08-27

Packages with solder ball revealed through laser

#22

20150187722

2015-07-02

Semiconductor package and fabrication method thereof

#23

20150162290

2015-06-11

Method for handling very thin device wafers

#24

20150118796

2015-04-30

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

#25

20150102486

2015-04-16

Method for mounting a chip and chip package

#26

20150079763

2015-03-19

Solder bump stretching method and device for performing the same

#27

20140357075

2014-12-04

SEMICONDUCTOR DEVICE

#28

20140217610

2014-08-07

3D semiconductor package interposer with die cavity

#29

20140210076

2014-07-31

Flip-chip hybridization of microelectronic components by local heating of connecting elements

#30

20140167252

2014-06-19

Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages

#31

20140151698

2014-06-05

Test structures for post-passivation interconnect

#32

20140131861

2014-05-15

Plasma treatment for semiconductor devices

#33

20140021596

2014-01-23

Wafer-level device packaging

#34

20110309490

2011-12-22

Plasma treatment for semiconductor devices

#35

20100237494

2010-09-23

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

#36

20100072263

2010-03-25

Method and apparatus for forming planar alloy deposits on a substrate

#37

20100028612

2010-02-04

Method and apparatus for forming planar alloy deposits on a substrate

#38

20090294961

2009-12-03

SEMICONDUCTOR DEVICE

#39

20080303143

2008-12-11

Microelectronic die including locking bump and method of making same

#40

20080251914

2008-10-16

Semiconductor device

#41

20080197493

2008-08-21

Integrated circuit including conductive bumps

#42

20080050901

2008-02-28

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices