209679 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the bump connector Thermal treatments, e.g. annealing, controlled cooling
Sub-classes:SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
#2ELECTRONIC DEVICE
#3SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODUCING MEMBER WITH SOLDER BUMPS
#4ELECTRONIC DEVICE
#5FINE-PITCH JOINING PAD STRUCTURE
#6POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION APPARATUS
#7Method of forming brass-coated metals in flip-chip redistribution layers
#8Method of manufacturing semiconductor device
#9Low temperature hybrid bonding structures and manufacturing method thereof
#10Brass-coated metals in flip-chip redistribution layers
#11SEMICONDUCTOR DEVICE WITH ELECTROPLATED COPPER STRUCTURES
#12EXPANDED HEAD PILLAR FOR BUMP BONDS
#13SEMICONDUCTOR DEVICE HAVING BUMP STRUCTURES AND SEMICONDUCTOR PACKAGE HAVING THE SAME
#14Metal bonding pads for packaging applications
#15Expanded head pillar for bump bonds
#16Metal bonding pads for packaging applications
#17HYBRID LOW METAL LOADING FLUX
#18Semiconductor device and method for manufacturing the same
#19Solder bump stretching method
#203D semiconductor package interposer with die cavity
#21Conductive connections, structures with such connections, and methods of manufacture
#22Copper structures with intermetallic coating for integrated circuit chips
#23Method for manufacturing alloy bump
#24Semiconductor device and method for manufacturing the same
#25Bonding structure and method for producing bonding structure
#26Systems and methods for interconnect simulation and characterization
#27Sintering materials and attachment methods using same
#28PACKAGE-ON-PACKAGE DEVICE AND CAVITY FORMATION BY SOLDER REMOVAL FOR PACKAGE INTERCONNECTION
#29Copper structures with intermetallic coating for integrated circuit chips
#303D semiconductor package interposer with die cavity
#31Semiconductor device having a cylindrical shaped conductive portion
#32Solutions and processes for removing substances from substrates
#33Electrical apparatus
#34Semiconductor device and manufacturing method thereof
#35Package-on-package structure and methods for forming the same
#36Conductive connections, structures with such connections, and methods of manufacture
#37SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS, AND ELECTRONIC APPARATUS
#38Semiconductor device structure and manufacturing method
#39Flip-chip hybridisation of two microelectronic components using a UV anneal
#40Methods of forming semiconductor die assemblies
#41Solder bump stretching method and device for performing the same
#42LASER ABLATION METHOD AND RECIPE FOR SACRIFICIAL MATERIAL PATTERNING AND REMOVAL
#43Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#44Solder bump forming method and apparatus
#45Semiconductor device and method for manufacturing same
#46Metal bump structure for use in driver IC and method for forming the same
#47Metal bump structure for use in driver IC and method for forming the same
#483D semiconductor package interposer with die cavity
#49Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#50Hybrid low metal loading flux
#51Semiconductor assemblies and structures
#52Bump structure and electronic packaging solder joint structure and fabricating method thereof
#53Semiconductor apparatus
#54Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus
#55Doping Minor Elements into Metal Bumps
#56Semiconductor die having fine pitch electrical interconnects
#57Semiconductor apparatus including a metal alloy between a first contact and a second contact
#58Doping minor elements into metal bumps
#59Semiconductor package and method of fabricating the same
#60Method of fabricating semiconductor device allowing smooth bump surface
#61Bump structure and fabrication method thereof
#62Method and apparatus of manufacturing functionally gradient material
#63Alignment structures for integrated-circuit packaging
#64Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
#65Semiconductor device and method for manufacturing semiconductor device
#66Electrical connectivity for circuit applications
#67Semiconductor device and manufacturing method thereof
#68Method and apparatus for forming planar alloy deposits on a substrate
#69Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#70Method and apparatus for forming planar alloy deposits on a substrate
#71Integrated circuit including conductive bumps
#72Wafer-level package and IC module assembly method for the wafer-level package
#73Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages