209683 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Methods of manufacturing bump connectors involving a specific sequence of method steps with repetition of the same manufacturing step Multiple masking steps
Semiconductor device
#2Semiconductor device
#3Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
#4Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
#5Interconnect structures and methods for fabricating interconnect structures
#6Semiconductor device
#7Methods for forming pillar bumps on semiconductor wafers
#8Reducing solder pad topology differences by planarization
#9Semiconductor device
#10Metal contact for semiconductor device
#11Packages with solder ball revealed through laser
#12Semiconductor device
#13Semiconductor device
#14Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#15Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#16Semiconductor device
#17Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
#18Multi-component integrated circuit contacts
#19Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
#20Injection molded solder process for forming solder bumps on substrates
#21Injection molded solder process for forming solder bumps on substrates
#22Solder collapse free bumping process of semiconductor device
#23SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#24Bump structure and manufacturing method thereof
#25Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
#26METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM
#27SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#28Semiconductor die terminal
#29Process for making conductive post with footing profile
#30Magnetic microelectronic device attachment
#31Bump, method for forming the bump, and method for mounting substrate having the bump thereon
#32Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#33Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
#34Chip having a metal pillar structure
#35Enhanced copper posts for wafer level chip scale packaging
#36Terminal face contact structure and method of making same
#37Manufacturing method of semiconductor device including Au bump on seed film
#38Interconnect structure and a method of fabricating the same
#39Multi-component integrated circuit contacts
#40Semiconductor device
#41LITHOGRAPHIC CONTACT ELEMENTS
#42Semiconductor package and methods of manufacturing the same
#43Chip-based thermo-stack
#44Process for Preparing a Solder Stand-Off
#45Mock bump system for flip chip integrated circuits
#46Semiconductor device having a refractory metal containing film and method for manufacturing the same
#47Undercut-free BLM process for Pb-free and Pb-reduced C4
#48Method for micro component self-assembly
#49Wafer of circuit board and joining structure of wafer or circuit board
#50Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
#51SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION
#52PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#53Semiconductor device and method of manufacturing the same
#54Enhanced copper posts for wafer level chip scale packaging
#55Undercut-free BLM process for Pb-free and Pb-reduced C4
#56Three-dimensional wafer stacking with vertical interconnects
#57Method of making lithographic contact elements
#58Wiring board and method of manufacturing the same
#59Solder ball mounting method and solder ball mounting substrate manufacturing method
#60Electrical interconnection structure formation
#61Solder elements with columnar structures and methods of making the same
#62Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#63Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#64Method for forming C4 connections on integrated circuit chips and the resulting devices
#65Method for forming metal bumps
#66Chip package and method for fabricating the same
#67Methods of forming metal layers using multi-layer lift-off patterns
#68Method of fabrication on high coplanarity of copper pillar for flip chip packaging application
#69Electronic device and method of manufacturing the same
#70Manufacturing method for semiconductor device and semiconductor device
#71Interconnect structure of an integrated circuit and manufacturing method thereof
#72Electrical interconnection structure formation
#73Metal pad or metal bump over pad exposed by passivation layer
#74Bonding pad on IC substrate and method for making the same
#75Multi-component integrated circuit contacts
#76Chip-based thermo-stack
#77Semiconductor device including an under electrode and a bump electrode
#78Bumping process
#79Method for fabricating connection terminal of circuit board
#80Bumping process and structure thereof
#81UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE
#82Bumping process and structure thereof
#83Bump structure of semiconductor package and method for fabricating the same
#84Method of manufacturing a wiring board
#85Multi-component integrated circuit contacts
#86Formation method for conductive bump
#87Method for making an interconnect pad
#88Semiconductor device having a refractory metal containing film and method for manufacturing the same
#89Manufacturing method for semiconductor device and semiconductor device
#90Lithographic contact elements
#91Semiconductor device with intermediate connector
#92Semiconductor device and method of manufacturing the same
#93Process for forming lead-free bump on electronic component
#94Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode
#95Process of forming bonding columns