209712 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bump connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors; Disposition being disposed on at least two different sides of the body, e.g. dual array
CHIPLETS WITH CONNECTION POSTS
#2Chiplets with connection posts
#3Chiplets with connection posts
#4Chiplets with connection posts
#5Chiplets with connection posts
#6METHOD FOR PREPARING A SEMICONDUCTOR PACKAGE
#7Chiplets with connection posts
#8Printable component structure with electrical contact
#9Semiconductor package with lateral bump structure