209707 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors Shape
Sub-classes:Coplanar bump contacts of differing sizes
#2Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#3Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#4Conductor design for integrated magnetic devices
#5Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#6Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#7Electrode for a semiconductor device of a ball grid array (BGA) type
#8Open-passivation ball grid array pads
#9Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#10Ball pad with a plurality of lobes
#11Systems and methods for high-speed, low-profile memory packages and pinout designs
#12Semiconductor devices with ball strength improvement
#13Conductive connections, structures with such connections, and methods of manufacture
#14Method of manufacturing connector structures of integrated circuits
#15Semiconductor devices and package substrates having pillars and semiconductor packages and package stack structures having the same
#16CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
#17PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
#18Conductive connections, structures with such connections, and methods of manufacture
#19Connector structures of integrated circuits
#20Collapsible probe tower device and method of forming thereof
#21PACKAGE STRUCTURE
#22Package structure and method of forming the same
#23Self-aligning conductive bump structure and method of fabrication
#24TSV structures and methods for forming the same
#25Multi-die stack structure
#26Copper pillar bump and flip chip package using same
#27Bump electrode, board which has bump electrodes, and method for manufacturing the board
#28Semiconductor devices including unitary supports
#29Semiconductor devices with ball strength improvement
#30Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#31Hybrid lead frame and ball grid array package
#32Semiconductor device with bumps and display device module incorporating the same
#33TSV structures and methods for forming the same
#34Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims
#35SEMICONDUCTOR PACKAGE INCLUDING SOLDER BALL
#36SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#37Coreless integrated circuit packaging system and method of manufacture thereof
#38TSV structures and methods for forming the same
#39Methods of and semiconductor devices with ball strength improvement
#40Connector structures of integrated circuits
#41Self-aligning conductive bump structure and method of making the same
#42Bump-on-trace (BOT) structures
#43Reduced-stress bump-on-trace (BOT) structures
#44Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#45Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#46Method of making a semiconductor package and method of making a semiconductor device
#47Semiconductor package and semiconductor device
#48Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof