209686 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Manufacturing methods; Methods of manufacturing bump connectors involving a specific sequence of method steps the under bump metallisation [UBM] being used as a mask for patterning other parts
Semiconductor device structure and manufacturing method
#2Package structure and manufacturing method
#3Structure to prevent solder extrusion
#4Techniques for fabricating fine-pitch micro-bumps
#5Method of manufacturing a semiconductor component
#6Semiconductor component that includes a protective structure
#7Wafer-level packaged device having self-assembled resilient leads
#8Method for manufacturing a semiconductor component
#9Wafer-level packaged device having self-assembled resilient leads